| Steps toward automated deprocessing of integrated circuits EL Principe, N Asadizanjani, D Forte, M Tehranipoor, R Chivas, ... ISTFA 2017: Proceedings from the 43rd International Symposium for Testing …, 2017 | 25 | 2017 |
| Visible light LVP on bulk silicon devices J Beutler, VC Hodges, JJ Clement, J Stevens, EI Cole, S Silverman, ... ISTFA 2015, 6-13, 2015 | 22 | 2015 |
| Synthesis and photoluminescence of ultra-pure germanium nanoparticles R Chivas, S Yerci, R Li, L Dal Negro, TF Morse Optical Materials 33 (11), 1829-1832, 2011 | 16 | 2011 |
| Contactless fault isolation for FinFET technologies with visible light and GaP SIL H Lohrke, P Scholz, A Beyreuther, C Boit, E Uhlmann, S Kühne, ... ISTFA 2016, 19-26, 2016 | 15 | 2016 |
| High definition scintillation detector for medicine, homeland security and non-destructive evaluation TF Morse, R Gupta, CB Roberts, RD Chivas US Patent 8,477,906, 2013 | 15 | 2013 |
| Adaptive Grinding and Polishing of Silicon Integrated Circuits to Ultra-thin Remaining Thickness R Chivas, S Silverman, M DiBattista ISTFA 2015, 460-465, 2015 | 13 | 2015 |
| Plasma FIB deprocessing of integrated circuits from the backside EL Principe, N Asadizanjani, D Forte, M Tehranipoor, R Chivas, ... FICS Research Annual Conference on Cybersecurity, 2017 | 10 | 2017 |
| Preparation of Wafer Level Packaged Integrated Circuits Using Pulsed Laser Assisted Chemical Etching R Chivas, N Dandekar, S Silverman, R Cruz, M DiBattista ISTFA 2012, 491-497, 2012 | 8 | 2012 |
| Pulsed Laser Assisted Chemical Etch for analytic surface preparation R Chivas, S Silverman, N Dandekar 2012 IEEE International Reliability Physics Symposium (IRPS), 2D. 6.1-2D. 6.8, 2012 | 6 | 2012 |
| Fast, full chip image stitching of nanoscale integrated circuits D Zhang, G van der Wal, P Miller, D Stoker, E Matlin, N Marri, G Gan, ... SRI International Princeton United States, 2019 | 4 | 2019 |
| Adaptive grinding and polishing of packaged integrated circuits R Chivas, S Silverman 2014 IEEE International Reliability Physics Symposium, FA. 4.1-FA. 4.6, 2014 | 4 | 2014 |
| Laser-Assisted Chemical Polishing of Silicon (112) Wafers N Dandekar, R Chivas, S Silverman, X Kou, M Goorsky Journal of electronic materials 41 (10), 2790-2794, 2012 | 4 | 2012 |
| Electrical Invasiveness of Grinding and Polishing Silicon Integrated Circuits Down to 1 μm Remaining Silicon Thickness R Chivas, S Silverman, M DiBattista, U Kindereit ISTFA 2016, 166-171, 2016 | 2 | 2016 |
| Submicron thinning of finFET devices with high power density observed in 10/7nm process nodes using high aspect ratio trenches N Bakken, V Vlasyuk, M Beal, I Artishuk, R Chivas, M DiBattista, ... ISTFA 2019: Conference Proceedings from the 45th International Symposium for …, 2019 | 1 | 2019 |
| Laser Chemical Etching Trench Refinements for Backside Debug Journey to the Circuit Layer MM Mulholland, S Tan, MU Raza, M Levesque, J Furlong, CGL Ferri, ... ISTFA 2020, 357-361, 2020 | | 2020 |
| Steps Toward Computational Guided Deprocessing of Integrated Circuits EL Principe, R Chivas, M DiBattista, S Silverman, N Asadizanjani, D Forte, ... Synchrotron Research, Incorporated Melbourne Beach United States, 2018 | | 2018 |
| Photo: What a difference a micron makes. J Beutler, KD Greth, S Silverman, R Chivas Sandia National Lab.(SNL-NM), Albuquerque, NM (United States), 2015 | | 2015 |
| Visible Light LVP on Bulk Silicon Substrates. J Beutler, JJ Clement, J Stevens, VC Hodges, S Silverman, R Chivas Sandia National Lab.(SNL-NM), Albuquerque, NM (United States), 2015 | | 2015 |
| Aerosol deposition process for synthesizing optically active nano-scale materials RD Chivas Dissertation Abstracts International 68 (04), 2007 | | 2007 |
