| Carrier transport in thin films of organic electroluminescent materials Z Deng, ST Lee, DP Webb, YC Chan, WA Gambling Synthetic metals 107 (2), 107-109, 1999 | 130 | 1999 |
| Determination of gap-state distributions in amorphous semiconductors from transient photocurrents using a fourier transform technique C Main, R Brüggemann, DP Webb, S Reynolds Solid state communications 83 (6), 401-405, 1992 | 89 | 1992 |
| Application of Weibull distribution analysis to the dielectric failure of multilayer ceramic capacitors Y Wang, YC Chan, ZL Gui, DP Webb, LT Li Materials Science and Engineering: B 47 (3), 197-203, 1997 | 47 | 1997 |
| A concept of water usage efficiency to support water reduction in manufacturing industry M Sachidananda, DP Webb, S Rahimifard Sustainability 8 (12), 1222, 2016 | 46 | 2016 |
| An experimental evaluation of transient and modulated photocurrent density-of-states spectroscopies S Reynolds, C Main, DP Webb, MJ Rose Philosophical Magazine B 80 (4), 547-559, 2000 | 40 | 2000 |
| Photoinduced Dehydrogenation of Defects in Undoped -Si:H Using Positron Annihilation Spectroscopy X Zou, YC Chan, DP Webb, YW Lam, YF Hu, CD Beling, S Fung, ... Physical Review Letters 84 (4), 769, 2000 | 38 | 2000 |
| A methodology to analyse and simulate mechanical characteristics of poly (2‐hydroxyethyl methacrylate) hydrogel W Zhao, C Lenardi, P Webb, C Liu, T Santaniello, F Gassa Polymer international 62 (7), 1059-1067, 2013 | 31 | 2013 |
| Modulated and transient photoconductivity in a-As 2 Se 3 C Main, DP Webb, R Bruggemann, S Reynolds Journal of Non Crystalline Solids 137, 951-954, 1991 | 31 | 1991 |
| Time and frequency domain studies of photoconductivity in amorphous semiconductors C Main, R Brüggemann, DP Webb, S Reynolds Journal of non-crystalline solids 164, 481-484, 1993 | 29 | 1993 |
| Forging new frontiers in sustainable food manufacturing S Rahimifard, E Woolley, DP Webb, G Garcia-Garcia, J Stone, A Jellil, ... Sustainable Design and Manufacturing 2017: Selected papers on Sustainable …, 2017 | 25 | 2017 |
| Low frequency induction heating for the sealing of plastic microfluidic systems BJ Knauf, DP Webb, C Liu, PP Conway Microfluidics and Nanofluidics 9, 243-252, 2010 | 24 | 2010 |
| Electronic, Optoelectronic, and Magnetic Thin Films: Proceedings of the Eighth International School on Condensed Matter Physics, Varna, Bulgaria, 18th-23rd September 1994 JM Marshall, N Kirov, A Vavrek Research Studies Press Limited, 1995 | 19 | 1995 |
| Assessment of the capability of an optical sensor for in-line real-time wastewater quality analysis in food manufacturing G Skouteris, DP Webb, KLF Shin, S Rahimifard Water resources and industry 20, 75-81, 2018 | 18 | 2018 |
| Copper conductive adhesives for printed circuit interconnects S Qi, R Litchfield, DA Hutt, B Vaidhyanathan, C Liu, P Webb, S Ebbens 2012 IEEE 62nd Electronic Components and Technology Conference, 1651-1655, 2012 | 17 | 2012 |
| Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters B He, J Petzing, P Webb, R Leach Optics and Lasers in Engineering 75, 39-47, 2015 | 16 | 2015 |
| Packaging of microfluidic devices for fluid interconnection using thermoplastics DP Webb, DA Hutt, N Hopkinson, PP Conway, PJ Palmer Journal of Microelectromechanical Systems 18 (2), 354-362, 2009 | 13 | 2009 |
| Bandwidth considerations in modulated and transient photoconductivity measurements to determine localized state distributions S Reynolds, C Main, DP Webb, S Grabtchak Journal of Applied Physics 88 (1), 278-282, 2000 | 13 | 2000 |
| Optical characterization of hydrogenated amorphous silicon thin films deposited at high rate SH Lin, YC Chan, DP Webb, YW Lam Journal of Electronic Materials 28, 1452-1456, 1999 | 13 | 1999 |
| Current leakage failure of conformally coated electronic assemblies G Dou, DP Webb, DC Whalley, DA Hutt, AR Wilson 2008 2nd Electronics System-Integration Technology Conference, 1213-1218, 2008 | 12 | 2008 |
| Laser micromachining of polycrystalline alumina and aluminium nitride to enable compact optoelectronic interconnects O Williams, M Williams, C Liu, P Webb, P Firth 2009 11th Electronics Packaging Technology Conference, 920-925, 2009 | 11 | 2009 |
