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Taizhi Liu
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引用次数
引用次数
年份
System-level modeling of microprocessor reliability degradation due to BTI and HCI
CC Chen, S Cha, T Liu, L Milor
2014 IEEE International Reliability Physics Symposium, CA. 8.1-CA. 8.9, 2014
342014
SRAM stability analysis for different cache configurations due to bias temperature instability and hot carrier injection
T Liu, CC Chen, J Wu, L Milor
2016 IEEE 34th International Conference on Computer Design (ICCD), 225-232, 2016
302016
System-level variation-aware aging simulator using a unified novel gate-delay model for bias temperature instability, hot carrier injection, and gate oxide breakdown
T Liu, CC Chen, S Cha, L Milor
Microelectronics Reliability 55 (9-10), 1334-1340, 2015
262015
Comprehensive reliability-aware statistical timing analysis using a unified gate-delay model for microprocessors
T Liu, CC Chen, L Milor
IEEE Transactions on Emerging Topics in Computing 6 (2), 219-232, 2016
232016
System-level modeling of microprocessor reliability degradation due to bias temperature instability and hot carrier injection
CC Chen, T Liu, L Milor
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24 (8 …, 2016
222016
A comprehensive time-dependent dielectric breakdown lifetime simulator for both traditional CMOS and FinFET technology
K Yang, T Liu, R Zhang, L Milor
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (11 …, 2018
212018
Comprehensive reliability and aging analysis on SRAMs within microprocessor systems
T Liu, CC Chen, W Kim, L Milor
Microelectronics Reliability 55 (9-10), 1290-1296, 2015
192015
Accurate standard cell characterization and statistical timing analysis using multivariate adaptive regression splines
T Liu, CC Chen, L Milor
Sixteenth International Symposium on Quality Electronic Design, 272-279, 2015
182015
Extraction of threshold voltage degradation modeling due to negative bias temperature instability in circuits with I/O measurements
S Cha, CC Chen, T Liu, LS Milor
2014 IEEE 32nd VLSI Test Symposium (VTS), 1-6, 2014
182014
Processor-level reliability simulator for time-dependent gate dielectric breakdown
CC Chen, T Liu, S Cha, L Milor
Microprocessors and Microsystems 39 (8), 950-960, 2015
112015
Memory and logic lifetime simulation systems and methods
L Milor, T Liu, CC Chen
US Patent 10,514,973, 2019
102019
Technologies for estimating remaining life of integrated circuits using on-chip memory
L Milor, W Kim, T Liu
US Patent 10,303,541, 2019
102019
Multivariate adaptive regression splines in standard cell characterization for nanometer technology in semiconductor
T Liu
Chapter 3, 47-62, 2018
102018
A comparison study of time-dependent dielectric breakdown for analog and digital circuit's optimal accelerated test regions
K Yang, T Liu, R Zhang, L Milor
2017 32nd Conference on Design of Circuits and Integrated Systems (DCIS), 1-6, 2017
102017
Modeling of the reliability degradation of a FinFET-based SRAM due to bias temperature instability, hot carrier injection, and gate oxide breakdown
R Zhang, T Liu, K Yang, L Milor
2017 IEEE International Integrated Reliability Workshop (IIRW), 1-4, 2017
102017
Front-end of line and middle-of-line time-dependent dielectric breakdown reliability simulator for logic circuits
K Yang, T Liu, R Zhang, DH Kim, L Milor
Microelectronics Reliability 76, 81-86, 2017
102017
SRAM stability analysis and performance–reliability tradeoff for different cache configurations
R Zhang, T Liu, K Yang, CC Chen, L Milor
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (3), 620-633, 2020
82020
Modeling of FinFET SRAM array reliability degradation due to electromigration
R Zhang, KX Yang, TZ Liu, L Milor
Microelectronics Reliability 100, 113485, 2019
82019
Circuit-level reliability simulator for front-end-of-line and middle-of-line time-dependent dielectric breakdown in FinFET technology
K Yang, T Liu, R Zhang, L Milor
2018 IEEE 36th VLSI Test Symposium (VTS), 1-6, 2018
82018
Analysis of time-dependent dielectric breakdown induced aging of SRAM cache with different configurations
R Zhang, T Liu, K Yang, L Milor
Microelectronics Reliability 76, 87-91, 2017
82017
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