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Hua Lu
Hua Lu
Verified email at gre.ac.uk
Title
Cited by
Cited by
Year
Design for reliability of power electronics modules
H Lu, C Bailey, C Yin
Microelectronics reliability 49 (9-11), 1250-1255, 2009
2432009
A multi-scale atomistic-continuum modelling of crack propagation in a two-dimensional macroscopic plate
H Rafii-Tabar, L Hua, M Cross
Journal of Physics: Condensed Matter 10 (11), 2375, 1998
1621998
Failure and reliability analysis of a SiC power module based on stress comparison to a Si device
B Hu, JO Gonzalez, L Ran, H Ren, Z Zeng, W Lai, B Gao, O Alatise, H Lu, ...
IEEE Transactions on device and materials reliability 17 (4), 727-737, 2017
1492017
Effect of adding 1 wt% Bi into the Sn–2.8 Ag–0.5 Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging
MJ Rizvi, YC Chan, C Bailey, H Lu, MN Islam
Journal of Alloys and Compounds 407 (1-2), 208-214, 2006
1122006
Predicting optimal process conditions for flip-chip assembly using copper column bumped dies
H Lu, C Bailey
4th Electronics Packaging Technology Conference, 2002., 338-343, 2002
772002
Effect of adding 0.3 wt% Ni into the Sn–0.7 wt% Cu solder: Part II. Growth of intermetallic layer with Cu during wetting and aging
MJ Rizvi, C Bailey, YC Chan, MN Islam, H Lu
Journal of alloys and compounds 438 (1-2), 122-128, 2007
762007
Wire bond reliability for power electronic modules-effect of bonding temperature
WS Loh, M Corfield, H Lu, S Hogg, T Tilford, CM Johnson
2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007
732007
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications
CY Yin, MO Alam, YC Chan, C Bailey, H Lu
Microelectronics Reliability 43 (4), 625-633, 2003
682003
Lifetime prediction for power electronics module substrate mount-down solder interconnect
H Lu, T Tilford, C Bailey, DR Newcombe
2007 International Symposium on High Density packaging and Microsystem …, 2007
672007
The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing
MJ Rizvi, YC Chan, C Bailey, H Lu, A Sharif
Soldering & Surface Mount Technology 17 (2), 40-48, 2005
552005
A review of data-driven prognostics in power electronics
A Kabir, C Bailey, H Lu, S Stoyanov
2012 35th International Spring Seminar on Electronics Technology, 189-192, 2012
492012
Effect of adding 0.3 wt% Ni into the Sn–0.7 wt% Cu solder: Part I: Wetting behavior on Cu and Ni substrates
MJ Rizvi, C Bailey, YC Chan, H Lu
Journal of Alloys and Compounds 438 (1-2), 116-121, 2007
492007
Fracture mechanics analysis of solder joint intermetallic compounds in shear test
MO Alam, H Lu, C Bailey, YC Chan
Computational Materials Science 45 (2), 576-583, 2009
482009
Wetting and reaction of Sn-2.8 Ag-0.5 Cu-1.0 Bi solder with Cu and Ni substrates
MJ Rizvi, YC Chan, C Bailey, H Lu, MN Islam, BY Wu
Journal of electronic materials 34, 1115-1122, 2005
482005
A physics-of-failure based prognostic method for power modules
CY Yin, H Lu, M Musallam, C Bailey, CM Johnson
2008 10th Electronics Packaging Technology Conference, 1190-1195, 2008
472008
Sintered silver finite element modelling and reliability based design optimisation in power electronic module
P Rajaguru, H Lu, C Bailey
Microelectronics Reliability 55 (6), 919-930, 2015
422015
A fusion approach to IGBT power module prognostics
N Patil, D Das, C Yin, H Lu, C Bailey, M Pecht
EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009
382009
In-service life consumption estimation in power modules
M Musallam, CM Johnson, C Yin, H Lu, C Bailey
2008 13th International Power Electronics and Motion Control Conference, 76-83, 2008
372008
Modelling the fatigue life of solder joints for surface mount resistors
H Lu, C Bailey, M Dusek, C Hunt, J Nottay
International Symposium on Electronic Materials and Packaging (EMAP2000)(Cat …, 2000
362000
Real-time life expectancy estimation in power modules
M Musallam, CM Johnson, C Yin, H Lu, C Bailey
2008 2nd Electronics System-Integration Technology Conference, 231-236, 2008
342008
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