Dipankar Roy
Title
Cited by
Cited by
Year
Surface plasmon resonance studies of gold and silver nanoparticles linked to gold and silver substrates by 2-aminoethanethiol and 1, 6-hexanedithiol
E Hutter, JH Fendler, D Roy
The Journal of Physical Chemistry B 105 (45), 11159-11168, 2001
2332001
Reflection and absorption techniques for optical characterization of chemically assembled nanomaterials
D Roy, J Fendler
Advanced materials 16 (6), 479-508, 2004
1602004
Electro-oxidation of methanol on gold in alkaline media: Adsorption characteristics of reaction intermediates studied using time resolved electro-chemical impedance and surface …
KA Assiongbon, D Roy
Surface Science 594 (1-3), 99-119, 2005
1502005
Role of substrate metal in gold nanoparticle enhanced surface plasmon resonance imaging
E Hutter, S Cha, JF Liu, J Park, J Yi, JH Fendler, D Roy
The Journal of Physical Chemistry B 105 (1), 8-12, 2001
1232001
Nature of the active site in surface-enhanced Raman scattering
TE Furtak, D Roy
Physical Review Letters 50 (17), 1301, 1983
1221983
The short-range mechanism of surface enhanced Raman scattering
TE Furtak, D Roy
Surface Science 158 (1-3), 126-146, 1985
1191985
Evidence for Ag cluster vibrations in enhanced Raman scattering from the Ag/electrolyte interface
D Roy, TE Furtak
Chemical physics letters 124 (4), 299-303, 1986
1141986
Analysis of experimental constraints and variables for time resolved detection of Fourier transform electrochemical impedance spectra
JE Garland, CM Pettit, D Roy
Electrochimica Acta 49 (16), 2623-2635, 2004
1132004
Achievement of high planarization efficiency in CMP of copper at a reduced down pressure
S Pandija, D Roy, SV Babu
Microelectronic Engineering 86 (3), 367-373, 2009
922009
Relative roles of H 2 O 2 and glycine in CMP of copper studied with impedance spectroscopy
J Lu, JE Garland, CM Pettit, SV Babu, D Roy
Journal of The Electrochemical Society 151 (10), G717, 2004
892004
PEGylated imidazolium ionic liquid electrolytes: thermophysical and electrochemical properties
LVNR Ganapatibhotla, J Zheng, D Roy, S Krishnan
Chemistry of Materials 22 (23), 6347-6360, 2010
872010
Citric acid as a complexing agent in CMP of copper: Investigation of surface reactions using impedance spectroscopy
VRK Gorantla, KA Assiongbon, SV Babu, D Roy
Journal of the Electrochemical Society 152 (5), G404, 2005
852005
Probing the electrochemical double layer of an ionic liquid using voltammetry and impedance spectroscopy: A comparative study of carbon nanotube and glassy carbon electrodes in …
JP Zheng, PC Goonetilleke, CM Pettit, D Roy
Talanta 81 (3), 1045-1055, 2010
812010
Synergistic roles of dodecyl sulfate and benzotriazole in enhancing the efficiency of CMP of copper
Y Hong, VK Devarapalli, D Roy, SV Babu
Journal of The Electrochemical Society 154 (6), H444, 2007
802007
Chemical mechanical planarization of copper using abrasive-free solutions of oxalic acid and hydrogen peroxide
S Pandija, D Roy, SV Babu
Materials chemistry and physics 102 (2-3), 144-151, 2007
612007
Controlling the galvanic corrosion of copper during chemical mechanical planarization of ruthenium barrier films
BC Peethala, D Roy, SV Babu
Electrochemical and solid state letters 14 (7), H306, 2011
602011
Electrochemical windows and impedance characteristics of [Bmim+][BF4-] and [Bdmim+][BF4-] ionic liquids at the surfaces of Au, Pt, Ta and glassy carbon electrodes
SS Moganty, RE Baltus, D Roy
Chemical Physics Letters 483 (1-3), 90-94, 2009
602009
Electrochemical characterization of surface complexes formed on Cu and Ta in succinic acid based solutions used for chemical mechanical planarization
CM Sulyma, D Roy
Applied surface science 256 (8), 2583-2595, 2010
592010
Relative roles of acetic acid, dodecyl sulfate and benzotriazole in chemical mechanical and electrochemical mechanical planarization of copper
PC Goonetilleke, D Roy
Applied surface science 254 (9), 2696-2707, 2008
592008
Electrochemical–mechanical planarization of copper: Effects of chemical additives on voltage controlled removal of surface layers in electrolytes
PC Goonetilleke, D Roy
Materials Chemistry and Physics 94 (2-3), 388-400, 2005
592005
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Articles 1–20