| Method for manufacturing a layer arrangement and layer arrangement Z Gabric, W Pamler, G Schindler, G Steinlesberger, A Stich, M Traving, ... US Patent 7,807,563, 2010 | 36 | 2010 |
| Method of Forming Self-Aligned Air-Gaps Using Self-Aligned Capping Layer over Interconnect Lines M Engelhardt, A Stich, E Unger US Patent App. 11/276,801, 2007 | 28 | 2007 |
| Conductor track arrangement and associated production method Z Gabric, W Pamler, G Schindler, A Stich US Patent App. 11/506,570, 2007 | 27 | 2007 |
| MIM capacitor and associated production method M Engelhardt, A Stich, G Schindler, M Schrenk US Patent 8,093,637, 2012 | 15 | 2012 |
| Integration of air gaps based on selective ozone/TEOS deposition into a multi layer metallization scheme A Stich, Z Gabric, W Pamler, G Schindler, M Traving, M Engelhardt 2006 International Interconnect Technology Conference, 134-136, 2006 | 9 | 2006 |
| Potential of air gap technology by selective ozone/TEOS deposition: Effects of air gap geometry on the dielectric constant A Stich, Z Gabric, W Pamler Microelectronic engineering 82 (3-4), 362-367, 2005 | 8 | 2005 |
| Air Gaps: Can They be a Solution to the Low-k Challenge? G Schindler, A Stich, Z Gabric, W Pamler Advanced Metallization Conference 2005(AMC 2005), 255-261, 2006 | 6 | 2006 |
| Development and electrical characterization of air gap structures for advanced metallization schemes A Stich Technische Universität München, 2007 | 3 | 2007 |
| Spectral photoresponse of advanced interconnects: a possible solution to the ITRS most difficult characterization challenges C Guedj, V Arnal, V Girault, G Imbert, R Daamen, R Hoofman, F Gaillard, ... 2006 International Interconnect Technology Conference, 207-209, 2006 | 2 | 2006 |
| Evidence for metastable defects in airgap interconnects C Guedj, A Stich, W Pamler, Z Gabric, F Mondon Microelectronic engineering 83 (11-12), 2386-2390, 2006 | 1 | 2006 |
| MIM capacitor and associated production method M Engelhardt, A Stich, G Schindler, M Schrenk US Patent 8,709,906, 2014 | | 2014 |
| MIM-Kondensator sowie zugehöriges Herstellungsverfahren MIM capacitor and associated production method M Engelhardt, G Schindler, M Schrenk, A Stich DE Patent 502,006,006,768, 2010 | | 2010 |
| MIM-capacitor and corresponding method of manufacturing M Engelhardt, A Stich, G Schindler, M Schrenk EP Patent 1,770,726, 2010 | | 2010 |
| Leitbahnanordnung sowie zugehöriges Herstellungsverfahren Z Gabric, WD Pamler, GD Schindler, A Stich DE Patent 102,005,039,323, 2009 | | 2009 |
| Verfahren zur Herstellung eines MIM-Kondensators A method for producing a MIM capacitor MD Engelhardt, GD Schindler, M Schrenk, A Stich DE Patent 102,005,047,111, 2007 | | 2007 |
| Leitbahnanordnung sowie zugehöriges Herstellungsverfahren Z Gabric, A Stich | | 2007 |
| Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung G Schindler, W Pamler, Z Gabric, E Unger, M Traving, G Steinlesberger, ... DE Patent 102,004,050,391, 2006 | | 2006 |
| METHOD FOR THE CREATION OF A LAYER SYSTEM AND LAYER SYSTEM Z GABRIC, W PAMLER, G SCHINDLER, G STEINLESBERGER, A STICH, ... WO Patent 2,006,042,498, 2006 | | 2006 |
| Scaling of Metal Interconnects: Challenges to Functionality and Reliability M Engelhardt, G Schindler, M Traving, A Stich, Z Gabric, W Pamler, ... AIP Conference Proceedings 817 (1), 3-12, 2006 | | 2006 |
| Scaling of Metal Interconnects: Challenges to Functionality and Reliability M Engelhardt, G Schindler, M Traving, A Stich, Z Gabric, W Pamler, ... AIP Conference Proceedings 817 (1), 3-12, 2006 | | 2006 |
Romano HoofmanStrategic Development Director at imecBestätigte E-Mail-Adresse bei imec.be
Romano HoofmanStrategic Development Director at imecBestätigte E-Mail-Adresse bei imec.be