| Power Grid Electromigration Checking using Physics-Based Models S Chatterjee, V Sukharev, FN Najm IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2017 | 94 | 2017 |
| Redundancy Aware Electromigration Checking for Mesh Power Grids S Chatterjee University of Toronto, 2013 | 44 | 2013 |
| Fast physics-based electromigration checking for on-die power grids S Chatterjee, V Sukharev, FN Najm 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2016 | 27 | 2016 |
| Fast physics-based electromigration assessment by efficient solution of linear time-invariant (LTI) systems S Chatterjee, V Sukharev, FN Najm 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 659-666, 2017 | 21 | 2017 |
| Finite-difference methodology for full-chip electromigration analysis applied to 3D IC test structure: Simulation vs. experiment JH Choy, V Sukharev, S Chatterjee, FN Najm, A Kteyan, S Moreau 2017 International Conference on Simulation of Semiconductor Processes and …, 2017 | 8 | 2017 |
| Redundancy-aware power grid electromigration checking under workload uncertainties S Chatterjee, M Fawaz, FN Najm IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2015 | 7 | 2015 |
| Theoretical predictions of EM-induced degradation in test-structures and on-chip power grids with analytical and numerical analysis V Sukharev, A Kteyan, JH Choy, S Chatterjee, FN Najm 2017 IEEE International Reliability Physics Symposium (IRPS), 6B-5.1-6B-5.10, 2017 | 6 | 2017 |
| A vectorless framework for power grid electromigration checking M Fawaz, S Chatterjee, FN Najm 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 553-560, 2013 | 6 | 2013 |
| Fast and scalable physics-based electromigration checking for power grids in integrated circuits S Chatterjee University of Toronto (Canada), 2017 | 5 | 2017 |
| Composable system resources as an architecture for networked systems S Chatterjee Massachusetts Institute of Technology, 2001 | 2 | 2001 |
| Burns, S., see Ayupov, A., TCAD Feb. 2018 420-430 Bustany, I., see Huang, C., TCAD March 2018 669-681 S Chatterjee, V Sukharev, FN Najm IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018 | | 2018 |
| Том. 7-10-November-2016. 2016 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2016.-Сер. 2016 IEEE/ACM International Conference on Computer-Aided Design … S Chatterjee, FN Najm, V Sukharev, T Kim, Z Sun, C Cook, J Gaddipati, ... | | 2016 |
| Materials, Processing, and Packaging Impact on Electromigration Performance of Combining CuSiN and Ti-Barrier Metal in Cu Interconnects............................. Y. Hayashi … SR Jan, TP Chou, CY Yeh, CW Liu, RV Goldstein, VA Gorodtsov, ... | | |
Farid N. NajmProfessor of Electrical & Computer Engineering, University of TorontoVerified email at utoronto.ca
