A Pragmatic Part Scale Model for Residual Stress and Distortion Prediction in Powder Bed Fusion RJ Williams, CM Davies, PA Hooper Additive Manufacturing, 2018 | 34 | 2018 |
In situ thermography for laser powder bed fusion: Effects of layer temperature on porosity, microstructure and mechanical properties RJ Williams, A Piglione, T Rønneberg, C Jones, MS Pham, CM Davies, ... Additive Manufacturing 30, 100880, 2019 | 9 | 2019 |
Effects of heat treatment on residual stresses in the laser powder bed fusion of 316L stainless steel: Finite element predictions and neutron diffraction measurements RJ Williams, F Vecchiato, J Kelleher, MR Wenman, PA Hooper, ... Journal of Manufacturing Processes 57, 641-653, 2020 | 2 | 2020 |
Fracture Toughness Behaviour of 316L Stainless Steel Samples Manufactured Through Selective Laser Melting CM Davies, R Zhou, O Withnell, R Williams, T Ronneberg, PA Hooper Pressure Vessels and Piping Conference 51678, V06AT06A006, 2018 | 2 | 2018 |
Finite element prediction and validation of residual stress profiles in 316L samples manufactured by laser powder bed fusion RJ Williams, PA Hooper, CM Davies Procedia Structural Integrity 13, 1353-1358, 2018 | 2 | 2018 |
Fracture analysis of 316L steel samples manufactured by selective laser melting CM Davies, O Withnell, T Ronnerberg, R Williams, PA Hooper Procedia Structural Integrity 13, 1384-1389, 2018 | 2 | 2018 |
Creep deformation and failure properties of 316 L stainless steel manufactured by laser powder bed fusion under multiaxial loading conditions RJ Williams, J Al-Lami, PA Hooper, MS Pham, CM Davies Additive Manufacturing, 101706, 2020 | 1 | 2020 |
Thermal Modeling in Metal Additive Manufacturing using Graph Theory: Experimental Validation with In-situ Infrared Thermography Data from Laser Powder Bed Fusion R Yavari, RJ Williams, KD Cole, PA Hooper, P Rao Journal of Manufacturing Science and Engineering, 2020 | | 2020 |
In situ monitoring of the layer height in laser powder bed fusion RJ Williams, CM Davies, PA Hooper Material Design & Processing Communications, 2020 | | 2020 |