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Co-authors
Max C. LemmeProfessor, RWTH Aachen University, Germany, Director, AMO GmbHVerified email at eld.rwth-aachen.de
Mikael ÖstlingKTH Royal Institute of TechnologyVerified email at kth.se
Anderson David SmithAssociate Professor, Chalmers University of TechnologyVerified email at kth.se
Grzegorz LupinaIHPVerified email at ihp-microelectronics.com
Mikael SternerPh.D. from KTH Royal Institute of TechnologyVerified email at kth.se
Yury Illarionov (Юрий Юрьевич Илла...Ioffe Physical-Technical Institute of the Russian Academy of Sciences and TU WienVerified email at iue.tuwien.ac.at
Saul RodriguezAssociate Professor, KTH Royal Institute of Technology, SwedenVerified email at kth.se
Eric PopStanford University, Electrical Engineering, Materials Science & EngineeringVerified email at stanford.edu
Stephan SchröderKTH Royal Institute of Technology, Micro and Nanosystems, Industrial PhD StudentVerified email at ee.kth.se
Alan PaussaVerified email at uniud.it
Fei YeResearcher, Functional Materials, KTH Royal Institute of TechnologyVerified email at kth.se
Mamoun MuhammedRoyal Institute of TechnologyVerified email at kth.se
Melkamu BeletePhD Candidate at RWTH Aachen University, Faculty of Electrical Engineering and Info. TechnologyVerified email at eld.rwth-aachen.de
Ana RusuProfessor of Electronic Circuits and Systems, KTH Royal Institute of Technology, EECS SchoolVerified email at kth.se
Fredrik ForsbergKTH Royal Institute of TechnologyVerified email at ee.kth.se
Francesco DriussiUniversità degli Studi di UdineVerified email at uniud.it
stefan wagnerAMO GmbHVerified email at amo.de
Eilam YalonTechnion, Israel Institute of TechnologyVerified email at technion.ac.il
Miguel Muñoz RojoAssistant Prof.-Tenure Track, Department of Thermal and Fluid Engineering, University of TwenteVerified email at utwente.nl
sebastien fregoneseCR CNRS, Université de BordeauxVerified email at ims-bordeaux.fr