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Norbert Herfurth
Norbert Herfurth
IHP - Leibniz-Institut für innovative Mikroelektronik
Bestätigte E-Mail-Adresse bei ihp-microelectronics.com
Titel
Zitiert von
Zitiert von
Jahr
Assessment of a chip backside protection
E Amini, A Beyreuther, N Herfurth, A Steigert, B Szyszka, C Boit
Journal of Hardware and Systems Security 2, 345-352, 2018
322018
Photon Emission in Silicon Based Integrated Circuits
C Boit, A Beyreuther, N Herfurth
Microelectronics Failure Analysis Desk Reference, 180, 2019
152019
IC security and quality improvement by protection of chip backside against hardware attacks
E Amini, A Beyreuther, N Herfurth, A Steigert, R Muydinov, B Szyszka, ...
Microelectronics Reliability 88, 22-25, 2018
122018
Second generation of optical IC-backside protection structure
E Amini, T Kiyan, N Herfurth, A Beyreuther, C Boit, JP Seifert
2020 IEEE International Symposium on the Physical and Failure Analysis of …, 2020
62020
Special session: Physical attacks through the chip backside: Threats, challenges, and opportunities
E Amini, K Bartels, C Boit, M Eggert, N Herfurth, T Kiyan, T Krachenfels, ...
2021 IEEE 39th VLSI Test Symposium (VTS), 1-12, 2021
42021
EOFM for contactless parameter extraction of low k dielectric MIS structures
N Herfurth, E Amini, A Beyreuther, T Nakamura, S Keil, C Boit
2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019
42019
Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission
A Beyreuther, I Vogt, N Herfurth, T Nakamura, GG Fischer, B Motamedi, ...
Microelectronics Reliability 92, 143-148, 2019
42019
Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
N Herfurth, C Wu, A Beyreuther, T Nakamura, I De Wolf, M Simon-Najasek, ...
Microelectronics Reliability 92, 73-78, 2019
42019
Photon emission as a characterization tool for bipolar parasitics in FinFET technology
A Beyreuther, N Herfurth, E Amini, T Nakamura, I De Wolf, C Boit
Microelectronics Reliability 88, 273-276, 2018
42018
Contactless device characterization of transistor structures in silicon using electro optical frequency mapping (EOFM)
A Beyreuther, N Herfurth, T Nakamura, GG Fischer, S Keil, C Boit
Microelectronics Reliability 106, 113583, 2020
32020
Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials–An adaptive calibration algorithm
P Scholz, N Herfurth, M Sadowski, T Lundquist, U Kerst, C Boit
Microelectronics Reliability 54 (9-10), 1794-1797, 2014
32014
Generation and Tracking of Optical Signals inside the IC to Improve Device Security and Failure Analysis
E Amini, N Herfurth, A Beyreuther, JP Seifert, C Boit
2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019
22019
EOFM measurements of lateral and vertical Bipolar Transistors in Silicon and SiGe: C Technologies
A Beyreuther, N Herfurth, E Amini, T Nakamura, GG Fischer, S Keil, C Boit
2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019
22019
Contactless Fault Isolation of Ultra Low k Dielectrics in Soft Breakdown Condition
N Herfurth, C Wu, T Nakamura, I De Wolf, K Croes, C Boit
2018 IEEE International Symposium on the Physical and Failure Analysis of …, 2018
22018
The IC Ultra-Thin Back Surface-A Field of Real Nanoscale Fault Isolation Opportunities Requiring a Skillful Sample Preparation
C Boit, J Jatzkowski, F Altmann, M DiBattista, S Silverman, G Zwicker, ...
2022 IEEE International Symposium on the Physical and Failure Analysis of …, 2022
12022
Meticulous system calibration as a key for extracting correct photon emission spectra
N Herfurth, C Boit
2021 IEEE International Symposium on the Physical and Failure Analysis of …, 2021
12021
Comprehensive parametric investigations of EOFM measurements on single FinFET transistors
A Beyreuther, N Herfurth, E Amini, T Nakamura, B Motamedi, C Boit
2020 IEEE International Symposium on the Physical and Failure Analysis of …, 2020
12020
New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis
N Herfurth, A Beyreuther, E Amini, C Boit, M Simon-Najasek, S Hübner, ...
2019 IEEE International Reliability Physics Symposium (IRPS), 1-9, 2019
12019
Reliable backside IC preparation down to STI level using Chemical Mechanical Polishing (CMP) with highly selective slurry
N Herfurth, AA Adesunkanmi, G Zwicker, C Boit
ISTFA 2023, 265-270, 2023
2023
Verified Value Chains, Innovation and Competition
A Weber, S Guilley, R Rathfelder, M Stöttinger, C Lüth, M Malenko, ...
2023 IEEE International Conference on Cyber Security and Resilience (CSR …, 2023
2023
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