| Assessment of a chip backside protection E Amini, A Beyreuther, N Herfurth, A Steigert, B Szyszka, C Boit Journal of Hardware and Systems Security 2 (4), 345-352, 2018 | 23 | 2018 |
| IC security and quality improvement by protection of chip backside against hardware attacks E Amini, A Beyreuther, N Herfurth, A Steigert, R Muydinov, B Szyszka, ... Microelectronics Reliability 88, 22-25, 2018 | 8 | 2018 |
| Photon Emission in Silicon Based Integrated Circuits C Boit, A Beyreuther, N Herfurth Microelectronics Failure Analysis Desk Reference, 180, 2019 | 5 | 2019 |
| EOFM for contactless parameter extraction of low k dielectric MIS structures N Herfurth, E Amini, A Beyreuther, T Nakamura, S Keil, C Boit 2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019 | 4 | 2019 |
| Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation N Herfurth, C Wu, A Beyreuther, T Nakamura, I De Wolf, M Simon-Najasek, ... Microelectronics Reliability 92, 73-78, 2019 | 4 | 2019 |
| Photon emission as a characterization tool for bipolar parasitics in FinFET technology A Beyreuther, N Herfurth, E Amini, T Nakamura, I De Wolf, C Boit Microelectronics Reliability 88, 273-276, 2018 | 4 | 2018 |
| Contactless device characterization of transistor structures in silicon using electro optical frequency mapping (EOFM) A Beyreuther, N Herfurth, T Nakamura, GG Fischer, S Keil, C Boit Microelectronics Reliability 106, 113583, 2020 | 3 | 2020 |
| Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials–An adaptive calibration algorithm P Scholz, N Herfurth, M Sadowski, T Lundquist, U Kerst, C Boit Microelectronics Reliability 54 (9-10), 1794-1797, 2014 | 3 | 2014 |
| Second generation of optical IC-backside protection structure E Amini, T Kiyan, N Herfurth, A Beyreuther, C Boit, JP Seifert 2020 IEEE International Symposium on the Physical and Failure Analysis of …, 2020 | 2 | 2020 |
| Generation and Tracking of Optical Signals inside the IC to Improve Device Security and Failure Analysis E Amini, N Herfurth, A Beyreuther, JP Seifert, C Boit 2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019 | 2 | 2019 |
| Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission A Beyreuther, I Vogt, N Herfurth, T Nakamura, GG Fischer, B Motamedi, ... Microelectronics Reliability 92, 143-148, 2019 | 2 | 2019 |
| Contactless Fault Isolation of Ultra Low k Dielectrics in Soft Breakdown Condition N Herfurth, C Wu, T Nakamura, I De Wolf, K Croes, C Boit 2018 IEEE International Symposium on the Physical and Failure Analysis of …, 2018 | 2 | 2018 |
| Comprehensive parametric investigations of EOFM measurements on single FinFET transistors A Beyreuther, N Herfurth, E Amini, T Nakamura, B Motamedi, C Boit 2020 IEEE International Symposium on the Physical and Failure Analysis of …, 2020 | 1 | 2020 |
| EOFM measurements of lateral and vertical Bipolar Transistors in Silicon and SiGe: C Technologies A Beyreuther, N Herfurth, E Amini, T Nakamura, GG Fischer, S Keil, C Boit 2019 IEEE 26th International Symposium on Physical and Failure Analysis of …, 2019 | 1 | 2019 |
| New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis N Herfurth, A Beyreuther, E Amini, C Boit, M Simon-Najasek, S Hübner, ... 2019 IEEE International Reliability Physics Symposium (IRPS), 1-9, 2019 | 1 | 2019 |
| Special Session: Physical Attacks through the Chip Backside: Threats, Challenges, and Opportunities E Amini, K Bartels, C Boit, M Eggert, N Herfurth, T Kiyan, T Krachenfels, ... 2021 IEEE 39th VLSI Test Symposium (VTS), 1-12, 2021 | | 2021 |
| Development of ultra sensitive localisation techniques for failure analysis of soft breakdown events in low K dielectrics N Herfurth | | 2020 |
| Micro-contacting of single and periodically arrayed columnar silicon structures by focused ion beam techniques F Friedrich, N Herfurth, AM Teodoreanu, T Sontheimer, V Preidel, B Rech, ... Applied Physics Letters 104 (24), 242104, 2014 | | 2014 |
| Meticulous system calibration as a key for extracting correct photon emission spectra N Herfurth, C Boit 2021 IEEE International Symposium on the Physical and Failure Analysis of …, 0 | | |
Christian BoitProfessor für Halbleiterbauelemente, TU BerlinBestätigte E-Mail-Adresse bei tu-berlin.de
