Ehrenfried Zschech
Ehrenfried Zschech
Professor for Nanoanalysis, Technical University Dresden
Bestätigte E-Mail-Adresse bei ikts.fraunhofer.de
TitelZitiert vonJahr
Full correction of the self-absorption in soft-fluorescence extended X-ray-absorption fine structure
L Tröger, D Arvanitis, K Baberschke, H Michaelis, U Grimm, E Zschech
Physical Review B 46 (6), 3283, 1992
4621992
Efficient hydrogen production on MoNi4 electrocatalysts with fast water dissociation kinetics
J Zhang, T Wang, P Liu, Z Liao, S Liu, X Zhuang, M Chen, E Zschech, ...
Nature communications 8, 15437, 2017
1432017
In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures
MA Meyer, M Herrmann, E Langer, E Zschech
Microelectronic Engineering 64 (1-4), 375-382, 2002
1152002
In situ observation of electromigration-induced void migration in dual-damascene interconnect structures
AV Vairagar, SG Mhaisalkar, A Krishnamoorthy, KN Tu, AM Gusak, ...
Applied physics letters 85 (13), 2502-2504, 2004
962004
X-ray microscopy in Zernike phase contrast mode at 4 keV photon energy with 60 nm resolution
U Neuhäusler, G Schneider, W Ludwig, MA Meyer, E Zschech, ...
Journal of Physics D: Applied Physics 36 (10A), A79, 2003
952003
Microstructural characterization of inlaid copper interconnect lines
PR Besser, E Zschech, W Blum, D Winter, R Ortega, S Rose, M Herrick, ...
Journal of Electronic Materials 30 (4), 320-330, 2001
902001
Advanced interconnects for ULSI technology
M Baklanov, PS Ho, E Zschech
John Wiley & Sons, 2012
752012
A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength
V Sukharev, E Zschech
Journal of Applied Physics 96 (11), 6337-6343, 2004
752004
Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2
R Hübner, M Hecker, N Mattern, V Hoffmann, K Wetzig, C Wenger, ...
Thin Solid Films 437 (1-2), 248-256, 2003
722003
A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure
V Sukharev, E Zschech, WD Nix
Journal of Applied Physics 102 (5), 053505, 2007
712007
Dynamical x-ray microscopy investigation of electromigration in passivated inlaid Cu interconnect structures
G Schneider, G Denbeaux, EH Anderson, B Bates, A Pearson, MA Meyer, ...
Applied physics letters 81 (14), 2535-2537, 2002
522002
Nano-Raman spectroscopy with metallized atomic force microscopy tips on strained silicon structures
L Zhu, C Georgi, M Hecker, J Rinderknecht, A Mai, Y Ritz, E Zschech
Journal of Applied Physics 101 (10), 104305, 2007
512007
Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation
E Zschech, MA Meyer, E Langer
MRS Online Proceedings Library Archive 812, 2004
462004
Applying X-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias
LW Kong, JR Lloyd, KB Yeap, E Zschech, A Rudack, M Liehr, A Diebold
Journal of applied physics 110 (5), 053502, 2011
452011
Microstructure effect on EM-induced degradations in dual inlaid copper interconnects
V Sukharev, A Kteyan, E Zschech, WD Nix
IEEE Transactions on Device and Materials Reliability 9 (1), 87-97, 2009
452009
Influence of nitrogen content on the crystallization behavior of thin Ta–Si–N diffusion barriers
R Hübner, M Hecker, N Mattern, A Voss, J Acker, V Hoffmann, K Wetzig, ...
Thin Solid Films 468 (1-2), 183-192, 2004
422004
Effect of nitrogen content on the degradation mechanisms of thin Ta–Si–N diffusion barriers for Cu metallization
R Hübner, M Hecker, N Mattern, V Hoffmann, K Wetzig, H Heuer, ...
Thin Solid Films 500 (1-2), 259-267, 2006
382006
Influence of N content on microstructure and thermal stability of Ta–N thin films for Cu interconnection
M Hecker, D Fischer, V Hoffmann, HJ Engelmann, A Voss, N Mattern, ...
Thin Solid Films 414 (2), 184-191, 2002
372002
Electromigration early failure void nucleation and growth phenomena in Cu and Cu (Mn) interconnects
M Hauschildt, C Hennesthal, G Talut, O Aubel, M Gall, KB Yeap, ...
Reliability Physics Symposium (IRPS), 2013 IEEE International, 2C. 1.1-2C. 1.6, 2013
362013
Microstructure, hardness profile and tensile strength in welds of AA6013 T6 extrusions
LA Guitterez, G Neye, E Zschech
Welding Journal 75 (4), 1996
361996
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