| Efficient hydrogen production on MoNi4 electrocatalysts with fast water dissociation kinetics J Zhang, T Wang, P Liu, Z Liao, S Liu, X Zhuang, M Chen, E Zschech, ... Nature communications 8 (1), 15437, 2017 | 828 | 2017 |
| Full correction of the self-absorption in soft-fluorescence extended x-ray-absorption fine structure L Tröger, D Arvanitis, K Baberschke, H Michaelis, U Grimm, E Zschech Physical Review B 46 (6), 3283, 1992 | 563 | 1992 |
| Zinc‐Mediated Template Synthesis of Fe‐N‐C Electrocatalysts with Densely Accessible Fe‐Nx Active Sites for Efficient Oxygen Reduction G Chen, P Liu, Z Liao, F Sun, Y He, H Zhong, T Zhang, E Zschech, ... Advanced Materials 32 (8), 1907399, 2020 | 314 | 2020 |
| Synergistic electroreduction of carbon dioxide to carbon monoxide on bimetallic layered conjugated metal-organic frameworks H Zhong, M Ghorbani-Asl, KH Ly, J Zhang, J Ge, M Wang, Z Liao, ... Nature Communications 11 (1), 1409, 2020 | 276 | 2020 |
| A coronene-based semiconducting two-dimensional metal-organic framework with ferromagnetic behavior R Dong, Z Zhang, DC Tranca, S Zhou, M Wang, P Adler, Z Liao, F Liu, ... Nature communications 9 (1), 2637, 2018 | 191 | 2018 |
| Advanced Interconnects for ULSI Technology MR Baklanov, PS Ho, E Zschech | 150 | 2012 |
| In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures MA Meyer, M Herrmann, E Langer, E Zschech Microelectronic Engineering 64 (1-4), 375-382, 2002 | 138 | 2002 |
| Engineering crystalline quasi-two-dimensional polyaniline thin film with enhanced electrical and chemiresistive sensing performances T Zhang, H Qi, Z Liao, YD Horev, LA Panes-Ruiz, PS Petkov, Z Zhang, ... Nature communications 10 (1), 4225, 2019 | 126 | 2019 |
| Iridium nanoparticles anchored on 3D graphite foam as a bifunctional electrocatalyst for excellent overall water splitting in acidic solution J Zhang, G Wang, Z Liao, P Zhang, F Wang, X Zhuang, E Zschech, ... Nano Energy 40, 27-33, 2017 | 122 | 2017 |
| In situ observation of electromigration-induced void migration in dual-damascene interconnect structures AV Vairagar, SG Mhaisalkar, A Krishnamoorthy, KN Tu, AM Gusak, ... Applied physics letters 85 (13), 2502-2504, 2004 | 121 | 2004 |
| A delamination strategy for thinly layered defect‐free high‐mobility black phosphorus flakes S Yang, K Zhang, AG Ricciardulli, P Zhang, Z Liao, MR Lohe, E Zschech, ... Angewandte Chemie 130 (17), 4767-4771, 2018 | 116 | 2018 |
| A semiconducting layered metal-organic framework magnet C Yang, R Dong, M Wang, PS Petkov, Z Zhang, M Wang, P Han, ... Nature communications 10 (1), 3260, 2019 | 112 | 2019 |
| X-ray microscopy in Zernike phase contrast mode at 4 keV photon energy with 60 nm resolution U Neuhäusler, G Schneider, W Ludwig, MA Meyer, E Zschech, ... Journal of Physics D: Applied Physics 36 (10A), A79, 2003 | 111 | 2003 |
| Copper-surface-mediated synthesis of acetylenic carbon-rich nanofibers for active metal-free photocathodes T Zhang, Y Hou, V Dzhagan, Z Liao, G Chai, M Löffler, D Olianas, A Milani, ... Nature communications 9 (1), 1140, 2018 | 110 | 2018 |
| Phthalocyanine‐based 2D conjugated metal‐organic framework nanosheets for high‐performance micro‐supercapacitors M Wang, H Shi, P Zhang, Z Liao, M Wang, H Zhong, F Schwotzer, AS Nia, ... Advanced Functional Materials 30 (30), 2002664, 2020 | 109 | 2020 |
| Two‐dimensional boronate ester covalent organic framework thin films with large single crystalline domains for a neuromorphic memory device SW Park, Z Liao, B Ibarlucea, H Qi, HH Lin, D Becker, J Melidonie, ... Angewandte Chemie 132 (21), 8295-8301, 2020 | 105 | 2020 |
| A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure V Sukharev, E Zschech, WD Nix Journal of Applied Physics 102 (5), 053505, 2007 | 104 | 2007 |
| Microstructural characterization of inlaid copper interconnect lines PR Besser, E Zschech, W Blum, D Winter, R Ortega, S Rose, M Herrick, ... Journal of Electronic Materials 30, 320-330, 2001 | 100 | 2001 |
| A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength V Sukharev, E Zschech Journal of Applied Physics 96 (11), 6337-6343, 2004 | 95 | 2004 |
| Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2 R Hübner, M Hecker, N Mattern, V Hoffmann, K Wetzig, C Wenger, ... Thin Solid Films 437 (1-2), 248-256, 2003 | 85 | 2003 |
Valeriy SukharevChief Scientist/Fellow, Siemens EDAVerified email at siemens.com
