Ehrenfried Zschech - Google Scholar Citations

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Citations	5268	1971
h-index	33	18
i10-index	127	42

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Valeriy SukharevTechnical Lead, Mentor Graphics Corp.Verified email at mentor.com
Kong Boon YeapGLOBALFOUNDRIES, Inc.Verified email at globalfoundries.com
Andriy GusakЧеркасский национальный университет имени Богдана Хмельницкого,Verified email at cdu.edu.ua
Rui Huang （黄锐）University of Texas at AustinVerified email at mail.utexas.edu
Henning HeuerProf. Dr.-Ing., TU Dresden, Fraunhofer IKTS DresdenVerified email at ikts.fraunhofer.de
Greg DenbeauxSUNY Polytechnic Institute, College of Nanoscale Science and EngineeringVerified email at sunypoly.edu
Kopycinska Mueller, MalgorzataIKTS-MDVerified email at ikts-md.fraunhofer.de
Xiaopeng XuSynopsys, IBM, Brown UniversityVerified email at synopsys.com
Thomas MikolajickScientific Director, NaMLab GmbH and Professor for nanoelectronic materials, TU DresdenVerified email at namlab.com
Klaus-Juergen WolterProfessor für Verfahrenstechnologie der Elektronik, TU DresdenVerified email at tu-dresden.de
Torsten E.M. StaabPrivatdozent, LCTM, Universität WürzburgVerified email at matsyn.uni-wuerzburg.de
Jens TrommerNamlab gGmbHVerified email at namlab.com
André HeinzigNaMLab, TU DresdenVerified email at namlab.com
Walter M. WeberProfessor of Nanoelectronics at TU WienVerified email at tuwien.ac.at
Dr. Di XuIntel;University of California, Los Angeles;Tsinghua UniversityVerified email at ucla.edu
Bernd KöhlerScientist, Matrial Diagnostics, Fraunhofer IKTSVerified email at ikts.fraunhofer.de
Vidvuds OzolinsProfessor of Applied Physics, Yale UniversityVerified email at yale.edu
Bryan TracyEvans Ananalytical GroupVerified email at sonic.net
Dipankar, MandalInstitute of Nano Science and Technology, Mohali 160062 & Dept. of Physics, Jadavpur UniversityVerified email at inst.ac.in
Sam ZhangProfessor, School of Mechanical and Aerospace Engineering, Nanyang Technological UniversityVerified email at ntu.edu.sg

Ehrenfried Zschech

Professor for Nanoanalysis, Technical University Dresden

Verified email at ikts.fraunhofer.de

Materials Science Materials Analysis Solid State Physics


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Full correction of the self-absorption in soft-fluorescence extended X-ray-absorption fine structure L Tröger, D Arvanitis, K Baberschke, H Michaelis, U Grimm, E Zschech Physical Review B 46 (6), 3283, 1992	489	1992
Efficient hydrogen production on MoNi 4 electrocatalysts with fast water dissociation kinetics J Zhang, T Wang, P Liu, Z Liao, S Liu, X Zhuang, M Chen, E Zschech, ... Nature communications 8 (1), 1-8, 2017	313	2017
In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures MA Meyer, M Herrmann, E Langer, E Zschech Microelectronic Engineering 64 (1-4), 375-382, 2002	124	2002
In situ observation of electromigration-induced void migration in dual-damascene interconnect structures AV Vairagar, SG Mhaisalkar, A Krishnamoorthy, KN Tu, AM Gusak, ... Applied physics letters 85 (13), 2502-2504, 2004	106	2004
Advanced interconnects for ULSI technology M Baklanov, PS Ho, E Zschech John Wiley & Sons, 2012	105	2012
X-ray microscopy in Zernike phase contrast mode at 4 keV photon energy with 60 nm resolution U Neuhäusler, G Schneider, W Ludwig, MA Meyer, E Zschech, ... Journal of Physics D: Applied Physics 36 (10A), A79, 2003	104	2003
Microstructural characterization of inlaid copper interconnect lines PR Besser, E Zschech, W Blum, D Winter, R Ortega, S Rose, M Herrick, ... Journal of Electronic Materials 30 (4), 320-330, 2001	95	2001
A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength V Sukharev, E Zschech Journal of Applied Physics 96 (11), 6337-6343, 2004	81	2004
A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure V Sukharev, E Zschech, WD Nix Journal of Applied Physics 102 (5), 053505, 2007	78	2007
Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2 R Hübner, M Hecker, N Mattern, V Hoffmann, K Wetzig, C Wenger, ... Thin Solid Films 437 (1-2), 248-256, 2003	75	2003
Dynamical x-ray microscopy investigation of electromigration in passivated inlaid Cu interconnect structures G Schneider, G Denbeaux, EH Anderson, B Bates, A Pearson, MA Meyer, ... Applied physics letters 81 (14), 2535-2537, 2002	57	2002
100 years of the physics of diodes P Zhang, Á Valfells, LK Ang, JW Luginsland, YY Lau Applied Physics Reviews 4 (1), 011304, 2017	51	2017
Applying X-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias LW Kong, JR Lloyd, KB Yeap, E Zschech, A Rudack, M Liehr, A Diebold Journal of applied physics 110 (5), 053502, 2011	49	2011
Nano-Raman spectroscopy with metallized atomic force microscopy tips on strained silicon structures L Zhu, C Georgi, M Hecker, J Rinderknecht, A Mai, Y Ritz, E Zschech Journal of Applied Physics 101 (10), 104305, 2007	47	2007
Microstructure effect on EM-induced degradations in dual inlaid copper interconnects V Sukharev, A Kteyan, E Zschech, WD Nix IEEE Transactions on Device and Materials Reliability 9 (1), 87-97, 2009	45	2009
Influence of nitrogen content on the crystallization behavior of thin Ta–Si–N diffusion barriers R Hübner, M Hecker, N Mattern, A Voss, J Acker, V Hoffmann, K Wetzig, ... Thin Solid Films 468 (1-2), 183-192, 2004	45	2004
Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation E Zschech, MA Meyer, E Langer MRS Online Proceedings Library Archive 812, 2004	45	2004
A coronene-based semiconducting two-dimensional metal-organic framework with ferromagnetic behavior R Dong, Z Zhang, DC Tranca, S Zhou, M Wang, P Adler, Z Liao, F Liu, ... Nature communications 9 (1), 1-9, 2018	43	2018
A delamination strategy for thinly layered defect‐free high‐mobility black phosphorus flakes S Yang, K Zhang, AG Ricciardulli, P Zhang, Z Liao, MR Lohe, E Zschech, ... Angewandte Chemie 130 (17), 4767-4771, 2018	43	2018
Microstructure, hardness profile and tensile strength in welds of AA6013 T6 extrusions LA Guitterez, G Neye, E Zschech Welding Journal 75 (4), 1996	42	1996

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