Ehrenfried Zschech
Ehrenfried Zschech
Professor for Nanoanalysis, Technische Universität Dresden
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Efficient hydrogen production on MoNi 4 electrocatalysts with fast water dissociation kinetics
J Zhang, T Wang, P Liu, Z Liao, S Liu, X Zhuang, M Chen, E Zschech, ...
Nature communications 8 (1), 1-8, 2017
Full correction of the self-absorption in soft-fluorescence extended X-ray-absorption fine structure
L Tröger, D Arvanitis, K Baberschke, H Michaelis, U Grimm, E Zschech
Physical Review B 46 (6), 3283, 1992
In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures
MA Meyer, M Herrmann, E Langer, E Zschech
Microelectronic Engineering 64 (1-4), 375-382, 2002
Advanced interconnects for ULSI technology
M Baklanov, PS Ho, E Zschech
John Wiley & Sons, 2012
Zinc‐Mediated Template Synthesis of Fe‐N‐C Electrocatalysts with Densely Accessible Fe‐Nx Active Sites for Efficient Oxygen Reduction
G Chen, P Liu, Z Liao, F Sun, Y He, H Zhong, T Zhang, E Zschech, ...
Advanced Materials 32 (8), 1907399, 2020
In situ observation of electromigration-induced void migration in dual-damascene interconnect structures
AV Vairagar, SG Mhaisalkar, A Krishnamoorthy, KN Tu, AM Gusak, ...
Applied physics letters 85 (13), 2502-2504, 2004
A coronene-based semiconducting two-dimensional metal-organic framework with ferromagnetic behavior
R Dong, Z Zhang, DC Tranca, S Zhou, M Wang, P Adler, Z Liao, F Liu, ...
Nature communications 9 (1), 1-9, 2018
Synergistic electroreduction of carbon dioxide to carbon monoxide on bimetallic layered conjugated metal-organic frameworks
H Zhong, M Ghorbani-Asl, KH Ly, J Zhang, J Ge, M Wang, Z Liao, ...
Nature communications 11 (1), 1-10, 2020
X-ray microscopy in Zernike phase contrast mode at 4 keV photon energy with 60 nm resolution
U Neuhäusler, G Schneider, W Ludwig, MA Meyer, E Zschech, ...
Journal of Physics D: Applied Physics 36 (10A), A79, 2003
Microstructural characterization of inlaid copper interconnect lines
PR Besser, E Zschech, W Blum, D Winter, R Ortega, S Rose, M Herrick, ...
Journal of Electronic Materials 30 (4), 320-330, 2001
A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure
V Sukharev, E Zschech, WD Nix
Journal of Applied Physics 102 (5), 053505, 2007
A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength
V Sukharev, E Zschech
Journal of Applied Physics 96 (11), 6337-6343, 2004
Structure and thermal stability of graded Ta–TaN diffusion barriers between Cu and SiO2
R Hübner, M Hecker, N Mattern, V Hoffmann, K Wetzig, C Wenger, ...
Thin Solid Films 437 (1-2), 248-256, 2003
A delamination strategy for thinly layered defect‐free high‐mobility black phosphorus flakes
S Yang, K Zhang, AG Ricciardulli, P Zhang, Z Liao, MR Lohe, E Zschech, ...
Angewandte Chemie 130 (17), 4767-4771, 2018
Iridium nanoparticles anchored on 3D graphite foam as a bifunctional electrocatalyst for excellent overall water splitting in acidic solution
J Zhang, G Wang, Z Liao, P Zhang, F Wang, X Zhuang, E Zschech, ...
Nano Energy 40, 27-33, 2017
Copper-surface-mediated synthesis of acetylenic carbon-rich nanofibers for active metal-free photocathodes
T Zhang, Y Hou, V Dzhagan, Z Liao, G Chai, M Löffler, D Olianas, A Milani, ...
Nature communications 9 (1), 1-11, 2018
A semiconducting layered metal-organic framework magnet
C Yang, R Dong, M Wang, PS Petkov, Z Zhang, M Wang, P Han, ...
Nature communications 10 (1), 1-9, 2019
Engineering crystalline quasi-two-dimensional polyaniline thin film with enhanced electrical and chemiresistive sensing performances
T Zhang, H Qi, Z Liao, YD Horev, LA Panes-Ruiz, PS Petkov, Z Zhang, ...
Nature communications 10 (1), 1-9, 2019
Dynamical x-ray microscopy investigation of electromigration in passivated inlaid Cu interconnect structures
G Schneider, G Denbeaux, EH Anderson, B Bates, A Pearson, MA Meyer, ...
Applied physics letters 81 (14), 2535-2537, 2002
Applying X-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias
LW Kong, JR Lloyd, KB Yeap, E Zschech, A Rudack, M Liehr, A Diebold
Journal of applied physics 110 (5), 053502, 2011
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