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Chang-Beom EomUniversity of Wisconsin-MadisonVerified email at engr.wisc.edu
Ho Won JangDepatment of Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
Dong-Wan KimSchool of Civil, Environmental and Architectural Engineering, Korea UniversityVerified email at korea.ac.kr
J.-L. LeePOSTECHVerified email at postech.ac.kr
Jeong Min BaikSungkyunkwan UniversityVerified email at skku.edu
Myoung Hoon SongUNISTVerified email at unist.ac.kr
Jae Cheol ShinProfessor at Division of Electrical and Electronics Engineering at Dongguk UniversityVerified email at dgu.ac.kr
Dong Min KimHongik University, Materials Science and EngineeringVerified email at hongik.ac.kr
Jaesang Leeschool of architectural, civil, and environmental engineering, korea universityVerified email at korea.ac.kr
Xiuling LiUniversity of Texas at AustinVerified email at utexas.edu
Seung Hyub BaekKorea Institute of Science and Technology (KIST)Verified email at kist.re.kr
Jung-Kun LeeUniversity of PittsburghVerified email at pitt.edu