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Fu Guo
Fu Guo
Professor, College of Materials Science and Engineering, Beijing University of Technology
Verified email at bjut.edu.cn
Title
Cited by
Cited by
Year
Cubic AgPbmSbTe2+m: Bulk Thermoelectric Materials with High Figure of Merit
KF Hsu, S Loo, F Guo, W Chen, JS Dyck, C Uher, T Hogan, ...
Science 303 (5659), 818-821, 2004
33242004
Zero thermal expansion in YbGaGe due to an electronic valence transition
JR Salvador, F Guo, T Hogan, MG Kanatzidis
Nature 425 (6959), 702-705, 2003
2152003
Composite lead-free electronic solders
F Guo
Lead-Free Electronic Solders, 129-145, 2006
1572006
Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder
Y Shi, J Tian, H Hao, Z Xia, Y Lei, F Guo
Journal of Alloys and Compounds 453 (1-2), 180-184, 2008
1412008
Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder alloy
W Dong, Y Shi, Z Xia, Y Lei, F Guo
Journal of Electronic Materials 37 (7), 982-991, 2008
1342008
Processing and aging characteristics of eutectic Sn-3.5 Ag solder reinforced with mechanically incorporated Ni particles
F Guo, J Lee, S Choi, JP Lucas, TR Bieler, KN Subramanian
Journal of Electronic Materials 30 (9), 1073-1082, 2001
1332001
Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5 Ag and Sn-4.0 Ag-0.5 Cu non-composite solder joints
F Guo, JP Lucas, KN Subramanian
Journal of Materials Science: Materials in Electronics 12 (1), 27-35, 2001
1142001
Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint
B Li, Y Shi, Y Lei, F Guo, Z Xia, B Zong
Journal of Electronic Materials 34 (3), 217-224, 2005
1072005
Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5 Ag composite solders
F Guo, S Choi, JP Lucas, KN Subramanian
Soldering & surface mount technology, 2001
1002001
Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
F Guo, S Choi, KN Subramanian, TR Bieler, JP Lucas, A Achari, ...
Materials Science and Engineering: A 351 (1-2), 190-199, 2003
992003
Creep properties of Sn-Ag solder joints containing intermetallic particles
S Choi, JG Lee, F Guo, TR Bieler, KN Subramanian, JP Lucas
JOM 53 (6), 22-26, 2001
922001
Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders
F Guo, S Choi, JP Lucas, KN Subramanian
Journal of electronic materials 29 (10), 1241-1248, 2000
832000
Metal recovery from waste printed circuit boards: A review for current status and perspectives
J Hao, Y Wang, Y Wu, F Guo
Resources, Conservation and Recycling 157, 104787, 2020
772020
Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions
F Tai, F Guo, ZD Xia, YP Lei, YF Yan, JP Liu, YW Shi
Journal of electronic materials 34 (11), 1357-1362, 2005
762005
Mechanical properties of intermetallic compounds associated with Pb-free solder joints using nanoindentation
JP Lucas, H Rhee, F Guo, KN Subramanian
Journal of electronic Materials 32 (12), 1375-1383, 2003
732003
Investigation of rare earth-doped BiAg high-temperature solders
Y Shi, W Fang, Z Xia, Y Lei, F Guo, X Li
Journal of Materials Science: Materials in Electronics 21 (9), 875-881, 2010
702010
Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint
WM Xiao, YW Shi, GC Xu, R Ren, F Guo, ZD Xia, YP Lei
Journal of alloys and compounds 472 (1-2), 198-202, 2009
652009
Creep property of composite solders reinforced by nano-sized particles
Y Shi, J Liu, Z Xia, Y Lei, F Guo, X Li
Journal of Materials Science: Materials in Electronics 19 (4), 349-356, 2008
642008
Effect of isothermal aging and thermal cycling on interfacial IMC growth and fracture behavior of SnAgCu/Cu joints
X Li, F Li, F Guo, Y Shi
Journal of electronic materials 40 (1), 51-61, 2011
612011
Creep properties of composite solders reinforced with nano-and microsized particles
Y Shi, J Liu, Y Yan, Z Xia, Y Lei, F Guo, X Li
Journal of electronic materials 37 (4), 507-514, 2008
602008
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