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Fu Guo
Fu Guo
Professor, College of Materials Science and Engineering, Beijing University of Technology
Verified email at bjut.edu.cn
Title
Cited by
Cited by
Year
Cubic AgPbmSbTe2+m: Bulk Thermoelectric Materials with High Figure of Merit
KF Hsu, S Loo, F Guo, W Chen, JS Dyck, C Uher, T Hogan, ...
Science 303 (5659), 818-821, 2004
35652004
Zero thermal expansion in YbGaGe due to an electronic valence transition
JR Salvador, F Guo, T Hogan, MG Kanatzidis
Nature 425 (6959), 702-705, 2003
2492003
Metal recovery from waste printed circuit boards: A review for current status and perspectives
J Hao, Y Wang, Y Wu, F Guo
Resources, Conservation and Recycling 157, 104787, 2020
1752020
Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder
Y Shi, J Tian, H Hao, Z Xia, Y Lei, F Guo
Journal of Alloys and Compounds 453 (1-2), 180-184, 2008
1612008
Composite lead-free electronic solders
KN Subramanian, F Guo
Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007
1612007
Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder alloy
W Dong, Y Shi, Z Xia, Y Lei, F Guo
Journal of Electronic Materials 37, 982-991, 2008
1532008
Processing and aging characteristics of eutectic Sn-3.5 Ag solder reinforced with mechanically incorporated Ni particles
F Guo, J Lee, S Choi, JP Lucas, TR Bieler, KN Subramanian
Journal of Electronic Materials 30, 1073-1082, 2001
1392001
Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5 Ag and Sn-4.0 Ag-0.5 Cu non-composite solder joints
F Guo, JP Lucas, KN Subramanian
Journal of Materials Science: Materials in Electronics 12, 27-35, 2001
1182001
Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint
B Li, Y Shi, Y Lei, F Guo, Z Xia, B Zong
Journal of Electronic Materials 34, 217-224, 2005
1082005
Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5 Ag composite solders
F Guo, S Choi, JP Lucas, KN Subramanian
Soldering & surface mount technology 13 (1), 7-18, 2001
1052001
Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
F Guo, S Choi, KN Subramanian, TR Bieler, JP Lucas, A Achari, ...
Materials Science and Engineering: A 351 (1-2), 190-199, 2003
1042003
Creep properties of Sn-Ag solder joints containing intermetallic particles
S Choi, JG Lee, F Guo, TR Bieler, KN Subramanian, JP Lucas
JOM 53, 22-26, 2001
932001
Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders
F Guo, S Choi, JP Lucas, KN Subramanian
Journal of electronic materials 29, 1241-1248, 2000
842000
Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions
F Tai, F Guo, ZD Xia, YP Lei, YF Yan, JP Liu, YW Shi
Journal of electronic materials 34, 1357-1362, 2005
812005
Mechanical properties of intermetallic compounds associated with Pb-free solder joints using nanoindentation
JP Lucas, H Rhee, F Guo, KN Subramanian
Journal of electronic Materials 32, 1375-1383, 2003
802003
Investigation of rare earth-doped BiAg high-temperature solders
Y Shi, W Fang, Z Xia, Y Lei, F Guo, X Li
Journal of Materials Science: Materials in Electronics 21, 875-881, 2010
742010
Creep property of composite solders reinforced by nano-sized particles
Y Shi, J Liu, Z Xia, Y Lei, F Guo, X Li
Journal of Materials Science: Materials in Electronics 19, 349-356, 2008
712008
Effect of isothermal aging and thermal cycling on interfacial IMC growth and fracture behavior of SnAgCu/Cu joints
X Li, F Li, F Guo, Y Shi
Journal of electronic materials 40, 51-61, 2011
682011
Creep properties of composite solders reinforced with nano-and microsized particles
Y Shi, J Liu, Y Yan, Z Xia, Y Lei, F Guo, X Li
Journal of electronic materials 37, 507-514, 2008
682008
Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint
WM Xiao, YW Shi, GC Xu, R Ren, F Guo, ZD Xia, YP Lei
Journal of alloys and compounds 472 (1-2), 198-202, 2009
652009
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