| Microelectronic elements with post-assembly planarization V Oganesian, B Haba, C Mitchell, I Mohammed, P Savalia US Patent 8,847,376, 2014 | 251 | 2014 |
| Microelectronic elements with rear contacts connected with via first or via middle structures V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia US Patent 8,796,135, 2014 | 192 | 2014 |
| Microelectronic elements having metallic pads overlying vias V Oganesian, I Mohammed, C Mitchell, B Haba, P Savalia US Patent 8,791,575, 2014 | 185 | 2014 |
| Active chip on carrier or laminated chip having microelectronic element embedded therein V Oganesian, I Mohammed, C Mitchell, B Haba, P Savalia US Patent 8,598,695, 2013 | 130 | 2013 |
| Methods of forming semiconductor elements using micro-abrasive particle stream V Oganesian, B Haba, C Mitchell, I Mohammed, P Savalia US Patent 9,640,437, 2017 | 89 | 2017 |
| Non-lithographic formation of three-dimensional conductive elements V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia US Patent 8,697,569, 2014 | 88 | 2014 |
| Staged via formation from both sides of chip V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia US Patent 8,847,380, 2014 | 87 | 2014 |
| Multi-chip module with stacked face-down connected dies B Haba, I Mohammed, P Savalia US Patent 8,841,765, 2014 | 85 | 2014 |
| Multiplexed identification, quantification and genotyping of infectious agents using a semiconductor biochip A Hassibi, A Manickam, R Singh, S Bolouki, R Sinha, KB Jirage, ... Nature biotechnology 36 (8), 738-745, 2018 | 75 | 2018 |
| Vias in porous substrates I Mohammed, B Haba, CE Uzoh, P Savalia US Patent 9,455,181, 2016 | 71 | 2016 |
| Stacked chip assembly having vertical vias V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia US Patent 8,686,565, 2014 | 66 | 2014 |
| Multi-function and shielded 3D interconnects V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia US Patent 8,610,259, 2013 | 61 | 2013 |
| Near-field antennas and methods of implementing the same for wearable pods and devices that include metalized interfaces S Sharma, P Savalia, C Singleton, P Panchalan, I Mohammad US Patent App. 14/480,452, 2016 | 48 | 2016 |
| Chip assembly having via interconnects joined by plating V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia US Patent 8,685,793, 2014 | 48 | 2014 |
| Carrier structures for microelectronic elements V Oganesian, B Haba, C Mitchell, I Mohammed, P Savalia US Patent 9,099,479, 2015 | 40 | 2015 |
| High density three-dimensional integrated capacitors V Oganesian, B Haba, I Mohammed, P Savalia US Patent 8,502,340, 2013 | 34 | 2013 |
| A study of crack–inclusion interactions and matrix–inclusion debonding using Moiré interferometry and finite element method PC Savalia, HV Tippur Experimental Mechanics 47, 533-547, 2007 | 34 | 2007 |
| Physiological information generation based on bioimpedance signals MES Luna, S Primas, JM Stivoric, C Singleton, P Savalia, P Panchalan, ... US Patent App. 14/121,939, 2015 | 33 | 2015 |
| Electrical barrier layers C Uzoh, V Oganesian, I Mohammed, B Haba, P Savalia, C Mitchell US Patent 9,125,333, 2015 | 31 | 2015 |
| Wearable devices including metalized interfaces and strap-integrated sensor electrodes S Sharma, C Singleton, P Savalia, P Panchalan, S Nabanja, SHY Cheng, ... US Patent App. 14/480,628, 2016 | 30 | 2016 |
Hareesh V. TippurProfessor of Mechanical Engineering, Auburn University, AlabamaBestätigte E-Mail-Adresse bei eng.auburn.edu
