| Mikrosystemtechnik für Ingenieure W Menz, O Paul John Wiley & Sons, 2012 | 378 | 2012 |
| Magnetic phase transition in two-dimensional ultrathin Fe films on Au (100) W Dürr, M Taborelli, O Paul, R Germar, W Gudat, D Pescia, M Landolt Physical review letters 62 (2), 206-209, 1989 | 361 | 1989 |
| Micromachined thermally based CMOS microsensors H Baltes, O Paul, O Brand Proceedings of the IEEE 86 (8), 1660-1678, 1998 | 306 | 1998 |
| Microsystem technology W Menz, J Mohr, O Paul John Wiley & Sons, 2008 | 268 | 2008 |
| MEMS: A practical guide of design, analysis, and applications J Korvink, O Paul Springer Science & Business Media, 2010 | 239 | 2010 |
| Process-dependent thin-film thermal conductivities for thermal CMOS MEMS M Von Arx, O Paul, H Baltes Journal of Microelectromechanical systems 9 (1), 136-145, 2000 | 214 | 2000 |
| Energy harvesters driven by broadband random vibrations E Halvorsen Journal of Microelectromechanical Systems 17 (5), 1061-1071, 2008 | 194 | 2008 |
| GaN-based micro-LED arrays on flexible substrates for optical cochlear implants C Goßler, C Bierbrauer, R Moser, M Kunzer, K Holc, W Pletschen, ... Journal of Physics D: Applied Physics 47 (20), 205401, 2014 | 132 | 2014 |
| Mechanical properties of thin films from the load deflection of long clamped plates V Ziebart, O Paul, U Munch, J Schwizer, H Baltes Journal of Microelectromechanical Systems 7 (3), 320-328, 1998 | 129 | 1998 |
| Fabrication technology for silicon-based microprobe arrays used in acute and sub-chronic neural recording S Herwik, S Kisban, AAA Aarts, K Seidl, G Girardeau, K Benchenane, ... Journal of Micromechanics and Microengineering 19 (7), 074008, 2009 | 122 | 2009 |
| Multifunctional ZnO‐nanowire‐based sensor A Menzel, K Subannajui, F Güder, D Moser, O Paul, M Zacharias Advanced Functional Materials 21 (22), 4342-4348, 2011 | 119 | 2011 |
| Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array A Schaufelbuhl, N Schneeberger, U Munch, M Waelti, O Paul, O Brand, ... Journal of Microelectromechanical systems 10 (4), 503-510, 2001 | 92 | 2001 |
| Strongly buckled square micromachined membranes V Ziebart, O Paul, H Baltes Journal of Microelectromechanical Systems 8 (4), 423-432, 1999 | 91 | 1999 |
| Single-chip CMOS anemometer F Mayer, A Haberli, H Jacobs, G Ofner, O Paul, H Baltes International Electron Devices Meeting. IEDM Technical Digest, 895-898, 1997 | 82 | 1997 |
| Thermally actuated CMOS micromirrors J Bühler, J Funk, O Paul, FP Steiner, H Baltes Sensors and Actuators A: Physical 47 (1-3), 572-575, 1995 | 82 | 1995 |
| CMOS-based high-density silicon microprobe arrays for electronic depth control in intracortical neural recording K Seidl, S Herwik, T Torfs, HP Neves, O Paul, P Ruther Journal of Microelectromechanical Systems 20 (6), 1439-1448, 2011 | 79 | 2011 |
| Recent progress in neural probes using silicon MEMS technology P Ruther, S Herwik, S Kisban, K Seidl, O Paul IEEJ Transactions on electrical and electronic engineering 5 (5), 505-515, 2010 | 79 | 2010 |
| Surface micromachining by sacrificial aluminium etching D Westberg, O Paul, GI Andersson, H Baltes Journal of Micromechanics and Microengineering 6 (4), 376, 1996 | 74 | 1996 |
| Two-dimensional integrated gas flow sensors by CMOS IC technology J Robadey, O Paul, H Baltes Journal of Micromechanics and Microengineering 5 (3), 243, 1995 | 73 | 1995 |
| Multidimensional CMOS in-plane stress sensor J Bartholomeyczik, S Brugger, P Ruther, O Paul IEEE Sensors Journal 5 (5), 872-882, 2005 | 72 | 2005 |
