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Anvar ZakhidovUniversity of Texas at Dallas, ITMO UniversityVerified email at metalab.ifmo.ru
Jinming GaoUT Southwestern Medical CenterVerified email at utsouthwestern.edu
Mukti AryalQORVO IncVerified email at qorvo.com
Gary H. BernsteinDepartment of Electrical Engineering, University of Notre DameVerified email at nd.edu
Marya LiebermanUniversity of Notre DameVerified email at nd.edu
Yaling LiuLehigh UniversityVerified email at lehigh.edu
Yi YangSr. Process Integration Engineer at GlobalFoundriesVerified email at globalfoundries.com
Qing GuAssociate Professor of ECE and Physics, North Carolina State UniversityVerified email at ncsu.edu
Yuchen LiangThe University of Texas at DallasVerified email at utdallas.edu
Prof. Dr. Fatih BuyukserinProfessor at Biomedical Eng. TOBB University of Economics and TechnologyVerified email at etu.edu.tr
Ronald M. ReanoProfessor, Electrical and Computer Engineering, Ohio State UniversityVerified email at osu.edu
Jeong Bong (JB) LeeProfessor of Electrical and Computer Engineering, University of Texas at DallasVerified email at utdallas.edu
Matthew GoecknerProf, University of Texas at DallasVerified email at utdallas.edu
Evelyn KF YimUniversity of WaterlooVerified email at uwaterloo.ca
Kam LeongBiomedical Engineering, Columbia UniversityVerified email at columbia.edu
Christopher L SolesNational Institute of Standards of TechnologyVerified email at nist.gov
Jiyoung KimProfessor of Materials Science and Engineering, University of Texas at DallasVerified email at utdallas.edu
yonghao cuiPostdoc Fellow in Material Science Engineering, Georgia Institute of TechnologyVerified email at gatech.edu
Rajagopal RamasubramaniamUnilever R&D BangaloreVerified email at unilever.com
Bongki LeeTechnology Development Engineer, GLOBALFOUNDRIESVerified email at globalfoundries.com