| Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips C Harendt, J Kostelnik, A Kugler, E Lorenz, S Saller, A Schreivogel, Z Yu, ... Solid-State Electronics 113, 101-108, 2015 | 52 | 2015 |
| Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards H Schröder, J Bauer, F Ebling, M Franke, A Beier, P Demmer, W Süllau, ... Optoelectronic Integrated Circuits VIII 6124, 44-57, 2006 | 39 | 2006 |
| Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides H Schroder, N Arndt-Staufenbiel, A Beier, F Ebling, M Franke, E Griese, ... 2008 58th Electronic Components and Technology Conference, 268-275, 2008 | 27 | 2008 |
| Combining organic and printed electronics in Hybrid System in Foil (HySiF) based smart skin for robotic applications MU Hassan, J Keck, H Klauk, J Kostelnik, Y Mahsereci, S Sailer, ... 2015 European microelectronics packaging conference (EMPC), 1-6, 2015 | 25 | 2015 |
| Ultra-thin silicon chips in flexible microsystems J Wolf, J Kostelnik, K Berschauer, A Kugler, E Lorenz, C Harendt, Z Yu Proceedings of the ECWC 13, 2014 | 15 | 2014 |
| Temperature sensor measurement system for firefighter gloves D Mrugala, F Ziegler, J Kostelnik, W Lang Procedia Engineering 47, 611-614, 2012 | 15 | 2012 |
| Chip embedding in laminates A Kugler, M Koyuncu, A Zimmermann, J Kostelnik Ultra-thin Chip Technology and Applications, 159-165, 2011 | 15 | 2011 |
| New generation interconnection technology: printed circuit boards with integrated optical layers P Demmer, R Modinger, J Bauer, F Ebling, H Schroder, P Beil, H Albrecht, ... Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005 …, 2005 | 15 | 2005 |
| Method for producing a coil J Kostelnik, A Schreivogel, J Wolf, J Keck, M Giousouf, T Reininger, ... US Patent 9,087,636, 2015 | 10 | 2015 |
| 240 Gbit/s parallel optical transmission using double layer waveguides in thin glass sheets H Schröder, N Arndt-Staufenbiel, A Beier, F Ebling, M Franke, E Griese, ... Proceedings of 2nd Int. Symp. on Photonic Packaging, 2008 | 8* | 2008 |
| „Temperaturstabile Wellenleiter und optische Kopplung für elektro-optische Leiterplatten” H Schröder, J Bauer, F Ebling, M Franke, A Beier, P Demmer, W Süllau, ... Tagungsband der GMM/DVS-Tagung Elektrische Baugruppen, Aufbau und …, 2006 | 8 | 2006 |
| Method for producing a coil integrated in a substrate or applied to a substrate, and electronic device J Kostelnik, A Schreivogel, A Kiessling, M Giousouf US Patent 9,899,137, 2018 | 6 | 2018 |
| Embedding technologies for an automotive radar system KF Becker, M Koch, R Kahle, T Braun, L Bottcher, A Ostmann, J Kostelnik, ... 2009 59th Electronic Components and Technology Conference, 1453-1459, 2009 | 5 | 2009 |
| High performance electrical optical circuit boards (EOCB) using planar optical interconnects integrated in thin glass foils H Schröder, A Beier, R Mödinger, S Intemann, J Kostelnik, E Griese, ... Proc. EOS Conference on Trends in Optoelectronics, 2007 | 5 | 2007 |
| Ausdehnungsarmes thermoplastisches Basismaterial für flexible Schaltungsträger auf Basis von Polyetheretherketon (PEEK) C Seidel, H Münstedt, FE durch Innovation, N Philippin, A Schreivogel, ... Tagungsband 3, 119-124, 0 | 5 | |
| Verbesserung der Ergonomie am Arbeitsplatz mittels einer intelligenten Orthesen-Weste J Kuschan, H Schmidt, E Jung, U Oestermann, M Winkler, A Schreivogel, ... Zukunft Lebensräume Kongress, 2016 | 4 | 2016 |
| Elektro-optische Leiterplatten auf Basis von Dunnglaslaminaten mit integrierten optischen Wellenleitern H Schroder, N Arndt-Staufenbiel, M Franke, A Beier, J Kostelnik, F Ebling, ... PLUS. Produktion von Leiterplatten und Systemen 10 (4), 794, 2008 | 4 | 2008 |
| Leiterplatten mit innenliegender optolage-Wellenleitertechnologie und koppelkonzept J Bauer, F Ebling, H Schroeder, A Beier, P Beil, P Demmer, M Franke, ... Tagungsband des IV. ITG-Workshop Photonische Aufbau-und Verbindungstechnik, 2005 | 4 | 2005 |
| New optical coupling element for 90 degree waveguide coupling in electrical-optical circuit boards (EOCB) H Schroder 10th MicroOptics Conference MOC'04, 2004. 9, 2004 | 4 | 2004 |
| PowerGrasp–Design and Evaluation of a Modular Soft-Robotic Arm Exosuit for Industrial Applications JP Goppold, J Kuschan, G Thiele, H Schmidt, J Krueger, R Hackbart, ... ISR 2020; 52th International Symposium on Robotics, 1-8, 2020 | 3 | 2020 |
