Pritish R. Parida
Pritish R. Parida
IBM Research
Verified email at us.ibm.com
Title
Cited by
Cited by
Year
Server liquid cooling with chiller-less data center design to enable significant energy savings
M Iyengar, M David, P Parida, V Kamath, B Kochuparambil, D Graybill, ...
2012 28th annual IEEE semiconductor thermal measurement and management …, 2012
1002012
Fabrication, assembly, and testing of Cu-and Al-based microchannel heat exchangers
F Mei, PR Parida, J Jiang, WJ Meng, SV Ekkad
Journal of Microelectromechanical systems 17 (4), 869-881, 2008
682008
Analysis of solidification of a semitransparent planar layer using the lattice Boltzmann method and the discrete transfer method
R Raj, A Prasad, PR Parida, SC Mishra
Numerical Heat Transfer, Part A: Applications 49 (3), 279-299, 2006
682006
Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers
MP David, M Iyengar, P Parida, R Simons, M Schultz, M Gaynes, ...
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012
552012
Thermal transfer structures coupling electronics card (s) to coolant-cooled structure (s)
MP David, DP Graybill, MK Iyengar, V Kamath, BJ Kochuparambil, ...
US Patent 8,913,384, 2014
442014
Dynamically limiting energy consumed by cooling apparatus
TJ Chainer, MP David, MK Iyengar, PR Parida, RR Schmidt, MD Schultz
US Patent 9,043,035, 2015
402015
Dynamically limiting energy consumed by cooling apparatus
TJ Chainer, MP David, MK Iyengar, PR Parida, RR Schmidt, MD Schultz
US Patent 9,052,722, 2015
382015
Impact of operating conditions on a chiller-less data center test facility with liquid cooled servers
MP David, MK Iyengar, P Parida, RE Simons, M Schultz, M Gaynes, ...
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
362012
Improving data center energy efficiency with advanced thermal management
TJ Chainer, MD Schultz, PR Parida, MA Gaynes
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017
342017
Impingement-based high performance cooling configurations for automotive power converters
PR Parida, SV Ekkad, K Ngo
International Journal of Heat and Mass Transfer 55 (4), 834-847, 2012
322012
Experimental and numerical investigation of confined oblique impingement configurations for high heat flux applications
PR Parida, SV Ekkad, K Ngo
International journal of thermal sciences 50 (6), 1037-1050, 2011
302011
Embedded two-phase cooling of large 3D compatible chips with radial channels
M Schultz, F Yang, E Colgan, R Polastre, B Dang, C Tsang, M Gaynes, ...
International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015
282015
Solidification of a semitransparent planar layer subjected to radiative and convective cooling
PR Parida, R Raj, A Prasad, SC Mishra
Journal of Quantitative Spectroscopy and Radiative Transfer 107 (2), 226-235, 2007
272007
Experimental investigation of water cooled server microprocessors and memory devices in an energy efficient chiller-less data center
PR Parida, M David, M Iyengar, M Schultz, M Gaynes, V Kamath, ...
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012
252012
Extreme energy efficiency using water cooled servers inside a chiller-less data center
M Iyengar, M David, P Parida, V Kamath, B Kochuparambil, D Graybill, ...
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
232012
Embedded two-phase cooling of large three-dimensional compatible chips with radial channels
M Schultz, F Yang, E Colgan, R Polastre, B Dang, C Tsang, M Gaynes, ...
Journal of Electronic Packaging 138 (2), 2016
222016
Coolant and ambient temperature control for chillerless liquid cooled data centers
TJ Chainer, MP David, MK Iyengar, PR Parida, RE Simons
US Patent 9,250,636, 2016
222016
Local measurements of flow boiling heat transfer on hot spots in 3D compatible radial microchannels
F Yang, M Schultz, P Parida, E Colgan, R Polastre, B Dang, C Tsang, ...
International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015
202015
Reduced order modeling for chip-embedded micro-channel flow boiling
PR Parida
International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015
172015
Validation study for VOF simulations of boiling in a microchannel
C Gorlé, H Lee, F Houshmand, M Asheghi, K Goodson, PR Parida
International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015
152015
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