Kong Boon Yeap
Kong Boon Yeap
Bestätigte E-Mail-Adresse bei globalfoundries.com
TitelZitiert vonJahr
Applying X-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias
LW Kong, JR Lloyd, KB Yeap, E Zschech, A Rudack, M Liehr, A Diebold
Journal of applied physics 110 (5), 053502, 2011
452011
Electromigration early failure void nucleation and growth phenomena in Cu and Cu (Mn) interconnects
M Hauschildt, C Hennesthal, G Talut, O Aubel, M Gall, KB Yeap, ...
Reliability Physics Symposium (IRPS), 2013 IEEE International, 2C. 1.1-2C. 1.6, 2013
362013
Determining interfacial properties of submicron low- films on Si substrate by using wedge indentation technique
KB Yeap, K Zeng, H Jiang, L Shen, D Chi
Journal of applied physics 101 (12), 123531, 2007
352007
Residual stress measurement in thin films at sub-micron scale using focused ion beam milling and imaging
X Song, KB Yeap, J Zhu, J Belnoue, M Sebastiani, E Bemporad, K Zeng, ...
Thin Solid Films 520 (6), 2073-2076, 2012
292012
Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies
KB Yeap, K Zeng, D Chi
Acta Materialia 56 (5), 977-984, 2008
282008
Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study
KB Yeap, E Zschech, UD Hangen, T Wyrobek, LW Kong, A Karmakar, ...
Journal of Materials Research 27 (1), 339-348, 2012
232012
Nanomechanical characterization of sputtered RuO2 thin film on silicon substrate for solid state electronic devices
J Zhu, KB Yeap, K Zeng, L Lu
Thin Solid Films 519 (6), 1914-1922, 2011
202011
The effect of oxidation on the corrosion resistance and mechanical properties of a Zr-based metallic glass
XP Nie, XH Yang, LY Chen, KB Yeap, KY Zeng, D Li, JS Pan, XD Wang, ...
Corrosion Science 53 (11), 3557-3565, 2011
182011
Residual stress measurement in thin films using the semi-destructive ring-core drilling method using Focused Ion Beam
X Song, KB Yeap, J Zhu, J Belnoue, M Sebastiani, E Bemporad, KY Zeng, ...
Procedia Engineering 10, 2190-2195, 2011
182011
In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
K Boon Yeap, M Gall, Z Liao, C Sander, U Muehle, P Justison, O Aubel, ...
Journal of Applied Physics 115 (12), 124101, 2014
152014
Finite element simulation and experimental determination of interfacial adhesion properties by wedge indentation
L Chen, KB Yeap, KY Zeng, GR Liu
Philosophical Magazine 89 (17), 1395-1413, 2009
142009
Charge transport model to predict intrinsic reliability for dielectric materials
SP Ogden, J Borja, JL Plawsky, TM Lu, KB Yeap, WN Gill
Journal of Applied Physics 118 (12), 124102, 2015
122015
Copper anisotropy effects in three-dimensional integrated circuits using through-silicon vias
AP Karmarkar, X Xu, KB Yeap, E Zschech
IEEE Transactions on Device and Materials Reliability 12 (2), 225-232, 2012
122012
Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods
M Kopycinska-Müller, KB Yeap, S Mahajan, B Köhler, N Kuzeyeva, ...
Nanotechnology 24 (35), 355703, 2013
102013
A 7nm CMOS technology platform for mobile and high performance compute application
S Narasimha, B Jagannathan, A Ogino, D Jaeger, B Greene, C Sheraw, ...
Electron Devices Meeting (IEDM), 2017 IEEE International, 29.5. 1-29.5. 4, 2017
92017
Electromigration void nucleation and growth analysis using large-scale early failure statistics
M Hauschildt, M Gall, C Hennesthal, G Talut, O Aubel, KB Yeap, ...
AIP Conference Proceedings 1601 (1), 89-98, 2014
92014
Nanoindentation for reliability assessment of ULK films and interconnects structures
KB Yeap, F Iacopi, H Geisler, U Hangen, E Zschech
Microelectronic Engineering 106, 182-187, 2013
92013
Nanometer deformation of elastically anisotropic materials studied by nanoindentation
KB Yeap, M Kopycinska-Müller, UD Hangen, C Zambaldi, R Hübner, ...
Philosophical Magazine 92 (25-27), 3142-3157, 2012
92012
Thermal oxidation effect on corrosion behavior of Zr46Cu37. 6Ag8. 4Al8 bulk metallic glass
XP Nie, XH Yang, Y Ma, LY Chen, KB Yeap, KY Zeng, D Li, JS Pan, ...
Intermetallics 22, 84-91, 2012
92012
A Realistic Method for Time-Dependent Dielectric Breakdown Reliability Analysis for Advanced Technology Node
KB Yeap, F Chen, HW Yao, T Shen, SF Yap, P Justison
IEEE Transactions on Electron Devices 63 (2), 755-759, 2016
82016
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