Kong Boon Yeap
Kong Boon Yeap
Verified email at globalfoundries.com
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Applying X-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias
LW Kong, JR Lloyd, KB Yeap, E Zschech, A Rudack, M Liehr, A Diebold
Journal of applied physics 110 (5), 053502, 2011
Electromigration early failure void nucleation and growth phenomena in Cu and Cu (Mn) interconnects
M Hauschildt, C Hennesthal, G Talut, O Aubel, M Gall, KB Yeap, ...
2013 IEEE International Reliability Physics Symposium (IRPS), 2C. 1.1-2C. 1.6, 2013
A 7nm CMOS technology platform for mobile and high performance compute application
S Narasimha, B Jagannathan, A Ogino, D Jaeger, B Greene, C Sheraw, ...
2017 IEEE International Electron Devices Meeting (IEDM), 29.5. 1-29.5. 4, 2017
Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging
X Song, KB Yeap, J Zhu, J Belnoue, M Sebastiani, E Bemporad, K Zeng, ...
Thin Solid Films 520 (6), 2073-2076, 2012
Determining interfacial properties of submicron low- films on Si substrate by using wedge indentation technique
KB Yeap, K Zeng, H Jiang, L Shen, D Chi
Journal of applied physics 101 (12), 123531, 2007
The effect of oxidation on the corrosion resistance and mechanical properties of a Zr-based metallic glass
XP Nie, XH Yang, LY Chen, KB Yeap, KY Zeng, D Li, JS Pan, XD Wang, ...
Corrosion science 53 (11), 3557-3565, 2011
Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies
KB Yeap, K Zeng, D Chi
Acta materialia 56 (5), 977-984, 2008
Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study
KB Yeap, E Zschech, UD Hangen, T Wyrobek, LW Kong, A Karmakar, ...
Journal of Materials Research 27 (1), 339-348, 2012
Nanomechanical characterization of sputtered RuO2 thin film on silicon substrate for solid state electronic devices
J Zhu, KB Yeap, K Zeng, L Lu
Thin Solid Films 519 (6), 1914-1922, 2011
Residual stress measurement in thin films using the semi-destructive ring-core drilling method using Focused Ion Beam
X Song, KB Yeap, J Zhu, J Belnoue, M Sebastiani, E Bemporad, KY Zeng, ...
Procedia Engineering 10, 2190-2195, 2011
In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms
K Boon Yeap, M Gall, Z Liao, C Sander, U Muehle, P Justison, O Aubel, ...
Journal of Applied Physics 115 (12), 124101, 2014
Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy
M Kopycinska-Müller, A Clausner, KB Yeap, B Köhler, N Kuzeyeva, ...
Ultramicroscopy 162, 82-90, 2016
Charge transport model to predict intrinsic reliability for dielectric materials
SP Ogden, J Borja, JL Plawsky, TM Lu, KB Yeap, WN Gill
Journal of Applied Physics 118 (12), 124102, 2015
Effect of metal line width on electromigration of BEOL Cu interconnects
S Choi, C Christiansen, L Cao, J Zhang, R Filippi, T Shen, KB Yeap, ...
2018 IEEE International Reliability Physics Symposium (IRPS), 4F. 4-1-4F. 4-6, 2018
Copper anisotropy effects in three-dimensional integrated circuits using through-silicon vias
AP Karmarkar, X Xu, KB Yeap, E Zschech
IEEE Transactions on Device and Materials Reliability 12 (2), 225-232, 2012
Testing the limits of TaN barrier scaling
C Witt, KB Yeap, A Leśniewska, D Wan, N Jordan, I Ciofi, C Wu, Z Tokei
2018 IEEE International Interconnect Technology Conference (IITC), 54-56, 2018
A Realistic Method for Time-Dependent Dielectric Breakdown Reliability Analysis for Advanced Technology Node
KB Yeap, F Chen, HW Yao, T Shen, SF Yap, P Justison
IEEE Transactions on Electron Devices 63 (2), 755-759, 2016
Thermal oxidation effect on corrosion behavior of Zr46Cu37. 6Ag8. 4Al8 bulk metallic glass
XP Nie, XH Yang, Y Ma, LY Chen, KB Yeap, KY Zeng, D Li, JS Pan, ...
Intermetallics 22, 84-91, 2012
Finite element simulation and experimental determination of interfacial adhesion properties by wedge indentation
L Chen, KB Yeap, KY Zeng, GR Liu
Philosophical Magazine 89 (17), 1395-1413, 2009
Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods
M Kopycinska-Müller, KB Yeap, S Mahajan, B Köhler, N Kuzeyeva, ...
Nanotechnology 24 (35), 355703, 2013
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