| Radiofrequency endovenous ClosureFAST versus laser ablation for the treatment of great saphenous reflux: a multicenter, single-blinded, randomized study (RECOVERY study) JI Almeida, J Kaufman, O Göckeritz, P Chopra, MT Evans, DF Hoheim, ... Journal of Vascular and Interventional Radiology 20 (6), 752-759, 2009 | 395 | 2009 |
| Crystallographic and morphological characterization of reactively sputtered Ta, TaN and TaNO thin films M Stavrev, D Fischer, C Wenzel, K Drescher, N Mattern Thin Solid Films 307 (1-2), 79-88, 1997 | 200 | 1997 |
| Three-year European follow-up of endovenous radiofrequency-powered segmental thermal ablation of the great saphenous vein with or without treatment of calf varicosities TM Proebstle, J Alm, O Göckeritz, C Wenzel, T Noppeney, C Lebard, ... Journal of vascular surgery 54 (1), 146-152, 2011 | 184 | 2011 |
| PET/MRI in head and neck cancer: initial experience I Platzek, B Beuthien-Baumann, M Schneider, V Gudziol, J Langner, ... European journal of nuclear medicine and molecular imaging 40, 6-11, 2013 | 162* | 2013 |
| Five-year results from the prospective European multicentre cohort study on radiofrequency segmental thermal ablation for incompetent great saphenous veins TM Proebstle, BJ Alm, O Göckeritz, C Wenzel, T Noppeney, C Lebard, ... Journal of British Surgery 102 (3), 212-218, 2015 | 149 | 2015 |
| Behavior of thin Ta-based films in the Cu/barrier/Si system M Stavrev, D Fischer, F Praessler, C Wenzel, K Drescher Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 17 (3 …, 1999 | 102 | 1999 |
| Sputtering of tantalum-based diffusion barriers in SiCu metallization: effects of gas pressure and composition M Stavrev, C Wenzel, A Möller, K Drescher Applied surface science 91 (1-4), 257-262, 1995 | 71 | 1995 |
| Study of Ta–Si–N thin films for use as barrier layer in copper metallizations D Fischer, T Scherg, JG Bauer, HJ Schulze, C Wenzel Microelectronic Engineering 50 (1-4), 459-464, 2000 | 62 | 2000 |
| Fabrication of a 3D differential-capacitive acceleration sensor by UV-LIGA W Qu, C Wenzel, G Gerlach Sensors and Actuators A: Physical 77 (1), 14-20, 1999 | 59 | 1999 |
| Influence of N content on microstructure and thermal stability of Ta–N thin films for Cu interconnection M Hecker, D Fischer, V Hoffmann, HJ Engelmann, A Voss, N Mattern, ... Thin Solid Films 414 (2), 184-191, 2002 | 49 | 2002 |
| Optical and structural characteristics of Ga-doped ZnO films OA Novodvorsky, LS Gorbatenko, VY Panchenko, OD Khramova, ... Semiconductors 43, 419-424, 2009 | 42 | 2009 |
| Relationship between microstructure and electromigration damage in unpassivated PVD copper damascene interconnects TG Koetter, H Wendrock, H Schuehrer, C Wenzel, K Wetzig Microelectronics Reliability 40 (8-10), 1295-1299, 2000 | 42 | 2000 |
| Study of nanocrystalline Ta (N, O) diffusion barriers for use in Cu metallization M Stavrev, D Fischer, A Preuß, C Wenzel, N Mattern Microelectronic engineering 33 (1-4), 269-275, 1997 | 42 | 1997 |
| Focusing hard x rays beyond the critical angle of total reflection by adiabatically focusing lenses J Patommel, S Klare, R Hoppe, S Ritter, D Samberg, F Wittwer, A Jahn, ... Applied Physics Letters 110 (10), 2017 | 39 | 2017 |
| UV-LIGA: a promising and low-cost variant for microsystem technology W Qu, C Wenzel, A Jahn, D Zeidler 1998 Conference on Optoelectronic and Microelectronic Materials and Devices …, 1998 | 35 | 1998 |
| Electrical evaluation of Ru–W (-N), Ru–Ta (-N) and Ru–Mn films as Cu diffusion barriers H Wojcik, R Kaltofen, U Merkel, C Krien, S Strehle, J Gluch, M Knaut, ... Microelectronic engineering 92, 71-75, 2012 | 32 | 2012 |
| Improvement of sputtered Galfenol thin films for sensor applications B Adolphi, J McCord, M Bertram, CG Oertel, U Merkel, U Marschner, ... Smart materials and structures 19 (5), 055013, 2010 | 31 | 2010 |
| Physical characterization of PECVD and PEALD Ru (-C) films and comparison with PVD ruthenium film properties H Wojcik, M Junige, W Bartha, M Albert, V Neumann, U Merkel, A Peeva, ... Journal of The Electrochemical Society 159 (2), H166, 2011 | 24 | 2011 |
| One-mask procedure for the fabrication of movable high-aspect-ratio 3D microstructures W Qu, C Wenzel, A Jahn Journal of Micromechanics and Microengineering 8 (4), 279, 1998 | 24 | 1998 |
| Study of Ta (N, O) diffusion barrier stability: analytical and electrical characterization of low level Cu contamination in Si M Stavrev, D Fischer, C Wenzel, T Heiser Microelectronic Engineering 37, 245-251, 1997 | 24 | 1997 |
