| Wireless Surface Acoustic Wave Pressure and Temperature Sensor With Unique Identification Based on A Binder, G Bruckner, N Schobernig, D Schmitt IEEE Sensors Journal 13 (5), 1801-1805, 2013 | 60 | 2013 |
| Wireless SAW temperature sensor system for high-speed high-voltage motors A Binder, R Fachberger IEEE Sensors Journal 11 (4), 966-970, 2010 | 59 | 2010 |
| Exploiting the combination of 3D polymer printing and inkjet Ag-nanoparticle printing for advanced packaging M Krivec, A Roshanghias, A Abram, A Binder Microelectronic Engineering 176, 1-5, 2017 | 45 | 2017 |
| Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives MH Malik, G Grosso, H Zangl, A Binder, A Roshanghias Microelectronics Reliability 123, 114204, 2021 | 30 | 2021 |
| Internal combustion engine E Winklhofer, G Franz, G Kroupa, V Mannheim, A Binder US Patent 7,499,477, 2009 | 28 | 2009 |
| A comparative study on direct Cu–Cu bonding methodologies for copper pillar bumped flip-chips Y Ma, A Roshanghias, A Binder Journal of Materials Science: Materials in Electronics 29, 9347-9353, 2018 | 14 | 2018 |
| Automated Inspection System of Stent I Ibraheem, A Binder 4th European Conference of the International Federation for Medical and …, 2009 | 11 | 2009 |
| Packaging and antenna design for wireless SAW temperature sensors in metallic environments A Binder, R Fachberger, E Kaldjob, B Geck SENSORS, 2009 IEEE, 807-810, 2009 | 10 | 2009 |
| Die-level thinning for flip-chip integration on flexible substrates MH Malik, A Tsiamis, H Zangl, A Binder, S Mitra, A Roshanghias Electronics 11 (6), 849, 2022 | 9 | 2022 |
| Multilayer Pt/Al based ohmic contacts for AlGaN/GaN heterostructures stable up to 600° C ambient air N Goyal, S Dusari, J Bardong, F Medjdoub, A Kenda, A Binder Solid-State Electronics 116, 107-110, 2016 | 9 | 2016 |
| Design and characterisation of a combined pressure, temperature, ID sensor for harsh environment A Binder, J Bardong, G Bruckner 2014 IEEE International Ultrasonics Symposium, 1513-1516, 2014 | 9 | 2014 |
| Phase stability comparison of SAW sensor evaluation with various CW type radars A Binder, R Fachberger, M Lenzhofer Procedia Engineering 5, 661-664, 2010 | 9 | 2010 |
| Durability of SAW transponders for wireless sensing in harsh environments R Fachberger, G Bruckner, A Binder SENSORS, 2008 IEEE, 811-814, 2008 | 9 | 2008 |
| Glass frit jetting for advanced wafer-level hermetic packaging A Roshanghias, J Bardong, A Binder Materials 15 (8), 2786, 2022 | 8 | 2022 |
| Fast phase analysis of SAW delay lines C Gruber, A Binder, M Lenzhofer Internet of Things. IoT Infrastructures: Second International Summit, IoT …, 2016 | 8 | 2016 |
| Novel technology for handling very thin wafers A Binder, G Kroupa Solid State Technology 46 (10), 64-67, 2003 | 8 | 2003 |
| Passive SAW based RFID systems finding their way to harsh environment applications A Binder, G Bruckner, J Bardong Proceedings of the SENSORCOMM, 57-62, 2013 | 7 | 2013 |
| SAW-RFID and temperature monitoring of slide gate plates R Fachberger, A Binder, A Erlacher SENSORS, 2009 IEEE, 1514-1517, 2009 | 7 | 2009 |
| Digital micro-dispension of non-conductive adhesives (NCA) by inkjet printer A Roshanghias, M Krivec, A Binder 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-3, 2017 | 6 | 2017 |
| SAW delay lines as wireless sensors for industrial applications G Bruckner, J Bardong, A Binder, P Nicolay Proceedings of the VIII ECCOMAS Thematic Conference on Smart Structures and …, 2017 | 6 | 2017 |
