Follow
Minseok Ha
Title
Cited by
Cited by
Year
Development of a thermal resistance model for chip-on-board packaging of high power LED arrays
M Ha, S Graham
Microelectronics Reliability 52 (5), 836-844, 2012
1782012
Thermal management methods for compact high power LED arrays
A Christensen, M Ha, S Graham
Seventh International Conference on Solid State Lighting 6669, 192-210, 2007
612007
Pool boiling characteristics and critical heat flux mechanisms of microporous surfaces and enhancement through structural modification
M Ha, S Graham
Applied Physics Letters 111 (9), 2017
522017
Thermal analysis of high power LED arrays
MS Ha
Georgia Institute of Technology, 2009
382009
Pool boiling enhancement using vapor channels in microporous surfaces
M Ha, S Graham
International Journal of Heat and Mass Transfer 143, 118532, 2019
282019
Measuring the thermal resistance in light emitting diodes using a transient thermal analysis technique
S Natarajan, M Ha, S Graham
IEEE transactions on electron devices 60 (8), 2548-2555, 2013
162013
Pool boiling enhancement through hierarchical texturing of surfaces
M Ha, S Graham
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
132016
Thermal management of high density power servers using a compact two-phase loop cooling system
J Choi, M Ha, Y Lee, S Graham, H Kang
29th IEEE Semiconductor Thermal Measurement and Management Symposium, 29-32, 2013
92013
Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 2: Corrosion Reliability Testing and Failure Model
CU Kim, G Ni, G Kini, JY Chang, A Saha, A Antoniswamy, I Klein, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
72020
Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 1: Flow Loop Design for Reliability Tests
G Kini, CU Kim, H Madanipour, JY Chang, A Saha, A Antoniswamy, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
62020
Mechanical Texturing of Microporous Surfaces To Enhance Pool Boiling Heat Transfer
M Ha
Georgia Institute of Technology, 2018
22018
Evaporator for looped heat pipe system and method of manufacturing the same
JH Choi, YK Lee, MW Seo, MS HA
US Patent App. 13/768,244, 2014
12014
Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies
A Uppal, JY Chang, W Tang, M Ha
US Patent 11,664,294, 2023
2023
The system can't perform the operation now. Try again later.
Articles 1–13