| SEMATECH’s EUV program: a key enabler for EUVL introduction S Wurm, CU Jeon, M Lercel Emerging Lithographic Technologies XI 6517, 35-49, 2007 | 35 | 2007 |
| Manufacturability evaluation of model-based OPC masks SH Jang, SY Zinn, WT Ki, JH Choi, CU Jeon, SW Choi, HS Yoon, ... 22nd Annual BACUS Symposium on Photomask Technology 4889, 520-529, 2002 | 26 | 2002 |
| A fast path-based method for 3-D resist development simulation Q Dai, R Guo, SY Lee, J Choi, SH Lee, IK Shin, CU Jeon, BG Kim, ... Microelectronic engineering 127, 86-96, 2014 | 23 | 2014 |
| Photomasks and methods of manufacturing the same J Oh, D Kang, C Jeon, H Ko, SJ Han, J Kim US Patent 8,784,672, 2014 | 21 | 2014 |
| Inspection with the lasertec M7360 at the SEMATECH mask blank development center W Cho, PA Kearney, EM Gullikson, A Jia, T Tamura, A Tajima, ... Emerging Lithographic Technologies XI 6517, 121-128, 2007 | 20 | 2007 |
| Mask pattern recovery by level set method based inverse inspection technology (IIT) and its application on defect auto disposition JH Park, PDH Chung, CU Jeon, HK Cho, L Pang, D Peng, V Tolani, ... Photomask Technology 2009 7488, 82-92, 2009 | 18 | 2009 |
| Minimization of line edge roughness and critical dimension error in electron-beam lithography X Zhao, SY Lee, J Choi, SH Lee, IK Shin, CU Jeon Journal of Vacuum Science & Technology B 32 (6), 2014 | 14 | 2014 |
| Method of manufacturing EUVL alternating phase-shift mask S Huh, HB Kim, SW Choi, D Kim, C Jeon US Patent 7,601,467, 2009 | 13 | 2009 |
| Study of nanometer-thick graphite film for high-power EUVL pellicle MJ Kim, HC Jeon, R Chalykh, E Kim, J Na, BG Kim, H Kim, C Jeon, ... Extreme Ultraviolet (EUV) Lithography VII 9776, 577-586, 2016 | 12 | 2016 |
| Improving CD uniformity using MB-MDP for 14nm node and beyond BG Kim, J Choi, J Park, CU Jeon, S Watson, A Adamov, B Pack, I Bork Photomask Technology 2012 8522, 16-22, 2012 | 12 | 2012 |
| EUV mask blank defect inspection strategies for 32-nm half-pitch and beyond S Wurm, H Han, P Kearney, W Cho, CU Jeon, E Gullikson Photomask and Next-Generation Lithography Mask Technology XIV 6607, 898-906, 2007 | 12 | 2007 |
| Photomask, method of making a photomask and photolithography method and system using the same S Huh, H Kim, D Lee, C Jeon US Patent 7,629,087, 2009 | 11 | 2009 |
| Detectability and printability of EUVL mask blank defects for the 32-nm HP node W Cho, HS Han, KA Goldberg, PA Kearney, CU Jeon Photomask Technology 2007 6730, 373-381, 2007 | 11 | 2007 |
| Requirements of data technology for EUV photomask J Choi, J Doh, M Kim, CU Jeon Photomask Technology 2019 11148, 51-66, 2019 | 10 | 2019 |
| Printability and inspectability of defects on EUV blank for 2xnm hp HVM application S Huh, IY Kang, CY Jeong, J Na, DR Lee, H Seo, SS Kim, CU Jeon, J Doh, ... Extreme Ultraviolet (EUV) Lithography III 8322, 163-169, 2012 | 10 | 2012 |
| Thermal limitation of silicon EUV pellicle and possible improvements for mass production of EUV lithography S Kwon, Y Jung, H Jeon, J Kim, J Choi, BG Kim, CU Jeon Int. EUVL Symp, 2015 | 9 | 2015 |
| Determining the critical size of EUV mask substrate defects H Han, W Cho, KA Goldberg, EM Gullikson, CU Jeon, S Wurm Emerging Lithographic Technologies XII 6921, 596-603, 2008 | 9 | 2008 |
| Current status of EUV mask inspection using 193nm optical inspection system in 30nm node and beyond SH Han, J Na, W Cho, DH Chung, CU Jeon, HK Cho, D Bernstein, ... 27th European Mask and Lithography Conference 7985, 299-308, 2011 | 8 | 2011 |
| Practical approach to modeling e-beam lithographic process from SEM images for minimization of line edge roughness and critical dimension error R Guo, SY Lee, J Choi, SH Park, IK Shin, CU Jeon Journal of Vacuum Science & Technology B 34 (1), 2016 | 7 | 2016 |
| Development of high-transmittance phase-shifting mask for ArF immersion lithography W Ahn, HS Seo, JM Bang, JY Kim, JM Song, BH Seung, HB Kim, CU Jeon Photomask Japan 2015: Photomask and Next-Generation Lithography Mask …, 2015 | 7 | 2015 |
