| Disease detection in apple leaves using deep convolutional neural network P Bansal, R Kumar, S Kumar Agriculture 11 (7), 617, 2021 | 115 | 2021 |
| Knowledge-based neural networks for fast design space exploration of hybrid copper-graphene on-chip interconnect networks R Kumar, SSL Narayan, S Kumar, S Roy, BK Kaushik, R Achar, R Sharma IEEE Transactions on Electromagnetic Compatibility 64 (1), 182-195, 2021 | 27 | 2021 |
| Comparative Analysis of Prior Knowledge-Based Machine Learning Metamodels for Modeling Hybrid Copper–Graphene On-Chip Interconnects S Kushwaha, N Soleimani, F Treviso, R Kumar, R Trinchero, ... IEEE Transactions on Electromagnetic Compatibility, 1-12, 2022 | 13 | 2022 |
| High-speed interconnects: history, evolution, and the road ahead VR Kumbhare, R Kumar, MK Majumder, S Kumar, PP Paltani, BK Kaushik, ... IEEE Microwave Magazine 23 (8), 66-82, 2022 | 10 | 2022 |
| Analysis of parasitics on CMOS based memristor crossbar array for neuromorphic systems SA Thomas, SK Vohra, R Kumar, R Sharma, DM Das 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS …, 2021 | 10 | 2021 |
| Analysis of Parasitic Effects in a Crossbar in CMOS Based Neuromorphic System for Pattern Recognition Using Memristive Synapses SA Thomas, SK Vohra, R Kumar, R Sharma, DM Das IEEE Transactions on Nanotechnology 21, 380 - 389, 2022 | 8 | 2022 |
| Design, modeling and analysis of Cu-carbon hybrid interconnects B Kumari, R Kumar, R Sharma, M Sahoo IEEE Access 9, 113577-113584, 2021 | 8 | 2021 |
| A temperature and dielectric roughness-aware matrix rational approximation model for the reliability assessment of copper–graphene hybrid on-chip interconnects R Kumar, A Kumar, S Guglani, S Kumar, S Roy, BK Kaushik, R Sharma, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 8 | 2020 |
| Role of grain size on the effective resistivity of cu-graphene hybrid interconnects R Kumar, S Pathania, S Guglani, A Kumar, S Kumar, S Roy, BK Kaushik, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1620-1625, 2020 | 8 | 2020 |
| Exploring the Impact of Parametric Variability on Eye Diagram of On-Chip Multi-walled Carbon Nanotube Interconnects using Fast Machine Learning Techniques RS K M Dimple, Surila Guglani, Rahul Kumar, Sourajeet Roy, Suyash Kushwaha ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022 | 6 | 2022 |
| Temperature and Dielectric Surface Roughness dependent Performance Analysis of Cu-Graphene Hybrid Interconnects R Kumar, B Kumari, S Kumar, M Sahoo, R Sharma IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2021 | 6 | 2021 |
| A 60 db bulk-driven rail-to-rail input/output OTA A Shrivastava, AP Gangwar, R Kumar, R Dhiman 2016 IEEE International Symposium on Nanoelectronic and Information Systems …, 2016 | 5 | 2016 |
| Extrapolation with Range Determination of 2D Spectral Transposed Convolutional Neural Network for Advanced Packaging Problems Y Guo, X Jia, X Li, Y Wang, R Kumar, R Sharma, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 3 | 2023 |
| Performance Analysis of Self Heated Multilayer Vertical Graphene Nanoribbon Interconnects B Kumari, R Kumar, M Sahoo, R Sharma 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1614-1619, 2021 | 2 | 2021 |
| Estimating per-unit-length resistance parameter in emerging copper-graphene hybrid interconnects via prior knowledge based accelerated neural networks R Kumar, SSL Narayan, S Kumar, S Roy, BK Kaushik, R Achar, R Sharma 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 2 | 2020 |
| Thermal-Aware SoC Macro Placement and Multi-chip Module Design Optimization with Bayesian Optimization M Molter, R Kumar, S Koller, OW Bhatti, N Ambasana, E Rosenbaum, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 935-942, 2023 | 1 | 2023 |
| Temperature-aware compact modeling for resistivity in ultra-scaled Cu-graphene hybrid interconnects R Kumar, S Kumar, S Guglani, S Roy, BK Kaushik, R Sharma, R Achar 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI), 1-4, 2020 | 1 | 2020 |
| Temperature-aware closed-form matrix rational approximation model for crosstalk analysis of multi-walled carbon nanotube interconnects S Guglani, A Kumar, R Kumar, BK Kaushik, R Sharma, R Achar, S Roy 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2019 | 1 | 2019 |
| Batch Training of Gaussian Process for Up-sampling Problems in S-Parameter Predictions Y Guo, X Li, Y Wang, R Kumar, M Swaminathan 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging …, 2023 | | 2023 |
| Surrogate Modeling With Complex-Valued Neural Nets for Signal Integrity Applications O Akinwande, S Erdogan, R Kumar, M Swaminathan IEEE Transactions on Microwave Theory and Techniques, 2023 | | 2023 |
Rohit SharmaPenn State UniversityBestätigte E-Mail-Adresse bei psu.edu
