| Control of Junction Temperature and its Rate of Change at Thermal Boundaries via Precise Loss Manipulation TA Polom, B Wang, RD Lorenz IEEE Transactions on Industry Applications 53 (5), 4796-4806, 2017 | 56 | 2017 |
| Reviewing thermal-monitoring techniques for smart power modules S Kalker, LA Ruppert, CH van der Broeck, J Kuprat, M Andresen, ... IEEE Journal of Emerging and Selected Topics in Power Electronics 10 (2 …, 2021 | 49 | 2021 |
| Real-Time Monitoring of Thermal Response and Life-Time Varying Parameters in Power Modules CH van der Broeck, TA Polom, RD Lorenz, RW De Doncker IEEE Transactions on Industry Applications 56 (5), 5279-5291, 2020 | 40 | 2020 |
| In-situ Thermal Impedance Spectroscopy of Power Electronic Modules for Localized Degradation Identification CH van der Broeck, S Kalker, TA Polom, RD Lorenz, RW De Doncker PCIM Europe 2019; International Exhibition and Conference for Power …, 2019 | 27 | 2019 |
| Real-Time, In Situ Degradation Monitoring in Power Semiconductor Converters TA Polom, CH van der Broeck, RW De Doncker, RD Lorenz 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 2720-2727, 2019 | 26 | 2019 |
| Thermal Monitoring of Power Electronic Modules Using Device Self-Sensing CH van der Broeck, TA Polom, RD Lorenz, RW De Doncker 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4699-4706, 2018 | 23 | 2018 |
| Exploiting distinct thermal response properties for power semiconductor module health monitoring TA Polom, CH van der Broeck, RW De Doncker, RD Lorenz IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (4 …, 2020 | 19 | 2020 |
| Frequency Domain Electrothermal Impedance Spectroscopy of an Actively Switching Power Semiconductor Converter TA Polom, M Andresen, M Liserre, RD Lorenz IEEE Transactions on Industry Applications, 2019 | 18 | 2019 |
| Spatially-Varying Electrothermal Impedance Analysis for Designing Power Semiconductor Converter Systems TA Polom, CH van der Broeck, RW De Doncker, RD Lorenz IEEE Intersociety Conf. on Thermal and Thermomechanical Phenomena in …, 2019 | 16 | 2019 |
| Designing Power Module Health Monitoring Systems Based on Converter Load Profile TA Polom, CH van der Broeck, RW De Doncker, RD Lorenz IEEE Transactions on Industry Applications 56 (6), 6711-6721, 2020 | 13 | 2020 |
| Computational Heat Transfer Platform for Frequency Domain Reliability Design JA Free, TA Polom, RD Lorenz 2019 20th Workshop on Control and Modeling for Power Electronics (COMPEL), 1-7, 2019 | 10 | 2019 |
| Experimentally Extracting Multiple Spatial Thermal Models that Accurately Capture Slow and Fast Properties of Assembled Power Semiconductor Converter Systems TA Polom, M Andresen, M Liserre, RD Lorenz 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 7391-7398, 2018 | 10 | 2018 |
| Designing Power Modules for Degradation Sensing TA Polom, RD Lorenz, CH van der Broeck, RW De Doncker 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 3325-3332, 2019 | 9 | 2019 |
| Online Junction Temperature Monitoring of Power Semiconductor Devices Based on a Wheatstone Bridge N Fritz, M Friedel, RW De Doncker, TA Polom 2021 IEEE Energy Conversion Congress and Exposition (ECCE), 2740-2746, 2021 | 7 | 2021 |
| Diagnosing Power Module Degradation with High-Resolution, Data-Driven Methods CH van der Broeck, TA Polom, RW De Doncker 2021 IEEE Energy Conversion Congress and Exposition (ECCE), 3607-3614, 2021 | 7 | 2021 |
| Power device interface characterization with low-cost thermal system identification TA Polom, RD Lorenz IEEE Journal of Emerging and Selected Topics in Power Electronics 10 (2 …, 2021 | 6 | 2021 |
| Evaluating On-State Voltage and Junction Temperature Monitoring Concepts for Wide-Bandgap Semiconductor Devices N Fritz, T Kamp, TA Polom, M Friedel, RW De Doncker IEEE Transactions on Industry Applications 58 (6), 7550-7561, 2022 | 5 | 2022 |
| Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging A Roshanghias, P Malago, J Kaczynski, T Polom, J Bardong, D Holzmann, ... Energies 14 (8), 2176, 2021 | 5 | 2021 |
| ΔTj Control of Switching Power Devices at Thermal Boundaries via Physics-Based Loss Manipulation TA Polom, B Wang, RD Lorenz 2016 IEEE Energy Conversion Congress and Exposition (ECCE), 1-8, 2016 | 5 | 2016 |
| Expediting Transient Thermal Frequency Response Characterization and Sensitivity Analysis TA Polom, RD Lorenz 2020 IEEE Energy Conversion Congress and Exposition (ECCE), 3320-3327, 2020 | 4 | 2020 |
Rik De DonckerProfessor, RWTH Aachen UniversityVerified email at ieee.org
