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Tengfei Jiang
Tengfei Jiang
Assistant Professor of Materials Science and Engineering, University of Central Florida
Verified email at ucf.edu
Title
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Cited by
Year
Oxygen-activated growth and bandgap tunability of large single-crystal bilayer graphene
Y Hao, L Wang, Y Liu, H Chen, X Wang, C Tan, S Nie, JW Suk, T Jiang, ...
Nature nanotechnology 11 (5), 426-431, 2016
3132016
Effect of thermal stresses on carrier mobility and keep-out zone around through-silicon vias for 3-D integration
SK Ryu, KH Lu, T Jiang, JH Im, R Huang, PS Ho
IEEE Transactions on Device and Materials Reliability 12 (2), 255-262, 2012
1222012
Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique
SK Ryu, T Jiang, KH Lu, J Im, HY Son, KY Byun, R Huang, PS Ho
Applied Physics Letters 100 (4), 2012
1212012
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias
T Jiang, SK Ryu, Q Zhao, J Im, R Huang, PS Ho
Microelectronics Reliability 53 (1), 53-62, 2013
1172013
Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects
T Jiang, C Wu, L Spinella, J Im, N Tamura, M Kunz, HY Son, B Gyu Kim, ...
Applied Physics Letters 103 (21), 2013
762013
Through-silicon via stress characteristics and reliability impact on 3D integrated circuits
T Jiang, J Im, R Huang, PS Ho
Mrs Bulletin 40 (3), 248-256, 2015
692015
Quantitative microstructural imaging by scanning Laue x-ray micro-and nanodiffraction
X Chen, C Dejoie, T Jiang, CS Ku, N Tamura
MRS bulletin 41 (6), 445-453, 2016
472016
Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect
Y Wang, SH Chae, R Dunne, Y Takahashi, K Mawatari, P Steinmann, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 319-325, 2012
362012
Thermomechanical failure analysis of through-silicon via interface using a shear-lag model with cohesive zone
SK Ryu, T Jiang, J Im, PS Ho, R Huang
IEEE Transactions on Device and Materials Reliability 14 (1), 318-326, 2013
252013
Study of stresses and plasticity in through-silicon via structures for 3D interconnects by X-ray micro-beam diffraction
T Jiang, C Wu, N Tamura, M Kunz, BG Kim, HY Son, MS Suh, J Im, ...
IEEE Transactions on Device and Materials Reliability 14 (2), 698-703, 2014
182014
The interfacial reliability of through-glass vias for 2.5 D integrated circuits
O Ahmed, G Jalilvand, S Pollard, C Okoro, T Jiang
Microelectronics International 37 (4), 181-188, 2020
162020
Effect of wiring density and pillar structure on chip packaging interaction for mixed-signal Cu low k chips
W Chu, T Jiang, PS Ho
IEEE Transactions on Device and Materials Reliability 21 (3), 290-296, 2021
152021
Effect of scaling copper through-silicon vias on stress and reliability for 3D interconnects
L Spinella, M Park, J Im, P Ho, N Tamura, T Jiang
2016 IEEE International Interconnect Technology Conference/Advanced …, 2016
142016
The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study
O Ahmed, C Okoro, S Pollard, T Jiang
Multidiscipline Modeling in Materials and Structures 17 (2), 451-464, 2021
122021
Synchrotron X-ray microdiffraction investigation of scaling effects on reliability for through-silicon vias for 3-D integration
L Spinella, T Jiang, N Tamura, JH Im, PS Ho
IEEE Transactions on Device and Materials Reliability 19 (3), 568-571, 2019
112019
Second-harmonic microscopy of strain fields around through-silicon-vias
Y Cho, F Shafiei, BS Mendoza, M Lei, T Jiang, PS Ho, MC Downer
Applied Physics Letters 108 (15), 2016
102016
Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron X-ray microdiffraction
T Jiang, C Wu, P Su, X Liu, P Chia, L Li, HY Son, JS Oh, KY Byun, NS Kim, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 641-647, 2013
102013
The effective control of Cu through-silicon via extrusion for three-dimensional integrated circuits by a metallic cap layer
G Jalilvand, O Ahmed, L Spinella, L Zhou, T Jiang
Scripta Materialia 164, 101-104, 2019
92019
Study of the impact of pitch distance on the statistical variation of tsv protrusion and the underlying mechanisms
G Jalilvand, O Ahmed, N Dube, T Jiang
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1173-1179, 2020
82020
Die and package level thermal and thermal/moisture stresses in 3D packaging: Modeling and characterization
L Chen, T Jiang, X Fan
3D Microelectronic Packaging: From Fundamentals to Applications, 293-332, 2017
82017
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Articles 1–20