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Co-authors
- Shawn ChesterNJIT, MIT, LLNLVerified email at mit.edu
- Surya R. KalidindiGeorgia Institute of Technology, Atlanta, GAVerified email at me.gatech.edu
- Curt BronkhorstUniversity of Wisconsin - MadisonVerified email at wisc.edu
- Vikas SrivastavaHoward M. Reisman Assistant Professor of Engineering, Brown UniversityVerified email at brown.edu
- Claudio V. Di LeoGeorgia Institute of TechnologyVerified email at gatech.edu
- Alexander StaroselskyAssociate Director, Raytheon Technologies Research CenterVerified email at utrc.utc.com
- Suvrat P LeleVerified email at alum.mit.edu
- Yunwei MaoLoopro Inc., MIT, XJTUVerified email at loopro.ai
- Nicoli AmesConsultant, ExponentVerified email at exponent.com
- YuJie WeiProfessor of Mechanics of Materials, Chinese Academy of SciencesVerified email at lnm.imech.ac.cn
- David L. HenannJames R. Rice Associate Professor of Solid Mechanics, Brown UniversityVerified email at brown.edu
- Antonios ZavaliangosProfessor of Materials Science and EngineeringVerified email at coe.drexel.edu
- Stuart BrownManaging Principal, Veryst EngineeringVerified email at veryst.com
- Prakash ThamburajaProfessor, Department of Mechanical & Manufacturing Engineering, UKMVerified email at ukm.edu.my
- Eliot FriedProfessor, Okinawa Institute of Science and TechnologyVerified email at oist.jp
- Elisha RejovitzkyMITVerified email at mit.edu
- Brandon TalaminiLawrence Livermore National LaboratoryVerified email at llnl.gov
- Eric M. StewartGraduate Student, Massachusetts Institute of TechnologyVerified email at mit.edu
- Sanjay GovindjeeUniversity of California, BerkeleyVerified email at berkeley.edu
- Haowen LiuIntelVerified email at intel.com