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Vladimir Yussupov
Vladimir Yussupov
Verified email at iaas.uni-stuttgart.de - Homepage
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Year
Smart contract invocation protocol (SCIP): A protocol for the uniform integration of heterogeneous blockchain smart contracts
G Falazi, U Breitenbücher, F Daniel, A Lamparelli, F Leymann, ...
Advanced Information Systems Engineering: 32nd International Conference …, 2020
422020
Facing the unplanned migration of serverless applications: A study on portability problems, solutions, and dead ends
V Yussupov, U Breitenbücher, F Leymann, C Müller
Proceedings of the 12th IEEE/ACM International Conference on Utility and …, 2019
422019
A systematic mapping study on engineering function-as-a-service platforms and tools
V Yussupov, U Breitenbücher, F Leymann, M Wurster
Proceedings of the 12th IEEE/ACM International Conference on Utility and …, 2019
412019
Process-based composition of permissioned and permissionless blockchain smart contracts
G Falazi, M Hahn, U Breitenbücher, F Leymann, V Yussupov
2019 IEEE 23rd International Enterprise Distributed Object Computing …, 2019
412019
Modeling and automated deployment of serverless applications using tosca
M Wurster, U Breitenbücher, K Képes, F Leymann, V Yussupov
2018 IEEE 11th conference on service-oriented computing and applications …, 2018
392018
Faasten your decisions: A classification framework and technology review of function-as-a-service platforms
V Yussupov, J Soldani, U Breitenbücher, A Brogi, F Leymann
Journal of Systems and Software 175, 110906, 2021
302021
The EDMM modeling and transformation system
M Wurster, U Breitenbücher, A Brogi, G Falazi, L Harzenetter, F Leymann, ...
Service-Oriented Computing–ICSOC 2019 Workshops: WESOACS, ASOCA, ISYCC, TBCE …, 2020
282020
TOSCA Light: Bridging the Gap between the TOSCA Specification and Production-ready Deployment Technologies.
M Wurster, U Breitenbücher, L Harzenetter, F Leymann, J Soldani, ...
CLOSER, 216-226, 2020
272020
Pattern-based modelling, integration, and deployment of microservice architectures
V Yussupov, U Breitenbücher, C Krieger, F Leymann, J Soldani, ...
2020 IEEE 24th International Enterprise Distributed Object Computing …, 2020
252020
Toward a definition for serverless computing
S Kounev, C Abad, I Foster, N Herbst, A Iosup, S Al-Kiswany, AAE Hassan, ...
Schloss Dagstuhl--Leibniz-Zentrum fur Informatik, 2021
242021
Standards‐based modeling and deployment of serverless function orchestrations using BPMN and TOSCA
V Yussupov, J Soldani, U Breitenbücher, F Leymann
Software: Practice and Experience 52 (6), 1454-1495, 2022
142022
An Exploratory Study on the Challenges of Engineering Quantum Applications in the Cloud.
D Vietz, J Barzen, F Leymann, B Weder, V Yussupov
Q-SET@ QCE, 1-12, 2021
122021
SEAPORT: Assessing the Portability of Serverless Applications
V Yussupov, U Breitenbücher, A Kaplan, F Leymann
112020
Quokka: A service ecosystem for workflow-based execution of variational quantum algorithms
M Beisel, J Barzen, S Garhofer, F Leymann, F Truger, B Weder, ...
International Conference on Service-Oriented Computing, 369-373, 2022
102022
From Serverful to Serverless: A Spectrum of Patterns for Hosting Application Components.
V Yussupov, J Soldani, U Breitenbücher, A Brogi, F Leymann
CLOSER, 268-279, 2021
102021
Warm-starting and quantum computing: A systematic mapping study
F Truger, J Barzen, M Bechtold, M Beisel, F Leymann, A Mandl, ...
arXiv preprint arXiv:2303.06133, 2023
92023
Patterns for quantum error handling
M Beisel, J Barzen, F Leymann, F Truger, B Weder, V Yussupov
Proceedings of the 14th International Conference on Pervasive Patterns and …, 2022
92022
Selection and optimization of hyperparameters in warm-started quantum optimization for the MaxCut problem
F Truger, M Beisel, J Barzen, F Leymann, V Yussupov
Electronics 11 (7), 1033, 2022
92022
On the serverless nature of blockchains and smart contracts
V Yussupov, G Falazi, U Breitenbücher, F Leymann
arXiv preprint arXiv:2011.12729, 2020
92020
Configurable readout error mitigation in quantum workflows
M Beisel, J Barzen, F Leymann, F Truger, B Weder, V Yussupov
Electronics 11 (19), 2983, 2022
82022
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