| Tailoring the thermal and mechanical properties of graphene film by structural engineering N Wang, MK Samani, H Li, L Dong, Z Zhang, P Su, S Chen, J Chen, ... Small 14 (29), 1801346, 2018 | 125 | 2018 |
| Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ... Journal of Physics D: Applied Physics 49 (26), 265501, 2016 | 47 | 2016 |
| Highly sensitive room temperature ammonia gas sensor using pristine graphene: The role of biocompatible stabilizer S Huang, LA Panes-Ruiz, A Croy, M Löffler, V Khavrus, V Bezugly, ... Carbon 173, 262-270, 2021 | 30 | 2021 |
| Development and characterization of graphene enhanced thermal conductive adhesives N Wang, N Logothetis, M Wei, S Huang, L Ye, J Liu 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6, 2016 | 11 | 2016 |
| A brief overview of atomic layer deposition and etching in the semiconductor processing G Yuan, N Wang, S Huang, J Liu 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 11 | 2016 |
| The effects of graphene-based films as heat spreaders for thermal management in electronic packaging S Huang, J Bao, H Ye, N Wang, G Yuan, W Ke, D Zhang, W Yue, Y Fu, ... 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 10 | 2016 |
| Graphene based heat spreader for high power chip cooling using flip-chip technology S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 347-352, 2013 | 10 | 2013 |
| Characterization for graphene as heat spreader using thermal imaging method S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu 2013 14th International Conference on Electronic Packaging Technology, 403-408, 2013 | 10 | 2013 |
| Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles Q Zhang, A Zehri, J Liu, W Ke, S Huang, MG Latorre, N Wang, X Lu, ... Soldering & Surface Mount Technology, 2019 | 9 | 2019 |
| Infrared emissivity measurement for vertically aligned multiwall carbon nanotubes (CNTs) based heat spreader applied in high power electronics packaging JKLJ shirong huang, ning wang, Bao J, Ye H, Zhang D, Yue W, Fu Y, Ye L Electronic System-Integration Technology Conf. (ESTC), 1–4, 2016 | 9 | 2016 |
| Stabilization of Aqueous Graphene Dispersions Utilizing A Biocompatible Dispersant: A Molecular Dynamics Study S Huang, A Croy, V Bezugly, G Cuniberti Physical Chemistry Chemical Physics, 2019 | 7 | 2019 |
| An overview of carbon nanotubes based interconnects for microelectronic packaging S Chen, B Shan, Y Yang, G Yuan, S Huang, X Lu, Y Zhang, Y Fu, L Ye, ... 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 113-119, 2017 | 7 | 2017 |
| Enhanced cold wall CVD reactor growth of horizontally aligned single-walled carbon nanotubes W Mu, EH Kwak, B Chen, S Huang, M Edwards, Y Fu, K Jeppson, K Teo, ... Electronic Materials Letters 12, 329-337, 2016 | 6 | 2016 |
| Machine learning‐enabled smart gas sensing platform for identification of industrial gases S Huang, A Croy, LA Panes-Ruiz, V Khavrus, V Bezugly, B Ibarlucea, ... Advanced Intelligent Systems 4 (4), 2200016, 2022 | 5 | 2022 |
| Effect of sintering method on properties of nanosilver paste Q Zhang, J Liu, W Ke, S Huang, MG Latorre, N Wang, X Lu, L Ye, J Liu 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 186-189, 2017 | 5 | 2017 |
| 2D heat dissipation materials for microelectronics cooling applications Y Zhang, S Huang, N Wang, J Bao, S Sun, M Edwards, X Fu, W Yue, X Lu, ... 2016 China Semiconductor Technology International Conference (CSTIC), 1-4, 2016 | 4 | 2016 |
| Reliability of graphene-based films used for high power electronics packaging S Huang, Y Zhang, N Wang, N Wang, Y Fu, L Ye, J Liu 2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015 | 4 | 2015 |
| The influence of sintering process on thermal properties of nano-silver paste X Lu, W Ke, C Zhou, Y Wu, Q Zhang, S Huang, W Xia, L Ye, A Zehri, J Liu 2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018 | 3 | 2018 |
| Application of two-dimensional layered hexagonal boron nitride in chip cooling JL Jie Bao, Yong Zhang, Shirong Huang, Shuangxi Sun, Xiuzhen Lu, Yifeng Fu JOURNAL OF BASIC SCIENCE AND ENGINEERING 24 (1), 8, 2016 | 3* | 2016 |
| Toward Smart Sensing by MXene Y Li, S Huang, S Peng, H Jia, J Pang, B Ibarlucea, C Hou, Y Cao, W Zhou, ... Small, 2206126, 2022 | 2 | 2022 |
Johan LiuProfessor, Chalmers University of TechnologyVerified email at chalmers.se
