| Tailoring the thermal and mechanical properties of graphene film by structural engineering N Wang, MK Samani, H Li, L Dong, Z Zhang, P Su, S Chen, J Chen, ... Small 14 (29), 1801346, 2018 | 73 | 2018 |
| Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ... Journal of Physics D: Applied Physics 49 (26), 265501, 2016 | 36 | 2016 |
| A brief overview of atomic layer deposition and etching in the semiconductor processing G Yuan, N Wang, S Huang, J Liu 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 10 | 2016 |
| Development and characterization of graphene-enhanced thermal conductive adhesives M Casa, S Huang, P Ciambelli, N Wang, L Ye, J Liu 2014 15th International Conference on Electronic Packaging Technology, 480-483, 2014 | 10 | 2014 |
| Characterization for graphene as heat spreader using thermal imaging method S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu 2013 14th International Conference on Electronic Packaging Technology, 403-408, 2013 | 9 | 2013 |
| Infrared emissivity measurement for vertically aligned multiwall carbon nanotubes (CNTs) based heat spreader applied in high power electronics packaging JKLJ shirong huang, ning wang, Bao J, Ye H, Zhang D, Yue W, Fu Y, Ye L Electronic System-Integration Technology Conf. (ESTC), 1–4, 2016 | 8 | 2016 |
| Graphene based heat spreader for high power chip cooling using flip-chip technology S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 347-352, 2013 | 6 | 2013 |
| Effect of sintering method on properties of nanosilver paste Q Zhang, J Liu, W Ke, S Huang, MG Latorre, N Wang, X Lu, L Ye, J Liu 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 186-189, 2017 | 5 | 2017 |
| The effects of graphene-based films as heat spreaders for thermal management in electronic packaging S Huang, J Bao, H Ye, N Wang, G Yuan, W Ke, D Zhang, W Yue, Y Fu, ... 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 5 | 2016 |
| Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles Q Zhang, A Zehri, J Liu, W Ke, S Huang, MG Latorre, N Wang, X Lu, ... Soldering & Surface Mount Technology, 2019 | 4 | 2019 |
| Enhanced cold wall CVD reactor growth of horizontally aligned single-walled carbon nanotubes W Mu, EH Kwak, B Chen, S Huang, M Edwards, Y Fu, K Jeppson, K Teo, ... Electronic Materials Letters 12 (3), 329-337, 2016 | 4 | 2016 |
| 2D heat dissipation materials for microelectronics cooling applications Y Zhang, S Huang, N Wang, J Bao, S Sun, M Edwards, X Fu, W Yue, X Lu, ... 2016 China Semiconductor Technology International Conference (CSTIC), 1-4, 2016 | 4 | 2016 |
| Stabilization of Aqueous Graphene Dispersions Utilizing A Biocompatible Dispersant: A Molecular Dynamics Study S Huang, A Croy, V Bezugly, G Cuniberti Physical Chemistry Chemical Physics, 2019 | 3 | 2019 |
| An overview of carbon nanotubes based interconnects for microelectronic packaging S Chen, B Shan, Y Yang, G Yuan, S Huang, X Lu, Y Zhang, Y Fu, L Ye, ... 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 113-119, 2017 | 3 | 2017 |
| Reliability of graphene-based films used for high power electronics packaging S Huang, Y Zhang, N Wang, N Wang, Y Fu, L Ye, J Liu 2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015 | 3 | 2015 |
| Large-area free-standing and ultrathin graphene films with superior thermal conductivity W Nan, MK Samani, H Li, L Dong, Z Zhang, P Su, S Chen, J Chen, ... Small, 2018 | 2 | 2018 |
| Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging Y Yang, H Ye, W Ke, S Huang, N Wang, X Lu, J Bao, L Ye, J Liu 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 125-128, 2017 | 2 | 2017 |
| Development and characterization of graphene enhanced thermal conductive adhesives N Wang, N Logothetis, M Wei, S Huang, L Ye, J Liu 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6, 2016 | 2 | 2016 |
| Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders K Jeppson, J Bao, S Huang, Y Zhang, S Sun, Y Fu, J Liu 2016 International Conference on Microelectronic Test Structures (ICMTS), 32-36, 2016 | 2 | 2016 |
| Preventing aging of electrically conductive adhesives on metal substrate using graphene based barrier H Ye, S Huang, Z Yuan, X Lu, K Jeppson, L Ye, J Liu 2016 China Semiconductor Technology International Conference (CSTIC), 1-5, 2016 | 2 | 2016 |
Johan LiuProfessor, Chalmers University of TechnologyVerified email at chalmers.se
