Follow
Shirong Huang
Shirong Huang
TU Dresden, Germany
Verified email at tu-dresden.de - Homepage
Title
Cited by
Cited by
Year
Tailoring the thermal and mechanical properties of graphene film by structural engineering
N Wang, MK Samani, H Li, L Dong, Z Zhang, P Su, S Chen, J Chen, ...
Small 14 (29), 1801346, 2018
1252018
Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging
J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ...
Journal of Physics D: Applied Physics 49 (26), 265501, 2016
472016
Highly sensitive room temperature ammonia gas sensor using pristine graphene: The role of biocompatible stabilizer
S Huang, LA Panes-Ruiz, A Croy, M Löffler, V Khavrus, V Bezugly, ...
Carbon 173, 262-270, 2021
302021
Development and characterization of graphene enhanced thermal conductive adhesives
N Wang, N Logothetis, M Wei, S Huang, L Ye, J Liu
2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6, 2016
112016
A brief overview of atomic layer deposition and etching in the semiconductor processing
G Yuan, N Wang, S Huang, J Liu
2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016
112016
The effects of graphene-based films as heat spreaders for thermal management in electronic packaging
S Huang, J Bao, H Ye, N Wang, G Yuan, W Ke, D Zhang, W Yue, Y Fu, ...
2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016
102016
Graphene based heat spreader for high power chip cooling using flip-chip technology
S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 347-352, 2013
102013
Characterization for graphene as heat spreader using thermal imaging method
S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu
2013 14th International Conference on Electronic Packaging Technology, 403-408, 2013
102013
Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
Q Zhang, A Zehri, J Liu, W Ke, S Huang, MG Latorre, N Wang, X Lu, ...
Soldering & Surface Mount Technology, 2019
92019
Infrared emissivity measurement for vertically aligned multiwall carbon nanotubes (CNTs) based heat spreader applied in high power electronics packaging
JKLJ shirong huang, ning wang, Bao J, Ye H, Zhang D, Yue W, Fu Y, Ye L
Electronic System-Integration Technology Conf. (ESTC), 1–4, 2016
92016
Stabilization of Aqueous Graphene Dispersions Utilizing A Biocompatible Dispersant: A Molecular Dynamics Study
S Huang, A Croy, V Bezugly, G Cuniberti
Physical Chemistry Chemical Physics, 2019
72019
An overview of carbon nanotubes based interconnects for microelectronic packaging
S Chen, B Shan, Y Yang, G Yuan, S Huang, X Lu, Y Zhang, Y Fu, L Ye, ...
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 113-119, 2017
72017
Enhanced cold wall CVD reactor growth of horizontally aligned single-walled carbon nanotubes
W Mu, EH Kwak, B Chen, S Huang, M Edwards, Y Fu, K Jeppson, K Teo, ...
Electronic Materials Letters 12, 329-337, 2016
62016
Machine learning‐enabled smart gas sensing platform for identification of industrial gases
S Huang, A Croy, LA Panes-Ruiz, V Khavrus, V Bezugly, B Ibarlucea, ...
Advanced Intelligent Systems 4 (4), 2200016, 2022
52022
Effect of sintering method on properties of nanosilver paste
Q Zhang, J Liu, W Ke, S Huang, MG Latorre, N Wang, X Lu, L Ye, J Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 186-189, 2017
52017
2D heat dissipation materials for microelectronics cooling applications
Y Zhang, S Huang, N Wang, J Bao, S Sun, M Edwards, X Fu, W Yue, X Lu, ...
2016 China Semiconductor Technology International Conference (CSTIC), 1-4, 2016
42016
Reliability of graphene-based films used for high power electronics packaging
S Huang, Y Zhang, N Wang, N Wang, Y Fu, L Ye, J Liu
2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015
42015
The influence of sintering process on thermal properties of nano-silver paste
X Lu, W Ke, C Zhou, Y Wu, Q Zhang, S Huang, W Xia, L Ye, A Zehri, J Liu
2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018
32018
Application of two-dimensional layered hexagonal boron nitride in chip cooling
JL Jie Bao, Yong Zhang, Shirong Huang, Shuangxi Sun, Xiuzhen Lu, Yifeng Fu
JOURNAL OF BASIC SCIENCE AND ENGINEERING 24 (1), 8, 2016
3*2016
Toward Smart Sensing by MXene
Y Li, S Huang, S Peng, H Jia, J Pang, B Ibarlucea, C Hou, Y Cao, W Zhou, ...
Small, 2206126, 2022
22022
The system can't perform the operation now. Try again later.
Articles 1–20