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Co-authors
- Jihui YangKyocera Professor of Materials Science and Engineering, University of WashingtonVerified email at uw.edu
- Wenjie XieTechnische Universität DarmstadtVerified email at mr.tu-darmstadt.de
- Jiong YangShanghai UniversityVerified email at t.shu.edu.cn
- Lihua WuApplied Materials, Inc.Verified email at amat.com
- Gangjian Tan (谭刚健)Wuhan University of TechnologyVerified email at whut.edu.cn
- Ping WeiWuhan University of TechnologyVerified email at whut.edu.cn
- Yun LiMicrosoftVerified email at microsoft.com
- Jun LiuPacific Northwest National LaboratoryVerified email at uw.edu
- Jian HeClemson UniversityVerified email at clemson.edu
- Song ZhuClemson University/CGG CompanyVerified email at clemson.edu
- Terry TrittProfessor of Physics, Clemson UniversityVerified email at g.clemson.edu
- Ctirad UherC. Wilbur Peters Collegiate Professor of Physics, University of MichiganVerified email at umich.edu
- Mengyu YanWuhan University of TechnologyVerified email at whut.edu.cn
- Karl MuellerPacific Northwest National LaboratoryVerified email at pnnl.gov
- Ying ChenPacific Northwest National LaboratoryVerified email at pnnl.gov
- Jie XiaoPacific Northwest national laboratoryVerified email at pnnl.gov
- Xu XuWuhan University of Technology; University of California, Los AngelesVerified email at chem.ucla.edu
- Liqiang MaiProfessor of Materials Science, Wuhan University of TechnologyVerified email at whut.edu.cn
- Qiulong WeiXiamen University, University of California Los AngelesVerified email at xmu.edu.cn
- Kangning ZhaoGreat Bay University, Wuhan University of Technology, UW-Madison, EPFLVerified email at epfl.ch
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Shanyu Wang (王善禹)
Keysight Technologies, University of Washington, Wuhan University of Technology
Verified email at uw.edu