| Design, modeling and analysis of Cu-carbon hybrid interconnects B Kumari, R Kumar, R Sharma, M Sahoo IEEE Access 9, 113577-113584, 2021 | 8 | 2021 |
| Temperature and dielectric surface roughness dependent performance analysis of Cu-graphene hybrid interconnects R Kumar, B Kumari, S Kumar, M Sahoo, R Sharma 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 6 | 2020 |
| Performance and signal integrity analysis of intercalation‐doped MLVGNR interconnects B Kumari, M Sahoo IET Circuits, Devices & Systems 14 (2), 192-199, 2020 | 5 | 2020 |
| Stability analysis of nanoscale copper-carbon hybrid interconnects B Kumari, R Sharma, M Sahoo 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 972-976, 2022 | 4 | 2022 |
| Electro-thermal modeling and reliability analysis of Cu–carbon hybrid interconnects for beyond-CMOS computing B Kumari, R Sharma, M Sahoo Applied Physics Letters 121 (10), 2022 | 3 | 2022 |
| Thermal-aware modeling and analysis of Cu-Mixed CNT nanocomposite interconnects B Kumari, S Pandranki, R Sharma, M Sahoo IEEE Transactions on Nanotechnology 21, 163-171, 2022 | 3 | 2022 |
| Performance and reliability improvement in intercalated MLGNR interconnects using optimized aspect ratio B Kumari, R Sharma, M Sahoo Scientific Reports 12 (1), 1475, 2022 | 3 | 2022 |
| Stability analysis of multilayer vertical graphene nanoribbon interconnects B Kumari, M Sahoo Materials Research Express 6 (8), 085601, 2019 | 3 | 2019 |
| Performance analysis of self heated multilayer vertical graphene nanoribbon interconnects B Kumari, R Kumar, M Sahoo, R Sharma 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1614-1619, 2021 | 2 | 2021 |
| Width optimization of intercalation doped multilayer graphene nanoribbon interconnects B Kumari, M Sahoo 2018 International Symposium on Devices, Circuits and Systems (ISDCS), 1-5, 2018 | 2 | 2018 |
| An efficient algebraic codebook structure for CS-ACELP based speech codecs B Kumari, A Maurya, M Pattanaik, GK Sharma 2017 8th International Conference on Computing, Communication and Networking …, 2017 | 2 | 2017 |
| Electrothermal study of Cu-CNT composite TSV using COMSOL Multiphysics® K Sable, B Kumari, M Sahoo | 1 | 2019 |
| Thickness optimization for intercalation doped multilayer graphene nanoribbon interconnects B Kumari, M Sahoo 2018 4th International Conference on Devices, Circuits and Systems (ICDCS …, 2018 | 1 | 2018 |
| 7 Hybrid Cu-Carbon B Kumari, M Sahoo Nano-Interconnect Materials and Models for Next Generation Integrated …, 2023 | | 2023 |
| Performance and Power Optimization for Intercalation Doped Multilayer Graphene Nanoribbon Interconnects B Kumari, M Sahoo IETE Journal of Research 68 (1), 722-731, 2022 | | 2022 |
| Copper-MWCNT composite: a solution to breakdown in copper interconnects B Kumari, S Pandranki, M Sahoo, R Sharma 2021 IEEE 21st International Conference on Nanotechnology (NANO), 122-125, 2021 | | 2021 |
| Investigation on the Impact of Various Intercalation Doping on the Signal Integrity in ML-GNR Interconnects P Jha, B Kumari, M Sahoo 2018 10th International Conference on Communications, Circuits and Systems …, 2018 | | 2018 |
| Hybrid Cu-Carbon as Interconnect Materials and Their Interconnect Models B Kumari, M Sahoo Nano-Interconnect Materials and Models for Next Generation Integrated …, 0 | | |
| Electrical and electrothermal performance modeling and analysis of carbon based nanoscale interconnects B Kumari Dhanbad, 0 | | |
| Performance and Signal Integrity Analysis of Intercalation Doped Multilayer Vertical Graphene Nanoribbon Interconnects B Kumari, M Sahoo | | |
