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Inyeal LeeSamsung electronics, Foundry business, Logic Process Architecture IntegrationVerified email at skku.edu
Dongsuk Lim성균관대학교Verified email at skku.edu
Muhammad Atif KhanSungkyunkwan UniversityVerified email at skku.edu
Han-Ik JohKonkuk UniversityVerified email at konkuk.ac.kr
Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
Jeong Min BaikSungkyunkwan UniversityVerified email at skku.edu
E. S. KannanGrenoble High magnetic Field Lab, Sungkyunkwan University, BITS-PilaniVerified email at goa.bits-pilani.ac.in
Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
Dr. KUMUD RANJANNTU, SingaporeVerified email at e.ntu.edu.sg
A. VenkatesanSungkyunkwan UniversityVerified email at skku.edu
Nobuyuki AokiDepertment of Materials ScienceVerified email at faculty.chiba-u.jp
Young-Jun YuAssociate Professor, Department of Physics, Chungnam National UniversityVerified email at cnu.ac.kr
Philip KimHarvard UniversityVerified email at g.harvard.edu
Yogendra Kumar YadavProcess/integration modelling, Applied Materials BangaloreVerified email at iitb.ac.in
Kuldeep TakharMicron Technology Singapore, IIT BombayVerified email at iitb.ac.in
Sang-Woo KIMProfessor of Mater. Sci. Eng., YONSEI UNIVERSITYVerified email at yonsei.ac.kr
Cheol-Ho LeeLG ChemVerified email at kaist.ac.kr
Young Duck KimAssociate Professor, Department of Physics, Kyung Hee University, Seoul 02447, Republic of KoreaVerified email at khu.ac.kr
James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu