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- Inyeal LeeSamsung electronics, Foundry business, Logic Process Architecture IntegrationVerified email at skku.edu
- Dongsuk Lim성균관대학교Verified email at skku.edu
- Muhammad Atif KhanSungkyunkwan UniversityVerified email at skku.edu
- Han-Ik JohKonkuk UniversityVerified email at konkuk.ac.kr
- Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
- T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
- Jeong Min BaikSungkyunkwan UniversityVerified email at skku.edu
- E. S. KannanBITS PILANI K K BIRLA GOA CAMPUSVerified email at goa.bits-pilani.ac.in
- Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
- Dr. KUMUD RANJANNTU, SingaporeVerified email at e.ntu.edu.sg
- A. VenkatesanSungkyunkwan UniversityVerified email at skku.edu
- Nobuyuki AokiDepertment of Materials ScienceVerified email at faculty.chiba-u.jp
- Young-Jun YuAssociate Professor, Department of Physics, Chungnam National UniversityVerified email at cnu.ac.kr
- Philip KimHarvard UniversityVerified email at g.harvard.edu
- Kuldeep TakharMicron Technology Singapore, IIT BombayVerified email at iitb.ac.in
- Yogendra Kumar YadavProcess/integration modelling, Applied Materials BangaloreVerified email at iitb.ac.in
- Sang-Woo KIMProfessor of Mater. Sci. Eng., YONSEI UNIVERSITYVerified email at yonsei.ac.kr
- Cheol-Ho LeeLG ChemVerified email at kaist.ac.kr
- Young Duck KimAssociate Professor, Department of Physics, Kyung Hee University, Seoul 02447, Republic of KoreaVerified email at khu.ac.kr
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu