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Gurdaman khaira
Gurdaman khaira
University of Chicago, Mentor Graphics Corporation, Graphcore Inc., Siemens EDA
Bestätigte E-Mail-Adresse bei siemens.com
Titel
Zitiert von
Zitiert von
Jahr
Molecular pathways for defect annihilation in directed self-assembly
SM Hur, V Thapar, A Ramírez-Hernández, G Khaira, T Segal-Peretz, ...
Proceedings of the National Academy of Sciences 112 (46), 14144-14149, 2015
1162015
Simulation of defect reduction in block copolymer thin films by solvent annealing
SM Hur, GS Khaira, A Ramírez-Hernández, M Müller, PF Nealey, ...
ACS Macro Letters 4 (1), 11-15, 2015
932015
Evolutionary optimization of directed self-assembly of triblock copolymers on chemically patterned substrates
GS Khaira, J Qin, GP Garner, S Xiong, L Wan, R Ruiz, HM Jaeger, ...
ACS Macro Letters 3 (8), 747-752, 2014
832014
Turning statistical physics models into materials design engines
MZ Miskin, G Khaira, JJ de Pablo, HM Jaeger
Proceedings of the National Academy of Sciences 113 (1), 34-39, 2016
802016
Evolutionary pattern design for copolymer directed self-assembly
J Qin, GS Khaira, Y Su, GP Garner, M Miskin, HM Jaeger, JJ de Pablo
Soft Matter 9 (48), 11467-11472, 2013
712013
Quantitative three-dimensional characterization of block copolymer directed self-assembly on combined chemical and topographical prepatterned templates
T Segal-Peretz, J Ren, S Xiong, G Khaira, A Bowen, LE Ocola, R Divan, ...
ACS nano 11 (2), 1307-1319, 2017
512017
Derivation of multiple covarying material and process parameters using physics-based modeling of X-ray data
G Khaira, M Doxastakis, A Bowen, J Ren, HS Suh, T Segal-Peretz, ...
Macromolecules 50 (19), 7783-7793, 2017
352017
Physical verification and manufacturing of contact/via layers using grapho-epitaxy DSA processes
JA Torres, K Sakajiri, D Fryer, Y Granik, Y Ma, P Krasnova, G Fenger, ...
Design-Process-Technology Co-optimization for Manufacturability VIII 9053 …, 2014
202014
Optimizing self-consistent field theory block copolymer models with X-ray metrology
AF Hannon, DF Sunday, A Bowen, G Khaira, J Ren, PF Nealey, ...
Molecular systems design & engineering 3 (2), 376-389, 2018
152018
Probability prediction of EUV process failure due to resist-exposure stochastic: applications of Gaussian random fields excursions and Rice's formula
A Latypov, G Khaira, G Fenger, J Sturtevant, CI Wei, P De Bisschop
Extreme Ultraviolet (EUV) Lithography XI 11323, 140-164, 2020
132020
Gaussian random field EUV stochastic models, their generalizations and lithographically meaningful stochastic metrics
A Latypov, G Khaira, G Fenger, S Wang, M Chew, S Shang
Extreme Ultraviolet (EUV) Lithography XII 11609, 104-119, 2021
122021
Directed self assembly (DSA) compliant flow with immersion lithography: from material to design and patterning
Y Ma, Y Wang, J Word, J Lei, J Mitra, JA Torres, L Hong, G Fenger, ...
Alternative Lithographic Technologies VIII 9777, 117-127, 2016
122016
Scalable simulations for directed self-assembly patterning with the use of GPU parallel computing
K Yoshimoto, BL Peters, GS Khaira, JJ de Pablo
Alternative Lithographic Technologies IV 8323, 568-578, 2012
92012
A comprehensive evaluation of novel AI accelerators for deep learning workloads
M Emani, Z Xie, S Raskar, V Sastry, W Arnold, B Wilson, R Thakur, ...
2022 IEEE/ACM international workshop on performance modeling, benchmarking …, 2022
82022
Calibration and application of Gaussian random field models for exposure and resist stochastic in EUV lithography
CI Wei, A Latypov, P De Bisschop, G Khaira, G Fenger
Japanese Journal of Applied Physics 61 (SD), SD0806, 2022
62022
Better prediction on patterning failure mode with hotspot aware OPC modeling
CI Wei, S Wu, Y Deng, G Khaira, I Kusnadi, G Fenger, S Kang, Y Okamoto, ...
Metrology, Inspection, and Process Control for Semiconductor Manufacturing …, 2021
52021
Directed self-assembly compliant flow with immersion lithography: from material to design and patterning
Y Ma, Y Wang, J Word, J Lei, J Mitra, JA Torres, L Hong, G Fenger, ...
Journal of Micro/Nanolithography, MEMS, and MOEMS 15 (3), 031610-031610, 2016
52016
Method and system for calculating probability of success or failure for a lithographic process due to stochastic variations of the lithographic process
G Khaira, GL Fenger, A Latypov, JL Sturtevant, Y Granik
US Patent 11,061,373, 2021
42021
Design technology co-optimization (DTCO) study on self-aligned-Via (SAV) with lamella DSA for sub-7 nm technology
Y Ma, J Kye, GS Khaira, L Hong, J Word, Y Sun, J Mitra, JA Torres, ...
Design-Process-Technology Co-optimization for Manufacturability XI 10148, 74-85, 2017
42017
Optimizing directed self-assembled morphology
J Qin, GS Khaira, Y Su, GP Garner, M Miskin, HM Jaeger, JJ de Pablo
arXiv preprint arXiv:1308.0622, 2013
22013
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