Folgen
Norocel Codreanu
Norocel Codreanu
POLITEHNICA University of Bucharest
Bestätigte E-Mail-Adresse bei cetti.ro
Titel
Zitiert von
Zitiert von
Jahr
Modified split ring resonators sensor for accurate complex permittivity measurements of solid dielectrics
AA Al-Behadili, IA Mocanu, N Codreanu, M Pantazica
Sensors 20 (23), 6855, 2020
332020
Investigations on active balancing circuits for supercapacitor banks
C Ionescu, A Drumea, A Vasile, N Codreanu
2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-5, 2018
202018
Solar powered wireless multi-sensor device for an irrigation system
N Codreanu, G Varzaru, C Ionescu
Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014
202014
VPS solution for lead-free soldering in EMS industries
I Plotog, G Varzaru, C Turcu, TC Cucu, P Svasta, ND Codreanu
2008 2nd Electronics System-Integration Technology Conference, 121-124, 2008
202008
PCB tracks thermal simulation, analysis and comparison to IPC-2152 for electrical current carrying capacity
R Bunea, ND Codreanu, C Ionescu, P Svasta, A Vasile
3rd Electronics System Integration Technology Conference ESTC, 1-4, 2010
182010
Investigations on assembling of electronic packages onto glass substrates using lead-free technology
I Plotog, N Codreanu, P Svasta, T Cucu, C Turcu, G Varzaru, G Lazar, ...
2008 31st International Spring Seminar on Electronics Technology, 409-413, 2008
172008
Advanced investigations on PCB traces fusing in high power applications
ND Codreanu, R Bunea, P Svasta
2010 IEEE 16th International Symposium for Design and Technology in …, 2010
152010
Thermal investigation of a planar core power transformer
C Ropoteanu, ND Codreanu, C Ionescu
2016 39th International Spring Seminar on Electronics Technology (ISSE), 112-115, 2016
142016
1D and 2D solutions for traceability in an Electronic Manufacturing Services company
TC Cucu, G Varzaru, C Turcu, ND Codreanu, I Plotog, R Fuica
2008 31st international spring seminar on electronics technology, 585-588, 2008
142008
Electrical and thermal investigations on printed conductive paste used in Solderless Assembly for Electronics Technology
C Ionescu, ND Codreanu, G Vărzaru
2017 IEEE 23rd International Symposium for Design and Technology in …, 2017
132017
Investigation of solder joints by thermographical analysis
P Svasta, C Ionescu, ND Codreanu, D Bonfert
2009 European Microelectronics and Packaging Conference, 1-5, 2009
132009
New aspects in modeling and simulation of PCB/MCM vias
P Svasta, ND Codreanu, Z Illyefalvi-Vitéz, G Golumbeanu
The 12th IMAPS Europe Conference, 7-9, 1999
111999
Investigations on current capabilities of PEDOT: PSS conductors
C Ionescu, D Bonfert, ND Codreanu, P Svasta
2012 35th International Spring Seminar on Electronics Technology, 59-64, 2012
102012
Training microsystems technologies in an European eLearning environment
S Tzanova, N Codreanu
IEEE EDUCON 2010 Conference, 113-118, 2010
102010
Simulation of multichip module structures
P Svasta, ND Codreanu, C Ionescu, V Golumbeanu, I Cristea
EC-MCM 99, 1-2, 1999
101999
Lead-free electronic system integrated in a vapour phase soldering equipment prototype
ND Codreanu, P Svasta, I Plotog, I Oancea, G Varzaru, TC Cucu
2009 32nd International Spring Seminar on Electronics Technology, 1-5, 2009
92009
Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment
D Straubinger, B Illés, D Busek, N Codreanu, A Géczy
Case Studies in Thermal Engineering 33, 102001, 2022
82022
Modeling of heat dissipation in SMD chip components
R Bunea, P Svasta, ND Codreanu
Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011
82011
Thermal investigations on high power LEDs
C Ionescu, A Drumea, ND Codreanu, A Vasile
Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies …, 2012
72012
Multi-criterial approach for implementing of vapour phase soldering technology
I Plotog, G Varzaru, C Jianu, A Stan, C Turcu, TC Cucu, ND Codreanu
Conference proceedings, 231-235, 2007
72007
Das System kann den Vorgang jetzt nicht ausführen. Versuchen Sie es später erneut.
Artikel 1–20