| An ultrathin conformable vibration-responsive electronic skin for quantitative vocal recognition S Lee, J Kim, I Yun, GY Bae, D Kim, S Park, IM Yi, W Moon, Y Chung, ... Nature communications 10 (1), 2468, 2019 | 133 | 2019 |
| An 80 mV-swing single-ended duobinary transceiver with a TIA RX termination for the point-to-point DRAM interface SM Lee, IM Yi, HK Jung, H Lee, YJ Kim, YS Kim, B Kim, JY Sim, HJ Park IEEE Journal of Solid-State Circuits 49 (11), 2618-2630, 2014 | 34 | 2014 |
| A 4-GS/s 11.3-mW 7-bit time-based ADC with folding voltage-to-time converter and pipelined TDC in 65-nm CMOS IM Yi, N Miura, H Nosaka IEEE Journal of Solid-State Circuits 56 (2), 465-475, 2020 | 22 | 2020 |
| A time-based receiver with 2-tap decision feedback equalizer for single-ended mobile DRAM interface IM Yi, MK Chae, SH Hyun, SJ Bae, JH Choi, SJ Jang, B Kim, JY Sim, ... IEEE Journal of Solid-State Circuits 53 (1), 144-154, 2017 | 21 | 2017 |
| A 15.1-mW 6-GS/s 6-bit single-channel flash ADC with selectively activated 8× time-domain latch interpolation IM Yi, N Miura, H Fukuyama, H Nosaka IEEE Journal of Solid-State Circuits 56 (2), 455-464, 2020 | 18 | 2020 |
| A transmitter to compensate for crosstalk-induced jitter by subtracting a rectangular crosstalk waveform from data signal during the data transition time in coupled microstrip … HK Jung, IM Yi, SM Lee, JY Sim, HJ Park IEEE journal of solid-state circuits 47 (9), 2068-2079, 2012 | 16 | 2012 |
| A 40 mV-Differential-Channel-Swing Transceiver Using a RX Current-Integrating TIA and a TX Pre-Emphasis Equalizer With a CML Driver at 9 Gb/s IM Yi, SM Lee, SJ Bae, YS Sohn, JH Choi, SJ Jang, B Kim, JY Sim, ... IEEE Transactions on Circuits and Systems I: Regular Papers 63 (1), 122 - 133, 2016 | 13 | 2016 |
| A Single-Ended Parallel Transceiver With Four-Bit Four-Wire Four-Level Balanced Coding for the Point-to-Point DRAM Interface SM Lee, JH Lim, IM Yi, YJ Jang, HK Jung, K Kim, D Kwon, B Kim, JY Sim, ... Solid-State Circuits, IEEE Journal of 51 (8), 1890-1901, 2016 | 11 | 2016 |
| 23.7 A time-based receiver with 2-tap DFE for a 12Gb/s/pin single-ended transceiver of mobile DRAM interface in 0.8 V 65nm CMOS IM Yi, MK Chae, SH Hyun, SJ Bae, JH Choi, SJ Jang, B Kim, JY Sim, ... 2017 IEEE International Solid-State Circuits Conference (ISSCC), 400-401, 2017 | 10 | 2017 |
| A 38GS/s 7b Time-Interleaved Pipelined-SAR ADC with Speed-Enhanced Bootstrapped Switch in 22nm FinFET Y Zhu, T Liu, SK Kaile, S Kiran, IIM Yi, R Liu, JCG Diaz, S Hoyos, ... 2022 IEEE Custom Integrated Circuits Conference (CICC), 1-2, 2022 | 9 | 2022 |
| A 15.1-mW 6-GS/s 6-bit flash ADC with selectively activated 8× time-domain interpolation IM Yi, N Miura, H Fukuyama, H Nosaka 2018 IEEE Asian Solid-State Circuits Conference (A-SSCC), 239-242, 2018 | 8 | 2018 |
| A 40-mV-swing single-ended transceiver for TSV with a switched-diode RX termination IM Yi, SM Lee, SJ Bae, YS Sohn, JH Choi, B Kim, JY Sim, HJ Park IEEE Transactions on Circuits and Systems II: Express Briefs 61 (12), 987-991, 2014 | 8 | 2014 |
| A 3D integrated energy-efficient transceiver realized by direct bond interconnect of co-designed 12 nm FinFET and silicon photonic integrated circuits PH Chang, A Samanta, P Yan, M Fu, Y Zhang, MB On, A Kumar, H Kang, ... Journal of Lightwave Technology 41 (21), 6741-6755, 2023 | 6 | 2023 |
| A 38-GS/s 7-bit pipelined-SAR ADC with speed-enhanced bootstrapped switch and output level shifting technique in 22-nm FinFET Y Zhu, T Liu, SK Kaile, S Kiran, IM Yi, R Liu, JCG Diaz, S Hoyos, ... IEEE Journal of Solid-State Circuits, 2023 | 5 | 2023 |
| A jitter-robust 40Gb/s ADC-based multicarrier receiver front end in 22nm FinFET Y Zhu, JCG Diaz, SK Kaile, IIM Yi, T Liu, S Hoyos, S Palermo 2022 IEEE Custom Integrated Circuits Conference (CICC), 1-2, 2022 | 5 | 2022 |
| An on-chip TSV emulation using metal bar surrounded by metal ring to develop interface circuits IM Yi, SJ Bae, YS Sohn, JY Sim, HJ Park 2012 International SoC Design Conference (ISOCC), 192-195, 2012 | 5 | 2012 |
| A jitter-robust 40 Gb/s ADC-based multicarrier receiver front-end with 4-GS/s baseband pipeline-SAR ADCs in 22-nm FinFET Y Zhu, JCG Diaz, SK Kaile, IM Yi, T Liu, S Hoyos, S Palermo IEEE Journal of Solid-State Circuits 58 (3), 662-676, 2022 | 4 | 2022 |
| A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with-20.3 dBm OMA Sensitivity and 691fJ/bit A Samanta, PH Chang, P Yan, M Fu, M Berkay-On, A Kumar, H Kang, ... 2023 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2023 | 3 | 2023 |
| LLM: Realizing Low-Latency Memory by Exploiting Embedded Silicon Photonics for Irregular Workloads M Fariborz, M Samani, P Fotouhi, R Proietti, IM Yi, V Akella, ... International Conference on High Performance Computing, 44-64, 2022 | 3 | 2022 |
| Decision feedback equalizer IM Yi, N Miura, H Fukuyama, H Nosaka US Patent 11,336,491, 2022 | 3 | 2022 |
