|Functionalization mediates heat transport in graphene nanoflakes|
H Han, Y Zhang, N Wang, MK Samani, Y Ni, ZY Mijbil, M Edwards, ...
Nature Communications 7 (1), 1-9, 2016
|Improved heat spreading performance of functionalized graphene in microelectronic device application|
Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ...
Advanced Functional Materials 25 (28), 4430-4435, 2015
|Synthesis and applications of two-dimensional hexagonal boron nitride in electronics manufacturing|
J Bao, K Jeppson, M Edwards, Y Fu, L Ye, X Lu, J Liu
Electronic Materials Letters 12 (1), 1-16, 2016
|Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging|
J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ...
Journal of Physics D: Applied Physics 49 (26), 265501, 2016
|Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures|
N Wang, S Pandit, L Ye, M Edwards, V Mokkapati, M Murugesan, ...
Carbon 111, 402-410, 2017
|Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects|
S Sun, W Mu, M Edwards, D Mencarelli, L Pierantoni, Y Fu, K Jeppson, ...
Nanotechnology 27 (33), 335705, 2016
|Effect of bias conditions on pressure sensors based on AlGaN/GaN high electron mobility transistor|
ED Le Boulbar, MJ Edwards, S Vittoz, G Vanko, K Brinkfeldt, L Rufer, ...
Sensors and Actuators A: Physical 194, 247-251, 2013
|Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications|
Y Zhang, M Edwards, MK Samani, N Logothetis, L Ye, Y Fu, K Jeppson, ...
Carbon 106, 195-201, 2016
|Modelling wafer bow in silicon–polycrystalline CVD diamond substrates for GaN-based devices|
MJ Edwards, CR Bowen, DWE Allsopp, ACE Dent
Journal of Physics D: Applied Physics 43 (38), 385502, 2010
|Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor|
W Mu, Y Fu, S Sun, M Edwards, L Ye, K Jeppson, J Liu
Chemical Engineering Journal 304, 106-114, 2016
|Tape-assisted transfer of carbon nanotube bundles for through-silicon-via applications|
W Mu, S Sun, D Jiang, Y Fu, M Edwards, Y Zhang, K Jeppson, J Liu
Journal of Electronic Materials 44 (8), 2898-2907, 2015
|Flexible Multifunctionalized Carbon Nanotubes‐Based Hybrid Nanowires|
N Wang, D Jiang, L Ye, M Murugesan, M Edwards, Y Fu, J Liu
Advanced Functional Materials 25 (26), 4135-4143, 2015
|Mutiphysics study of RF/microwave planar devices: Effect of the input signal power|
MA Sánchez-Soriano, M Edwards, Y Quéré, D Andersson, S Cadiou, ...
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014
|Chemical vapor deposition grown graphene on Cu-Pt alloys|
Y Zhang, Y Fu, M Edwards, K Jeppson, L Ye, J Liu
Materials Letters 193, 255-258, 2017
|Embedded Fin‐Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors|
D Jiang, N Wang, M Edwards, W Mu, A Nylander, Y Fu, K Jeppson, J Liu
Small 12 (11), 1521-1526, 2016
|Pressure and temperature dependence of GaN/AlGaN high electron mobility transistor based sensors on a sapphire membrane|
MJ Edwards, ED Le Boulbar, S Vittoz, G Vanko, K Brinkfeldt, L Rufer, ...
physica status solidi c 9 (3‐4), 960-963, 2012
|Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation|
X Luo, J Peng, C Zandén, Y Yang, W Mu, M Edwards, L Ye, J Liu
Acta Materialia 104, 109-118, 2016
|The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modules|
M Edwards, K Brinkfeldt, U Rusche, T Bukes, G Gaiser, M Da Silva, ...
Microelectronics Reliability 55 (5), 722-732, 2015
|Substrates for semiconductor devices|
T Mollart, Q Jiang, MJ Edwards, D Allsopp, CR Bowen, WN Wang
US Patent 10,023,974, 2018
|Enhanced cold wall CVD reactor growth of horizontally aligned single-walled carbon nanotubes|
W Mu, EH Kwak, B Chen, S Huang, M Edwards, Y Fu, K Jeppson, K Teo, ...
Electronic Materials Letters 12 (3), 329-337, 2016