| Functionalization mediates heat transport in graphene nanoflakes H Han, Y Zhang, N Wang, MK Samani, Y Ni, ZY Mijbil, M Edwards, ... Nature Communications 7 (1), 11281, 2016 | 162 | 2016 |
| Improved heat spreading performance of functionalized graphene in microelectronic device application Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ... Advanced Functional Materials 25 (28), 4430-4435, 2015 | 138 | 2015 |
| Synthesis and applications of two-dimensional hexagonal boron nitride in electronics manufacturing J Bao, K Jeppson, M Edwards, Y Fu, L Ye, X Lu, J Liu Electronic Materials Letters 12, 1-16, 2016 | 86 | 2016 |
| Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures N Wang, S Pandit, L Ye, M Edwards, V Mokkapati, M Murugesan, ... Carbon 111, 402-410, 2017 | 59 | 2017 |
| Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging J Bao, M Edwards, S Huang, Y Zhang, Y Fu, X Lu, Z Yuan, K Jeppson, ... Journal of Physics D: Applied Physics 49 (26), 265501, 2016 | 51 | 2016 |
| Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects S Sun, W Mu, M Edwards, D Mencarelli, L Pierantoni, Y Fu, K Jeppson, ... Nanotechnology 27 (33), 335705, 2016 | 48 | 2016 |
| Effect of bias conditions on pressure sensors based on AlGaN/GaN high electron mobility transistor ED Le Boulbar, MJ Edwards, S Vittoz, G Vanko, K Brinkfeldt, L Rufer, ... Sensors and Actuators A: Physical 194, 247-251, 2013 | 39 | 2013 |
| Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications Y Zhang, M Edwards, MK Samani, N Logothetis, L Ye, Y Fu, K Jeppson, ... Carbon 106, 195-201, 2016 | 36 | 2016 |
| Modelling wafer bow in silicon–polycrystalline CVD diamond substrates for GaN-based devices MJ Edwards, CR Bowen, DWE Allsopp, ACE Dent Journal of Physics D: Applied Physics 43 (38), 385502, 2010 | 29 | 2010 |
| Tape-assisted transfer of carbon nanotube bundles for through-silicon-via applications W Mu, S Sun, D Jiang, Y Fu, M Edwards, Y Zhang, K Jeppson, J Liu Journal of Electronic Materials 44, 2898-2907, 2015 | 26 | 2015 |
| Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor W Mu, Y Fu, S Sun, M Edwards, L Ye, K Jeppson, J Liu Chemical Engineering Journal 304, 106-114, 2016 | 24 | 2016 |
| Flexible Multifunctionalized Carbon Nanotubes‐Based Hybrid Nanowires N Wang, D Jiang, L Ye, M Murugesan, M Edwards, Y Fu, J Liu Advanced Functional Materials 25 (26), 4135-4143, 2015 | 22 | 2015 |
| Heat transfer modelling of flashlamp heating for automated tape placement of thermoplastic composites A Danezis, D Williams, M Edwards, AA Skordos Composites Part A: Applied Science and Manufacturing 145, 106381, 2021 | 19 | 2021 |
| Chemical vapor deposition grown graphene on Cu-Pt alloys Y Zhang, Y Fu, M Edwards, K Jeppson, L Ye, J Liu Materials Letters 193, 255-258, 2017 | 19 | 2017 |
| Embedded Fin‐Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors D Jiang, N Wang, M Edwards, W Mu, A Nylander, Y Fu, K Jeppson, J Liu Small 12 (11), 1521-1526, 2016 | 18 | 2016 |
| Mutiphysics study of RF/microwave planar devices: Effect of the input signal power MA Sánchez-Soriano, M Edwards, Y Quéré, D Andersson, S Cadiou, ... 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 18 | 2014 |
| Pressure and temperature dependence of GaN/AlGaN high electron mobility transistor based sensors on a sapphire membrane MJ Edwards, ED Le Boulbar, S Vittoz, G Vanko, K Brinkfeldt, L Rufer, ... physica status solidi c 9 (3‐4), 960-963, 2012 | 15 | 2012 |
| Substrates for semiconductor devices T Mollart, Q Jiang, MJ Edwards, D Allsopp, CR Bowen, WN Wang US Patent 10,023,974, 2018 | 13 | 2018 |
| Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation X Luo, J Peng, C Zandén, Y Yang, W Mu, M Edwards, L Ye, J Liu Acta Materialia 104, 109-118, 2016 | 12 | 2016 |
| The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modules M Edwards, K Brinkfeldt, U Rusche, T Bukes, G Gaiser, M Da Silva, ... Microelectronics Reliability 55 (5), 722-732, 2015 | 10 | 2015 |
Johan LiuProfessor, Chalmers University of TechnologyVerified email at chalmers.se
