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Jan Küchenhof
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Development of a design education platform for an interdisciplinary teaching concept
E Heyden, J Küchenhof, E Greve, D Krause
Procedia CIRP 91, 553-558, 2020
242020
Assessing the influence of generational variety on product family structures
J Küchenhof, C Tabel, D Krause
Procedia CIRP 91, 796-801, 2020
122020
From Visualizations to Matrices – Methodical support for New Development of Modular Product Families
J Küchenhof, LN Schwede, M Hanna, D Krause
DS 97: Proceedings of the 21st International DSM Conference (DSM 2019 …, 2019
82019
Entwicklung eines Produktarchitekturmodells zur Ableitung modularer Produktstrukturen
J Küchenhof, D Krause
DS 98: Proceedings of the 30th Symposium Design for X (DFX 2019), 25-36, 2019
72019
Methodical support for the new development of cyber-physical product families
J Küchenhof, MC Berschik, E Heyden, D Krause
Proceedings of the Design Society 2, 495-504, 2022
62022
Modularisierung in der industriellen Anwendung
C Rennpferdt, E Greve, J Kuhl, J Küchenhof, F Seiler, D Krause
Produktentwicklung und Konstruktionstechnik: Forschungsergebnisse und …, 2020
62020
Planning & tracking the changes-matrix mapping of modular product family generations
J Küchenhof, LN Schwede, D Krause
DS 101: Proceedings of NordDesign 2020, Lyngby, Denmark, 12th-14th August …, 2020
62020
A Review on Sensor‐Integrating Machine Elements
E Kirchner, T Wallmersperger, T Gwosch, JDM Menning, J Peters, ...
Advanced Sensor Research, 2300113, 2023
52023
Assessing the influence of digital innovations on the organizational design of product family generations
M Zuefle, J Küchenhof, M Hanna, D Krause
DS 121: Proceedings of the 24th International DSM Conference (DSM 2022 …, 2022
52022
Challenges in early phase of product family development processes
O Sankowski, J Küchenhof, FM Dambietz, M Züfle, A Wallisch, D Krause, ...
Procedia CIRP 100, 840-845, 2021
52021
Model Based Early-Stage Assessment for Modular New Product Development
J Küchenhof, F Seiler, D Krause
DS 103: Proceedings of the 22nd International DSM Conference (DSM 2020), MIT …, 2020
42020
INITIAL INTEGRAL PRODUCT AND ASSEMBLY STRUCTURING: A CASE STUDY
J Küchenhof, D Krause
Proceedings of the Design Society: DESIGN Conference 1, 2305-2314, 2020
32020
Neue Trends in der methodischen Entwicklung modularer Produktfamilien
E Greve, J Spallek, J Kuhl, J Küchenhof, C Rennpferdt, D Krause
Produktentwicklung und Konstruktionstechnik: Forschungsergebnisse und …, 2020
32020
A method for optimizing product architectures for the management of disturbance factors
R Breimann, M Fett, J Küchenhof, I Gomberg, E Kirchner, D Krause, ...
Procedia CIRP 119, 1041-1046, 2023
12023
4 Step Creation Method
J Küchenhof, HM Bickmeier
12021
Identification of Parameter Sets for the Selection of Microelectronic Components for Sensor-integrating Machine Elements
F Kruse, J Küchenhof, I Gomberg, R Breimann, D Krause, E Kirchner, ...
IEEE Sensors Journal, 2024
2024
HOOU an der TU Hamburg: Jahresbericht 2023
K Bock, S Dublasky, A Dürkop, PO Guglielmi, J Panke, D Schielein, ...
2024
Evaluation of a modular microsystem structure for sensor-integrating machine elements
I Gomberg, R Breimann, E Kirchner, J Kuechenhof, D Krause, HK Trieu
10. MikroSystemTechnik Kongress 2023, 2023
2023
Incorporating field effects into the design of modular product families
J Kuechenhof, MC Berschik, J Beibl, IA Fernández, K Otto, D Krause, ...
Proceedings of the Design Society 3, 2275-2284, 2023
2023
Experimental validation of a method for systematic new development
J Kuechenhof, D Krause
Proceedings of the Design Society 3, 1765-1774, 2023
2023
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