Dr. Di Xu
Dr. Di Xu
Intel;University of California, Los Angeles;Tsinghua University
Verified email at ucla.edu
Title
Cited by
Cited by
Year
Periodically twinned SiC nanowires
DH Wang, D Xu, Q Wang, YJ Hao, GQ Jin, XY Guo, KN Tu
Nanotechnology 19 (21), 215602, 2008
1622008
Highly spectral dependent enhancement of upconversion emission with sputtered gold island films
H Zhang, D Xu, Y Huang, X Duan
Chemical Communications 47 (3), 979-981, 2011
1082011
Growth of nickel silicides in Si and Si/SiOx core/shell nanowires
YC Lin, Y Chen, D Xu, Y Huang
Nano letters 10 (11), 4721-4726, 2010
762010
Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition
D Xu, WL Kwan, K Chen, X Zhang, V Ozoliņš, KN Tu
Applied Physics Letters 91 (25), 254105, 2007
732007
In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper
D Xu, V Sriram, V Ozolins, JM Yang, KN Tu, GR Stafford, C Beauchamp
Journal of Applied Physics 105 (2), 023521, 2009
562009
Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper
L Xu, D Xu, KN Tu, Y Cai, N Wang, P Dixit, JHL Pang, J Miao
Journal of Applied Physics 104 (11), 113717, 2008
492008
Nanotwin formation and its physical properties and effect on reliability of copper interconnects
D Xu, V Sriram, V Ozolins, JM Yang, KN Tu, GR Stafford, C Beauchamp, ...
Microelectronic Engineering 85 (10), 2155-2158, 2008
322008
Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM
L Xu, SW Liang, D Xu, JK Han, J Liang, KN Tu
2009 59th Electronic Components and Technology Conference, 909-913, 2009
172009
Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition
CN Liao, YC Lu, D Xu
Journal of the Electrochemical Society 160 (6), D207, 2013
132013
Erratum:“Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition”[Appl. Phys. Lett. 91, 254105 (2007)]
D Xu, WL Kwan, K Chen, X Zhang, V Ozolins, KN Tu
Applied Physics Letters 97 (12), 254105, 2010
42010
Improved Interconnect Properties For Nano‐Twinned Copper: Microstructure And Stability
D Xu, HP Chen, KN Tu
AIP Conference Proceedings 1300 (1), 23-32, 2010
12010
Erratum: “In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper” [J. Appl. Phys. 105, 023521 (2009)]
D Xu, V Sriram, V Ozolins, JM Yang, KN Tu, GR Stafford, C Beauchamp
Journal of Applied Physics 108 (9), 023521, 2010
12010
Nanotwin-modified copper interconnects and its effect on the physical properties of copper
D Xu, L Xu, V Sriram, K Sun, JM Yang, KN Tu
2009 59th Electronic Components and Technology Conference, 2060-2063, 2009
12009
Thermo-electromigration induced failure in WL-CSP Pb-free solder joints
L Xu, SW Liang, D Xu, KN Tu, S Gee, L Nguyen, M Andrews
International Conference and Exhibition on Device Packaging 2009, 2776-2811, 2008
12008
Magnetoresistance flipping of multilayers prepared by electron-beam evaporation
KW Geng, Y Gu, D Xu, C Song, F Pan
Journal of applied physics 98 (7), 073706, 2005
12005
Nanotwin Formation by Electrodeposition and Its Influence on the Physical Properties and Reliability of Copper Interconnects
D Xu
University of California, Los Angeles, 2009
2009
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Articles 1–16