Lahouari Benabou
Lahouari Benabou
PhD, Eng., Associate Prof., University of Versailles Paris-Saclay
Bestätigte E-Mail-Adresse bei
Zitiert von
Zitiert von
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling
VN Le, L Benabou, V Etgens, QB Tao
Microelectronics Reliability, 2016
A thermo-mechanical cohesive zone model for solder joint lifetime prediction
L Benabou, Z Sun, PR Dahoo
International Journal of Fatigue 49, 18-30, 2013
Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints
QB Tao, L Benabou, L Vivet, VN Le, FB Ouezdou
Materials Science and Engineering: A 669, 403-416, 2016
Investigation of the heel crack mechanism in Al connections for power electronics modules
Y Celnikier, L Benabou, L Dupont, G Coquery
Microelectronics reliability 51 (5), 965-974, 2011
Comparative analysis of damage at interfaces of composites
L Benabou, N Benseddiq, M Naıt-Abdelaziz
Composites Part B: Engineering 33 (3), 215-224, 2002
Predictions of compressive strength and kink band orientation for wood species
L Benabou
Mechanics of materials 42 (3), 335-343, 2010
Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module
VN Le, L Benabou, QB Tao, V Etgens
International Journal of Solids and Structures 106, 1-12, 2017
Kink band formation in wood species under compressive loading
L Benabou
Experimental Mechanics 48 (5), 647-656, 2008
Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni
QB Tao, L Benabou, VN Le, H Hwang, DB Luu
Journal of Alloys and Compounds 694, 892-904, 2017
Effective properties of a composite with imperfectly bonded interface
L Benabou, MN Abdelaziz, N Benseddiq
Theoretical and Applied Fracture Mechanics 41 (1-3), 15-20, 2004
Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling
Z Sun, L Benabou, PR Dahoo
Engineering Fracture Mechanics 107, 48-60, 2013
Creep behavior of Innolot solder alloy using small lap-shear specimens
QB Tao, L Benabou, KL Tan, JM Morelle, F Ben Ouezdou
17th Electronics Packaging Technology Conference, 2015
Optimization of wire connections design for power electronics
Y Celnikier, L Dupont, E Herve, G Coquery, L Benabou
Microelectronics Reliability 51 (9-11), 1892-1897, 2011
A design of a new miniature device for solder joints’ mechanical properties evaluation
QB Tao, L Benabou, L Vivet, KL Tan, JM Morelle, VN Le, F Ben Ouezdou
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of …, 2017
Continuum damage approach for fatigue life prediction of viscoplastic solder joints
L Benabou, Z Sun, P Pougnet, PR Dahoo
Journal of Mechanics, 2015
Modelling of the hygroelastic behaviour of a wood-based composite for construction
L Benabou, G Duchanois
Composites science and technology 67 (1), 45-53, 2007
Development and first assessment of a DIC system for a micro-tensile tester used for solder characterization
L Benabou, QB Tao
Experimental Techniques 41 (3), 317-326, 2017
Finite strain analysis of wood species under compressive failure due to kinking
L Benabou
International Journal of Solids and Structures 49 (3-4), 408-419, 2012
Systematic review of prosthetic socket fabrication using 3D printing
KT Nguyen, L Benabou, S Alfayad
Proceedings of the 2018 4th International Conference on Mechatronics and …, 2018
Analytical homogenization modeling and computational simulation of intergranular fracture in polycrystals
L Benabou, Z Sun
International Journal of Fracture 193 (1), 59-75, 2015
Das System kann den Vorgang jetzt nicht ausführen. Versuchen Sie es später erneut.
Artikel 1–20