Shuangxi Sun
Shuangxi Sun
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Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
S Sun, W Mu, M Edwards, D Mencarelli, L Pierantoni, Y Fu, K Jeppson, ...
Nanotechnology 27 (33), 335705, 2016
Compact and low loss electrochemical capacitors using a graphite/carbon nanotube hybrid material for miniaturized systems
Q Li, S Sun, AD Smith, P Lundgren, Y Fu, P Su, T Xu, L Ye, L Sun, J Liu, ...
Journal of Power Sources 412, 374-383, 2019
Tape-assisted transfer of carbon nanotube bundles for through-silicon-via applications
W Mu, S Sun, D Jiang, Y Fu, M Edwards, Y Zhang, K Jeppson, J Liu
Journal of Electronic Materials 44, 2898-2907, 2015
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
S Sun, S Chen, X Luo, Y Fu, L Ye, J Liu
Microelectronics Reliability 56, 129-135, 2016
Improving thermal transport at carbon hybrid interfaces by covalent bonds
S Sun, MK Samani, Y Fu, T Xu, L Ye, M Satwara, K Jeppson, T Nilsson, ...
Advanced Materials Interfaces 5 (15), 1800318, 2018
Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor
W Mu, Y Fu, S Sun, M Edwards, L Ye, K Jeppson, J Liu
Chemical Engineering Journal 304, 106-114, 2016
Cooling hot spots by hexagonal boron nitride heat spreaders
S Sun, J Bao, W Mu, Y Fu, Y Zhang, L Ye, J Liu
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1658-1663, 2015
Graphene based heat spreader for high power chip cooling using flip-chip technology
S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 347-352, 2013
Characterization for graphene as heat spreader using thermal imaging method
S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu
2013 14th International Conference on Electronic Packaging Technology, 403-408, 2013
Control of nanoplane orientation in vobn for high thermal anisotropy in a dielectric thin film: a new solution for thermal hotspot mitigation in electronics
O Cometto, MK Samani, B Liu, S Sun, SH Tsang, J Liu, K Zhou, EHT Teo
ACS Applied Materials & Interfaces 9 (8), 7456-7464, 2017
Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats
J Daon, S Sun, D Jiang, G Cibien, E Leveugle, C Galindo, A Ziaei, L Ye, ...
20th International Workshop on Thermal Investigations of ICs and Systems, 1-4, 2014
Chemically enhanced carbon nanotubes based thermal interface materials
J Daon, S Sun, D Jiang, E Leveugle, C Galindo, S Jus, A Ziaei, L Ye, Y Fu, ...
2015 21st International Workshop on Thermal Investigations of ICs and …, 2015
Double-Densified Vertically Aligned Carbon Nanotube bundles for application in 3D integration high aspect ratio TSV interconnects
W Mu, J Hansson, S Sun, M Edwards, Y Fu, K Jeppson, J Liu
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 211-216, 2016
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
D Jiang, S Sun, M Edwards, K Jeppson, N Wang, Y Fu, J Liu
Flexible and Printed Electronics 2 (2), 025003, 2017
Evaluating CNT-based interconnects: a nummerical tool to characterize Hybrid CNT-copper interconnects
S Bistarelli, S Sun, L Pierantoni, S Bellucci, D Mencarelli, J Lui
IEEE Microwave Magazine 18 (4), 124-129, 2017
2D heat dissipation materials for microelectronics cooling applications
Y Zhang, S Huang, N Wang, J Bao, S Sun, M Edwards, X Fu, W Yue, X Lu, ...
2016 China Semiconductor Technology International Conference (CSTIC), 1-4, 2016
Dissipating heat from hot spot using a new nano thermal interface material
S Sun, W Mu, Y Zhang, B Carlberg, L Ye, J Liu
2012 13th International Conference on Electronic Packaging Technology & High …, 2012
Test structures for studying flexible interconnect supported by carbon nanotube scaffolds
D Jiang, S Sun, M Edwards, K Jeppson
2017 International Conference of Microelectronic Test Structures (ICMTS), 1-4, 2017
Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders
K Jeppson, J Bao, S Huang, Y Zhang, S Sun, Y Fu, J Liu
2016 International Conference on Microelectronic Test Structures (ICMTS), 32-36, 2016
Thermal performance characterization of nano thermal interface materials after power cycling
S Sun, L Xin, C Zandén, B Carlberg, L Ye, J Liu
2012 IEEE 62nd Electronic Components and Technology Conference, 1426-1430, 2012
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