| Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects S Sun, W Mu, M Edwards, D Mencarelli, L Pierantoni, Y Fu, K Jeppson, ... Nanotechnology 27 (33), 335705, 2016 | 49 | 2016 |
| Compact and low loss electrochemical capacitors using a graphite/carbon nanotube hybrid material for miniaturized systems Q Li, S Sun, AD Smith, P Lundgren, Y Fu, P Su, T Xu, L Ye, L Sun, J Liu, ... Journal of Power Sources 412, 374-383, 2019 | 43 | 2019 |
| Improving thermal transport at carbon hybrid interfaces by covalent bonds S Sun, MK Samani, Y Fu, T Xu, L Ye, M Satwara, K Jeppson, T Nilsson, ... Advanced Materials Interfaces 5 (15), 1800318, 2018 | 27 | 2018 |
| Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor W Mu, Y Fu, S Sun, M Edwards, L Ye, K Jeppson, J Liu Chemical Engineering Journal 304, 106-114, 2016 | 26 | 2016 |
| Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging S Sun, S Chen, X Luo, Y Fu, L Ye, J Liu Microelectronics Reliability 56, 129-135, 2016 | 26 | 2016 |
| Tape-assisted transfer of carbon nanotube bundles for through-silicon-via applications W Mu, S Sun, D Jiang, Y Fu, M Edwards, Y Zhang, K Jeppson, J Liu Journal of Electronic Materials 44, 2898-2907, 2015 | 26 | 2015 |
| Control of nanoplane orientation in vobn for high thermal anisotropy in a dielectric thin film: a new solution for thermal hotspot mitigation in electronics O Cometto, MK Samani, B Liu, S Sun, SH Tsang, J Liu, K Zhou, EHT Teo ACS Applied Materials & Interfaces 9 (8), 7456-7464, 2017 | 11 | 2017 |
| Cooling hot spots by hexagonal boron nitride heat spreaders S Sun, J Bao, W Mu, Y Fu, Y Zhang, L Ye, J Liu 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1658-1663, 2015 | 11 | 2015 |
| Graphene based heat spreader for high power chip cooling using flip-chip technology S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 347-352, 2013 | 11 | 2013 |
| Characterization for graphene as heat spreader using thermal imaging method S Huang, Y Zhang, S Sun, X Fan, L Wang, Y Fu, Y Zhang, J Liu 2013 14th International Conference on Electronic Packaging Technology, 403-408, 2013 | 11 | 2013 |
| Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats J Daon, S Sun, D Jiang, G Cibien, E Leveugle, C Galindo, A Ziaei, L Ye, ... 20th International Workshop on Thermal Investigations of ICs and Systems, 1-4, 2014 | 10 | 2014 |
| Chemically enhanced carbon nanotubes based thermal interface materials J Daon, S Sun, D Jiang, E Leveugle, C Galindo, S Jus, A Ziaei, L Ye, Y Fu, ... 2015 21st International Workshop on Thermal Investigations of ICs and …, 2015 | 8 | 2015 |
| Double-Densified Vertically Aligned Carbon Nanotube bundles for application in 3D integration high aspect ratio TSV interconnects W Mu, J Hansson, S Sun, M Edwards, Y Fu, K Jeppson, J Liu 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 211-216, 2016 | 7 | 2016 |
| A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds D Jiang, S Sun, M Edwards, K Jeppson, N Wang, Y Fu, J Liu Flexible and Printed Electronics 2 (2), 025003, 2017 | 5 | 2017 |
| 2D heat dissipation materials for microelectronics cooling applications Y Zhang, S Huang, N Wang, J Bao, S Sun, M Edwards, X Fu, W Yue, X Lu, ... 2016 China Semiconductor Technology International Conference (CSTIC), 1-4, 2016 | 5 | 2016 |
| Evaluating CNT-based interconnects: a nummerical tool to characterize Hybrid CNT-copper interconnects S Bistarelli, S Sun, L Pierantoni, S Bellucci, D Mencarelli, J Lui IEEE Microwave Magazine 18 (4), 124-129, 2017 | 4 | 2017 |
| Dissipating heat from hot spot using a new nano thermal interface material S Sun, W Mu, Y Zhang, B Carlberg, L Ye, J Liu 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 4 | 2012 |
| Thermal performance characterization of nano thermal interface materials after power cycling S Sun, L Xin, C Zandén, B Carlberg, L Ye, J Liu 2012 IEEE 62nd Electronic Components and Technology Conference, 1426-1430, 2012 | 3 | 2012 |
| Test structures for studying flexible interconnect supported by carbon nanotube scaffolds D Jiang, S Sun, M Edwards, K Jeppson 2017 International Conference of Microelectronic Test Structures (ICMTS), 1-4, 2017 | 2 | 2017 |
| Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders K Jeppson, J Bao, S Huang, Y Zhang, S Sun, Y Fu, J Liu 2016 International Conference on Microelectronic Test Structures (ICMTS), 32-36, 2016 | 2 | 2016 |
