| A review of mechanical properties of lead-free solders for electronic packaging H Ma, JC Suhling Journal of materials science 44 (5), 1141-1158, 2009 | 695 | 2009 |
| Reliability of the aging lead free solder joint H Ma, JC Suhling, P Lall, MJ Bozack 56th Electronic Components and Technology Conference 2006, 16 pp., 2006 | 298* | 2006 |
| The influence of elevated temperature aging on reliability of lead free solder joints H Ma, JC Suhling, Y Zhang, P Lall, MJ Bozack 2007 Proceedings 57th Electronic Components and Technology Conference, 653-668, 2007 | 228 | 2007 |
| Fundamentals of lead-free solder interconnect technology TK Lee, TR Bieler, C Kim, H Ma Springer (US) chapter 1, 1-20, 2015 | 144 | 2015 |
| Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: Surface finish effects TK Lee, H Ma, KC Liu, J Xue Journal of Electronic Materials 39, 2564-2573, 2010 | 101 | 2010 |
| Constitutive models of creep for lead-free solders H Ma Journal of materials science 44 (14), 3841-3851, 2009 | 84 | 2009 |
| Nanostructural formation of fine grained aluminum alloy by severe plastic deformation at cryogenic temperature J Yin, J Lu, H Ma, P Zhang Journal of materials science 39 (8), 2851-2854, 2004 | 74 | 2004 |
| Viscosity and surface tension of liquid Sn-Cu lead-free solders N Zhao, XM Pan, DQ Yu, HT Ma, L Wang Journal of electronic materials 38, 828-833, 2009 | 52 | 2009 |
| Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints ML Huang, YZ Huang, HT Ma, J Zhao Journal of Electronic Materials 40, 315-323, 2011 | 43 | 2011 |
| Aging impact on the accelerated thermal cycling performance of lead-free BGA solder joints in various stress conditions TK Lee, H Ma 2012 IEEE 62nd Electronic Components and Technology Conference, 477-482, 2012 | 29 | 2012 |
| Isothermal aging effects on the mechanical shock performance of lead-free solder joints H Ma, TK Lee, DH Kim, HG Park, SH Kim, KC Liu IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (5 …, 2011 | 25 | 2011 |
| Different diffusion behavior of Cu and Ni undergoing liquid–solid electromigration ML Huang, ZJ Zhang, HT Ma, LD Chen Journal of Materials Science & Technology 30 (12), 1235-1242, 2014 | 20 | 2014 |
| Effects of board design variations on the reliability of lead-free solder joints H Ma, TK Lee IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (1 …, 2012 | 20 | 2012 |
| Acceleration factor study of lead-free solder joints under wide range thermal cycling conditions H Ma, M Ahmad, KC Liu 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 17 | 2010 |
| Reliability of lead-free solder joints under a wide range of thermal cycling conditions H Ma, M Ahmad, KC Liu IEEE Transactions on components, packaging and manufacturing technology 1 …, 2011 | 16 | 2011 |
| Effects of temperature and strain rate on the mechanical properties of lead-free solders H Ma Journal of materials science 45, 2351-2358, 2010 | 16 | 2010 |
| Characterization of lead-free solders for electronic packaging H Ma | 16 | 2007 |
| Continuous growth and coarsening mechanism of the orientation-preferred Cu6Sn5 at Sn-3.0 Ag/(001) Cu interface HR Ma, C Dong, P Priyanka, YP Wang, XG Li, HT Ma, J Chen Materials Characterization 166, 110449, 2020 | 15 | 2020 |
| Isothermal aging effects on the dynamic performance of lead-free solder joints H Ma, TK Lee, DH Kim, SH Kim, HG Park, KC Liu 2009 59th Electronic Components and Technology Conference, 390-397, 2009 | 14 | 2009 |
| Aging induced evolution of free solder material behavior H Ma, Y Zhang, Z Cai, JC Suhling, P Lall, MJ Bozack EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008 | 13 | 2008 |
