Follow
Di Jiang
Title
Cited by
Cited by
Year
Through-silicon vias filled with densified and transferred carbon nanotube forests
T Wang, S Chen, D Jiang, Y Fu, K Jeppson, L Ye, J Liu
IEEE Electron Device Letters 33 (3), 420-422, 2012
862012
Vertically stacked carbon nanotube-based interconnects for through silicon via application
D Jiang, W Mu, S Chen, Y Fu, K Jeppson, J Liu
IEEE Electron Device Letters 36 (5), 499-501, 2015
442015
mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application
D Jiang, T Wang, S Chen, L Ye, J Liu
Microelectronic Engineering 103, 177-180, 2013
432013
Formation of three-dimensional carbon nanotube structures by controllable vapor densification
T Wang, D Jiang, S Chen, K Jeppson, L Ye, J Liu
Materials Letters 78, 184-187, 2012
312012
Carbon nanotubes for electronics manufacturing and packaging: From growth to integration
J Liu, D Jiang, Y Fu, T Wang
Advances in Manufacturing 1, 13-27, 2013
292013
Tape-assisted transfer of carbon nanotube bundles for through-silicon-via applications
W Mu, S Sun, D Jiang, Y Fu, M Edwards, Y Zhang, K Jeppson, J Liu
Journal of Electronic Materials 44, 2898-2907, 2015
262015
High prevalence of overweight and obesity among inner city Chinese children in Shanghai, 2011
XX Jiang, LL Hardy, LA Baur, D Ding, L Wang, HJ Shi
Annals of Human Biology 41 (5), 469-472, 2014
262014
Flexible Multifunctionalized Carbon Nanotubes‐Based Hybrid Nanowires
N Wang, D Jiang, L Ye, M Murugesan, M Edwards, Y Fu, J Liu
Advanced Functional Materials 25 (26), 4135-4143, 2015
222015
Embedded Fin‐Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors
D Jiang, N Wang, M Edwards, W Mu, A Nylander, Y Fu, K Jeppson, J Liu
Small 12 (11), 1521-1526, 2016
182016
Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats
J Daon, S Sun, D Jiang, G Cibien, E Leveugle, C Galindo, A Ziaei, L Ye, ...
20th International Workshop on Thermal Investigations of ICs and Systems, 1-4, 2014
102014
Chemically enhanced carbon nanotubes based thermal interface materials
J Daon, S Sun, D Jiang, E Leveugle, C Galindo, S Jus, A Ziaei, L Ye, Y Fu, ...
2015 21st International Workshop on Thermal Investigations of ICs and …, 2015
82015
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
D Jiang, S Sun, M Edwards, K Jeppson, N Wang, Y Fu, J Liu
Flexible and Printed Electronics 2 (2), 025003, 2017
52017
Ultra‐short vertically aligned carbon nanofibers transfer and application as bonding material
S Chen
Soldering & Surface Mount Technology 25 (4), 242-250, 2013
52013
Carbon nanotubes in electronics interconnect applications with a focus on 3D-TSV technology
D Jiang, T Wang, LL Ye, K Jeppson, J Liu
ECS Transactions 44 (1), 683, 2012
42012
Carbon nanotube based interconnect material for electronic applications
D Jiang
PQDT-Global, 2015
32015
Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD
L Xu, D Jiang, YF Fu, S Xavier, S Bansropun, A Ziaei, ST Tu, J Liu
Advances in Manufacturing 1, 236-240, 2013
32013
Test structures for studying flexible interconnect supported by carbon nanotube scaffolds
D Jiang, S Sun, M Edwards, K Jeppson
2017 International Conference of Microelectronic Test Structures (ICMTS), 1-4, 2017
22017
Reliability of carbon nanotube bumps for chip on glass application
X Fan, X Li, W Mu, D Jiang, S Huang, Y Fu, Y Zhang, J Liu
Proceedings of the 5th Electronics System-integration Technology Conference …, 2014
22014
Experimental and numerical investigations on the performance and reliability of CNT fins for micro-cooler
Y Zhang, H Lv, J Fan, D Jiang, J Liu
2012 13th International Conference on Electronic Packaging Technology & High …, 2012
22012
Sn–3.0Ag–0.5Cu Nanocomposite Solder Reinforced With Bi2Te3Nanoparticles
S Chen, X Luo, D Jiang, L Ye, M Edwards, J Liu
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (8 …, 2015
12015
The system can't perform the operation now. Try again later.
Articles 1–20