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Navin Srivastava
Navin Srivastava
Software Engineer, Intel Corp
Bestätigte E-Mail-Adresse bei intel.com
Titel
Zitiert von
Zitiert von
Jahr
Carbon nanomaterials for next-generation interconnects and passives: Physics, status, and prospects
H Li, C Xu, N Srivastava, K Banerjee
IEEE Transactions on electron devices 56 (9), 1799-1821, 2009
5382009
Performance analysis of carbon nanotube interconnects for VLSI applications
N Srivastava, K Banerjee
ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005 …, 2005
3882005
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
GL Loi, B Agrawal, N Srivastava, SC Lin, T Sherwood, K Banerjee
Proceedings of the 43rd annual Design Automation Conference, 991-996, 2006
2642006
On the applicability of single-walled carbon nanotubes as VLSI interconnects
N Srivastava, H Li, F Kreupl, K Banerjee
IEEE Transactions on Nanotechnology 8 (4), 542-559, 2009
2452009
Scaling analysis of multilevel interconnect temperatures for high-performance ICs
S Im, N Srivastava, K Banerjee, KE Goodson
IEEE Transactions on Electron Devices 52 (12), 2710-2719, 2005
2292005
Are carbon nanotubes the future of VLSI interconnections?
K Banerjee, N Srivastava
Proceedings of the 43rd annual design automation conference, 809-814, 2006
1662006
Carbon nanotube interconnects: implications for performance, power dissipation and thermal management
N Srivastava, RV Joshi, K Banerjee
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest …, 2005
1172005
A comparative scaling analysis of metallic and carbon nanotube interconnections for nanometer scale VLSI technologies
N Srivastava, K Banerjee
Proc. 21st Intl. VLSI Multilevel Interconnect Conf, 393-398, 2004
932004
Interconnect challenges for nanoscale electronic circuits
N Srivastava, K Banerjee
Jom 56, 30-31, 2004
922004
Introspective 3D chips
S Mysore, B Agrawal, N Srivastava, SC Lin, K Banerjee, T Sherwood
Proceedings of the 12th international conference on Architectural support …, 2006
842006
Current status and future perspectives of carbon nanotube interconnects
K Banerjee, H Li, N Srivastava
2008 8th IEEE Conference on Nanotechnology, 432-436, 2008
632008
Impact of on-chip inductance on power distribution network design for nanometer scale integrated circuits
N Srivastava, X Qi, K Banerjee
Sixth international symposium on quality electronic design (isqed'05), 346-351, 2005
482005
Carbon nanotube vias: Does ballistic electron–phonon transport imply improved performance and reliability?
H Li, N Srivastava, JF Mao, WY Yin, K Banerjee
IEEE transactions on electron devices 58 (8), 2689-2701, 2011
442011
Interconnect modeling and analysis in the nanometer era: Cu and beyond
K Banerjee, S Im, N Srivastava
Proc. 22nd Adv. Metallization Conf, 26-29, 2005
382005
Electrothermal engineering in the nanometer era: from devices and interconnects to circuits and systems
K Banerjee, SC Lin, N Srivastava
Proceedings of the 2006 Asia and South Pacific Design Automation Conference …, 2006
312006
Carbon nanotube vias: A reality check
H Li, N Srivastava, JF Mao, WY Yin, K Banerjee
2007 IEEE International Electron Devices Meeting, 207-210, 2007
272007
A thermally-aware methodology for design-specific optimization of supply and threshold voltages in nanometer scale ICs
SC Lin, N Srivastava, K Banerjee
2005 International Conference on Computer Design, 411-416, 2005
212005
Thermal scaling analysis of multilevel Cu/Low-k interconnect structures in deep nanometer scale technologies
S Im, N Srivastava, K Banerjee, K Goodson
Proc. 22th Int. VLSI Multilevel Interconnect Conf.(VMIC) 3 (6), 2005
182005
Analytical expressions for high-frequency VLSI interconnect impedance extraction in the presence of a multilayer conductive substrate
N Srivastava, R Suaya, K Banerjee
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2009
102009
Can carbon nanotubes extend the lifetime of on-chip electrical interconnections?
K Banerjee, S Im, N Srivastava
2006 1st International Conference on Nano-Networks and Workshops, 1-9, 2006
92006
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