| Self‐Aligning Metallic Vertical Interconnect Access Formation through Microlensing Gas Phase Electrodeposition controlling Airgap and Morphology L Schlag, NA Isaac, MM Hossain, AL Hess, BC Wolz, J Reiprich, M Ziegler, ... Advanced Electronic Materials 9 (1), 2200838, 2023 | 3 | 2023 |
| Self-Aligning Ruthenium Interconnects L Schlag, R Grau, M Hossain, H Nahrstedt, NA Isaac, J Reiprich, J Pezoldt, ... 2020 IEEE International Interconnect Technology Conference (IITC), 82-84, 2020 | 1 | 2020 |
| Figure of merit analysis of nanostructured thermoelectric materials at room temperature MM Hossain, SA Ahmed, SM Shahriar, MSU Zzaman, A Das, AK Saha, ... 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), 139 - 144, 2017 | 1 | 2017 |
| Ruthenium and Rhodium Vertical Interconnect Formation Using Gas Phase Electrodeposition MM Hossain, L Schlag, B Wolz, M Ziegler, H Nahrstedt, H Reichel, ... 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE …, 2023 | | 2023 |
| Self‐Aligning Metallic Vertical Interconnect Access Formation through Microlensing Gas Phase Electrodeposition controlling Airgap and Morphology (Adv. Electron. Mater. 1/2023) L Schlag, NA Isaac, MM Hossain, AL Hess, BC Wolz, J Reiprich, M Ziegler, ... Advanced Electronic Materials 9 (1), 2370005, 2023 | | 2023 |
| Quantum transport in nanostructured thermoelectric generator MM Hossain, MS Uzzaman, SA Ahmed, MS Shafat BRAC University, 2016 | | 2016 |
Atanu K SahaIntel CorporationVerified email at intel.com
