Chris Bailey
Chris Bailey
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Cited by
Cited by
Design for reliability of power electronics modules
H Lu, C Bailey, C Yin
Microelectronics reliability 49 (9-11), 1250-1255, 2009
A finite volume procedure to solve elastic solid mechanics problems in three dimensions on an unstructured mesh
C Bailey, M Cross
International journal for numerical methods in engineering 38 (10), 1757-1776, 1995
A control volume procedure for solving the elastic stress-strain equations on an unstructured mesh
YD Fryer, C Bailey, M Cross, CH Lai
Applied mathematical modelling 15 (11-12), 639-645, 1991
Dynamic solid mechanics using finite volume methods
AK Slone, C Bailey, M Cross
Applied mathematical modelling 27 (2), 69-87, 2003
Solution of the elastic/visco-plastic constitutive equations: a finite volume approach
GA Taylor, C Bailey, M Cross
Applied mathematical modelling 19 (12), 746-760, 1995
A vertex‐based finite volume method applied to non‐linear material problems in computational solid mechanics
GA Taylor, C Bailey, M Cross
International journal for numerical methods in engineering 56 (4), 507-529, 2003
Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis
NA Fallah, C Bailey, M Cross, GA Taylor
Applied Mathematical Modelling 24 (7), 439-455, 2000
Predicting optimal process conditions for flip-chip assembly using copper column bumped dies
H Lu, C Bailey
4th Electronics Packaging Technology Conference, 2002., 338-343, 2002
Discretisation procedures for multi-physics phenomena
C Bailey, GA Taylor, M Cross, P Chow
Journal of Computational and Applied Mathematics 103 (1), 3-17, 1999
A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter
AK Slone, K Pericleous, C Bailey, M Cross, C Bennett
Applied mathematical modelling 28 (2), 211-239, 2004
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications
CY Yin, MO Alam, YC Chan, C Bailey, H Lu
Microelectronics Reliability 43 (4), 625-633, 2003
Lifetime prediction for power electronics module substrate mount-down solder interconnect
H Lu, T Tilford, C Bailey, DR Newcombe
2007 International Symposium on High Density packaging and Microsystem …, 2007
Multiphysics modelling of the metals casting process
C Bailey, P Chow, M Cross, Y Fryer, K Pericleous
Proceedings of the Royal Society of London. Series A: Mathematical, Physical …, 1996
The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing
MJ Rizvi, YC Chan, C Bailey, H Lu, A Sharif
Soldering & Surface Mount Technology, 2005
Wetting and reaction of Sn-2.8 Ag-0.5 Cu-1.0 Bi solder with Cu and Ni substrates
MJ Rizvi, YC Chan, C Bailey, H Lu, MN Islam, BY Wu
Journal of electronic materials 34 (8), 1115-1122, 2005
A cell-centred finite volume method for modelling viscoelastic flow
SS Edussuriya, AJ Williams, C Bailey
Journal of non-newtonian fluid mechanics 117 (1), 47-61, 2004
Prognostic and health management for engineering systems: a review of the data-driven approach and algorithms
T Sutharssan, S Stoyanov, C Bailey, C Yin
The Journal of engineering 2015 (7), 215-222, 2015
Correlation of solder paste rheology with computational simulations of the stencil printing process
R Durairaj, GJ Jackson, NN Ekere, G Glinski, C Bailey
Soldering & surface mount technology, 2002
Fracture mechanics analysis of solder joint intermetallic compounds in shear test
MO Alam, H Lu, C Bailey, YC Chan
Computational Materials Science 45 (2), 576-583, 2009
A physics-of-failure based prognostic method for power modules
CY Yin, H Lu, M Musallam, C Bailey, CM Johnson
2008 10th Electronics Packaging Technology Conference, 1190-1195, 2008
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