Polymer optical interconnects—A scalable large-area panel processing approach S Uhlig, L Frohlich, M Chen, N Arndt-Staufenbiel, G Lang, H Schroder, ... IEEE transactions on advanced packaging 29 (1), 158-170, 2006 | 57 | 2006 |
Structural and physical properties of highly piezoresistive nickel containing hydrogenated carbon thin films R Koppert, S Uhlig, H Schmid-Engel, D Göttel, AC Probst, G Schultes, ... Diamond and related materials 25, 50-58, 2012 | 50 | 2012 |
Limitations to and solutions for optical loss in optical backplanes S Uhlig, M Robertsson Journal of lightwave technology 24 (4), 1710, 2006 | 48 | 2006 |
Strain sensitive Pt–SiO2 nano-cermet thin films for high temperature pressure and force sensors H Schmid-Engel, S Uhlig, U Werner, G Schultes Sensors and Actuators A: Physical 206, 17-21, 2014 | 30 | 2014 |
Piezoresistive Ni: aC: H thin films containing hcp-Ni or Ni3C investigated by XRD, EXAFS, and wavelet analysis S Uhlig, R Struis, H Schmid-Engel, J Bock, AC Probst, O Freitag-Weber, ... Diamond and related materials 34, 25-35, 2013 | 30 | 2013 |
Advanced packaging materials for optical applications: bridging the gap between nm-size structures and large-area panel processing R Houbertz, H Wolter, P Dannberg, J Serbin, S Uhlig Photonics Packaging and Integration VI 6126, 43-55, 2006 | 30 | 2006 |
Pressure sensitivity of piezoresistive nickel–carbon Ni: aC: H thin films S Uhlig, H Schmid-Engel, T Speicher, G Schultes Sensors and Actuators A: Physical 193, 129-135, 2013 | 15 | 2013 |
Piezoresistivity of polycrystalline silicon applying the AIC process-route S Uhlig, S Rau, G Schultes Sensors and Actuators A: Physical 172 (2), 447-454, 2011 | 14 | 2011 |
Microwave circuits in multilayer inorganic-organic polymer thin film technology on laminate substrates C Johansson, S Uhlig, O Tageman, A Alping, J Haglund, M Robertsson, ... IEEE transactions on advanced packaging 26 (1), 81-89, 2003 | 14 | 2003 |
ORMOCER materials characterization, LAP-& Micro-Processing: applied to optical interconnects and high-frequency packaging S Uhlig Institutionen för teknik och naturvetenskap, 2006 | 8 | 2006 |
Micro-processing applied to optical interconnects and high-frequency packaging S Uhlig Sci. Technol, 1-163, 2006 | 5 | 2006 |
Preventing of Dewetting Effects for Inorganic–Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface Pretreatments S Uhlig, G Domann, R Houbertz, L Frohlich, H Schroder, J Krissler, ... IEEE transactions on electronics packaging manufacturing 29 (4), 297-307, 2006 | 4 | 2006 |
Flip chip mountable optical waveguide amplifier for optical backplane systems S Uhlig, M Robertsson Proceedings Electronic Components and Technology, 2005. ECTC'05., 1880-1887, 2005 | 3 | 2005 |
Piezoresistive Sensorschichten Auf Der Basis von Nano-Cermets Für Hochtemperaturanwendungen S Uhlig, H Schmid-Engel, G Schultes, U Werner Mikrosystemtechnik, 2013 | 2 | 2013 |
Ray-tracing studies on optical periscopes suitable for out-of-plane interconnects on optical backplanes S Uhlig IEEE transactions on electronics packaging manufacturing 33 (1), 55-64, 2010 | 2 | 2010 |
Concepts to control the relative permittivity (er) of nanoscaled inorganic-organic hybrid polymers for various applications in microelectronics G Domann, J Bahr, R Houbertz, S Uhlig | | 2008 |
Concepts to control the relative permittivity epsilon~ r of nanoscaled inorganic-organic hybrid polymers for various applications in microelectronics G Domann, J Bahr, R Houbertz, S Uhlig VDIBERICHT 2027, 35, 2008 | | 2008 |
Large-area processing of inorganic-organic hybrid polymers (ORMOCER® s) for optical backplane application S Uhlig, M Robertsson, H Schröder, G Lang, A Arndt-Staufenbiel, ... | | 2004 |
Large-area processing of inorganic-organic hybrid polymers (ORMOCER-Reg Trademark) for optical backplane application S Uhlig, M Robertsson, H Schröder, G Lang, N Arndt-Staufenbiel, ... | | 2004 |
Optical interconnects and high frequency electronic packaging: SBU-materials, material characterization, LAP-& microprocessing S Uhlig Linköpings universitet, 2003 | | 2003 |