Folgen
Dr. Steffen Uhlig
Dr. Steffen Uhlig
Corning GmbH (Germany), Development Engineer
Bestätigte E-Mail-Adresse bei corning.com - Startseite
Titel
Zitiert von
Zitiert von
Jahr
Polymer optical interconnects—A scalable large-area panel processing approach
S Uhlig, L Frohlich, M Chen, N Arndt-Staufenbiel, G Lang, H Schroder, ...
IEEE transactions on advanced packaging 29 (1), 158-170, 2006
572006
Structural and physical properties of highly piezoresistive nickel containing hydrogenated carbon thin films
R Koppert, S Uhlig, H Schmid-Engel, D Göttel, AC Probst, G Schultes, ...
Diamond and related materials 25, 50-58, 2012
502012
Limitations to and solutions for optical loss in optical backplanes
S Uhlig, M Robertsson
Journal of lightwave technology 24 (4), 1710, 2006
482006
Strain sensitive Pt–SiO2 nano-cermet thin films for high temperature pressure and force sensors
H Schmid-Engel, S Uhlig, U Werner, G Schultes
Sensors and Actuators A: Physical 206, 17-21, 2014
302014
Piezoresistive Ni: aC: H thin films containing hcp-Ni or Ni3C investigated by XRD, EXAFS, and wavelet analysis
S Uhlig, R Struis, H Schmid-Engel, J Bock, AC Probst, O Freitag-Weber, ...
Diamond and related materials 34, 25-35, 2013
302013
Advanced packaging materials for optical applications: bridging the gap between nm-size structures and large-area panel processing
R Houbertz, H Wolter, P Dannberg, J Serbin, S Uhlig
Photonics Packaging and Integration VI 6126, 43-55, 2006
302006
Pressure sensitivity of piezoresistive nickel–carbon Ni: aC: H thin films
S Uhlig, H Schmid-Engel, T Speicher, G Schultes
Sensors and Actuators A: Physical 193, 129-135, 2013
152013
Piezoresistivity of polycrystalline silicon applying the AIC process-route
S Uhlig, S Rau, G Schultes
Sensors and Actuators A: Physical 172 (2), 447-454, 2011
142011
Microwave circuits in multilayer inorganic-organic polymer thin film technology on laminate substrates
C Johansson, S Uhlig, O Tageman, A Alping, J Haglund, M Robertsson, ...
IEEE transactions on advanced packaging 26 (1), 81-89, 2003
142003
ORMOCER materials characterization, LAP-& Micro-Processing: applied to optical interconnects and high-frequency packaging
S Uhlig
Institutionen för teknik och naturvetenskap, 2006
82006
Micro-processing applied to optical interconnects and high-frequency packaging
S Uhlig
Sci. Technol, 1-163, 2006
52006
Preventing of Dewetting Effects for Inorganic–Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface Pretreatments
S Uhlig, G Domann, R Houbertz, L Frohlich, H Schroder, J Krissler, ...
IEEE transactions on electronics packaging manufacturing 29 (4), 297-307, 2006
42006
Flip chip mountable optical waveguide amplifier for optical backplane systems
S Uhlig, M Robertsson
Proceedings Electronic Components and Technology, 2005. ECTC'05., 1880-1887, 2005
32005
Piezoresistive Sensorschichten Auf Der Basis von Nano-Cermets Für Hochtemperaturanwendungen
S Uhlig, H Schmid-Engel, G Schultes, U Werner
Mikrosystemtechnik, 2013
22013
Ray-tracing studies on optical periscopes suitable for out-of-plane interconnects on optical backplanes
S Uhlig
IEEE transactions on electronics packaging manufacturing 33 (1), 55-64, 2010
22010
Concepts to control the relative permittivity (er) of nanoscaled inorganic-organic hybrid polymers for various applications in microelectronics
G Domann, J Bahr, R Houbertz, S Uhlig
2008
Concepts to control the relative permittivity epsilon~ r of nanoscaled inorganic-organic hybrid polymers for various applications in microelectronics
G Domann, J Bahr, R Houbertz, S Uhlig
VDIBERICHT 2027, 35, 2008
2008
Large-area processing of inorganic-organic hybrid polymers (ORMOCER® s) for optical backplane application
S Uhlig, M Robertsson, H Schröder, G Lang, A Arndt-Staufenbiel, ...
2004
Large-area processing of inorganic-organic hybrid polymers (ORMOCER-Reg Trademark) for optical backplane application
S Uhlig, M Robertsson, H Schröder, G Lang, N Arndt-Staufenbiel, ...
2004
Optical interconnects and high frequency electronic packaging: SBU-materials, material characterization, LAP-& microprocessing
S Uhlig
Linköpings universitet, 2003
2003
Das System kann den Vorgang jetzt nicht ausführen. Versuchen Sie es später erneut.
Artikel 1–20