| Performance of carbide tools with textured rake-face filled with solid lubricants in dry cutting processes D Jianxin, W Ze, L Yunsong, Q Ting, C Jie International Journal of Refractory Metals and Hard Materials 30 (1), 164-172, 2012 | 310 | 2012 |
| Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry J Cheng, T Wang, H Mei, W Zhou, X Lu Applied surface science 320, 531-537, 2014 | 44 | 2014 |
| Surface characteristics of ruthenium in periodate-based slurry during chemical mechanical polishing J Cheng, T Wang, L Jiang, X Lu Applied Surface Science 351, 401-409, 2015 | 34 | 2015 |
| Micro-galvanic corrosion of Cu/Ru couple in potassium periodate (KIO4) solution J Cheng, J Pan, T Wang, X Lu Corrosion Science 137, 184-193, 2018 | 28 | 2018 |
| Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry J Cheng, T Wang, Y He, X Lu Applied Surface Science 337, 130-137, 2015 | 28 | 2015 |
| Galvanic corrosion inhibitors for Cu/Ru couple during chemical mechanical polishing of Ru J Cheng, T Wang, X Lu ECS Journal of Solid State Science and Technology 6 (1), P62, 2016 | 25 | 2016 |
| Effects of KIO4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium J Cheng, T Wang, J Wang, Y Liu, X Lu Microelectronic Engineering 151, 30-37, 2016 | 21 | 2016 |
| Evolution of entrained water film thickness and dynamics of Marangoni flow in Marangoni drying C Li, D Zhao, J Wen, J Cheng, X Lu RSC advances 8 (9), 4995-5004, 2018 | 14 | 2018 |
| Tribocorrosion study of copper during chemical mechanical polishing in potassium periodate-based slurry J Cheng, T Wang, Z Chai, X Lu Tribology Letters 58, 1-11, 2015 | 13 | 2015 |
| Corrosion investigations of ruthenium in potassium periodate solutions relevant for chemical mechanical polishing J Cheng, T Wang, J Pan, X Lu Journal of Electronic Materials 45, 4067-4075, 2016 | 12 | 2016 |
| Chemical mechanical polishing of inlaid copper structures with Ru/Ta/TaN as barrier/liner layer J Cheng, B Wang, T Wang, C Li, X Lu ECS Journal of Solid State Science and Technology 7 (11), P634, 2018 | 9 | 2018 |
| A theoretical model incorporating both the nano-scale material removal and wafer global uniformity during planarization process J Li, Z Wei, T Wang, J Cheng, Q He Thin Solid Films 636, 240-246, 2017 | 8 | 2017 |
| Residual stress and pop-out simulation for TSVs and contacts in via-middle process C Rao, T Wang, Y Peng, J Cheng, Y Liu, SK Lim, X Lu IEEE Transactions on Semiconductor Manufacturing 30 (2), 143-154, 2017 | 7 | 2017 |
| Role of the adhesion force during copper chemical mechanical planarization J Li, J Liu, J Cheng, H Li, T Wang, J Liu ECS Journal of Solid State Science and Technology 7 (8), P410, 2018 | 4 | 2018 |
| A kinematic model describing particle movement near a surface as effected by Brownian motion and electrostatic and Van der Waals forces HG Mei, DW Zhao, TQ Wang, J Cheng, XC Lu Science China Technological Sciences 57, 2144-2152, 2014 | 4 | 2014 |
| Ruthenium and Copper CMP in periodate-based slurry with BTA and K2MoO4 as compound corrosion inhibitors J Cheng, T Wang, J Wang, Y He, X Lu Proceedings of International Conference on Planarization/CMP Technology 2014 …, 2014 | 3 | 2014 |
| Characterization of lanthanide elements doped ceria nanoparticles and its performance in chemical mechanical polishing as novel abrasive particles J Cheng, Y Li, X Lu 2018 China Semiconductor Technology International Conference (CSTIC), 1-4, 2018 | 2 | 2018 |
| The Behaviors of Alkaline Slurry during the CMP of TSV Backside Heterogeneous Microstructure B Wang, Y Liu, J Cheng, C Rao, X Lu Ecs Journal of Solid State Science and Technology 7 (2), P15, 2018 | 2 | 2018 |
| Exploring Java 9 F Cheng Berkeley, CA: Apress, 2018 | 2 | 2018 |
| Investigations of Annealing Effect on TSV CMP C Rao, T Wang, J Cheng, Y Liu, X Lu ICPT 2017; International Conference on Planarization/CMP Technology, 1-4, 2017 | 1 | 2017 |
Jinshan PanProfessor of Corrosion Science, Royal Institute of TechnologyBestätigte E-Mail-Adresse bei kth.se
