| Synergistic roles of dodecyl sulfate and benzotriazole in enhancing the efficiency of CMP of copper Y Hong, VK Devarapalli, D Roy, SV Babu Journal of the Electrochemical Society 154 (6), H444, 2007 | 94 | 2007 |
| Utility of dodecyl sulfate surfactants as dissolution inhibitors in chemical mechanical planarization of copper Y Hong, UB Patri, S Ramakrishnan, D Roy, SV Babu Journal of materials research 20 (12), 3413-3424, 2005 | 55 | 2005 |
| Ammonium dodecyl sulfate as a potential corrosion inhibitor surfactant for electrochemical mechanical planarization of copper Y Hong, D Roy, SV Babu Electrochemical and Solid-State Letters 8 (11), G297, 2005 | 54 | 2005 |
| Real-time electrical detection of epidermal skin MoS2 biosensor for point-of-care diagnostics G Yoo, H Park, M Kim, WG Song, S Jeong, MH Kim, H Lee, SW Lee, ... Nano Research 10, 767-775, 2017 | 48 | 2017 |
| Requirements management tool with evolving traceability for heterogeneous artifacts in the entire life cycle Y Hong, M Kim, SW Lee 2010 Eighth ACIS International Conference on Software Engineering Research …, 2010 | 19 | 2010 |
| Slurry and method for chemical-mechanical planarization of copper S Babu, S Hegde, S Jha, U Patri, Y Hong US Patent App. 10/846,718, 2005 | 18 | 2005 |
| A value-added predictive defect type distribution model based on project characteristics Y Hong, J Baik, IY Ko, HJ Choi Seventh IEEE/ACIS International Conference on Computer and Information …, 2008 | 17 | 2008 |
| Polishing slurries and methods for chemical mechanical polishing SC Jha, S Nimmala, S Hegde, Y Hong, SV Babu, UB Patri US Patent 7,186,653, 2007 | 14 | 2007 |
| Polishing slurries for chemical-mechanical polishing SC Jha, S Nimmala, S Hedge, Y Hong, SV Babu, UB Patri US Patent App. 12/469,193, 2009 | 8 | 2009 |
| Prediction of defect distribution based on project characteristics for proactive project management Y Hong, W Kim, J Joo Proceedings of the 6th International Conference on Predictive Models in …, 2010 | 6 | 2010 |
| Method for Chemical-Mechanical Planarization of Copper SV Babu, S Hegde, SC Jha, UB Patri, Y Hong US Patent App. 12/163,385, 2008 | 5 | 2008 |
| Polishing slurries and methods for chemical mechanical polishing S Jha, S Nimmala, S Hegde, Y Hong, SV Babu, U Patri US Patent App. 11/527,429, 2007 | 4 | 2007 |
| Study of inhibition characteristics of slurry additives in copper CMP using force spectroscopy MK Keswani, H Lee, S Babu, U Patri, Y Hong, L Economikos, M Goldstein, ... ECS Transactions 2 (2), 515, 2006 | 2 | 2006 |
| Novel Use of Surfactants in Copper Chemical Mechanical Polishing (CMP) Y Hong, UB Patri, S Ramakrishnan, SV Babu MRS Online Proceedings Library 867, 1101-1106, 2004 | 2 | 2004 |
| Polishing slurries and methods for chemical mechanical polishing S Chandra, S Nimmala, SV Babu, UB Patri, S Hedge, Y Hong US Patent 7,553,430, 2009 | 1 | 2009 |
| Restoration of neuromuscular function in charcot-marie-tooth (CMT) 1a disease by human tonsil-derived MSC (T-MSC) S Park, Y Choi, G Kwak, Y Hong, N Jung, J Kim, B Choi, S Jung Cytotherapy 19 (5), S132-S132, 2017 | | 2017 |
| High Photoresponsivity Multilayer MoS2 Thin-Film Transistors with Local Bottom Gate Structure S Hong, OJ Kim, G Han, J Kwon, N Liu, YK Hong, DH Kim, I Omkaram, ... Electrochemical Society Meeting Abstracts 230, 2318-2318, 2016 | | 2016 |
| High-Performance Thin-Film Transistors Based on Highly Crystalline CVD-Grown Multilayer MoSe2 Films N Liu, C Jung, H Moon, S Hong, YK Hong, I Omkaram, S Kim Electrochemical Society Meeting Abstracts 230, 1820-1820, 2016 | | 2016 |
| Study of Inhibition Characteristics of Slurry Additives inCopper CMP using Force Spectroscopy H Lee, A Philipossian, SV Babu, UB Patri, Y Hong, L Economikos, ... Transactions on Electrical and Electronic Materials 8 (1), 5-10, 2007 | | 2007 |
| Effect of slurry chemicals on chemical-mechanical planarization of copper Y Hong Clarkson University, 2006 | | 2006 |
